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公开(公告)号：US20240128114A1
公开(公告)日：2024-04-18
申请号：US18398723
申请日：2023-12-28
CPC分类号： H01L21/681 , B25J9/1694 , B25J11/0095 , B25J13/088 , G01B11/002 , G01B11/272 , H01L21/67259
摘要： Implementations disclosed describe an integrated sensor controller comprising a sensor circuit and a logic circuit. The sensor circuit includes a light source driver to generate a driving signal, a demultiplexer to produce, using the driving signal, a plurality of output driving signals to be delivered to one of a plurality of sensors, and an amplifier to: receive a first signal from a first sensor, the first signal being associated with a first event representative of a position of a substrate within a device manufacturing machine, and generate a second signal. The sensor circuit further includes an analog-to-digital converter to receive the second signal and generate a third signal. The logic circuit includes a memory device and a processing device coupled to the memory device, the processing device to obtain based on the third signal, information about the position of the substrate.
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公开(公告)号：USD938373S1
公开(公告)日：2021-12-14
申请号：US29710816
申请日：2019-10-25
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公开(公告)号：US11862499B2
公开(公告)日：2024-01-02
申请号：US16947822
申请日：2020-08-19
CPC分类号： H01L21/681 , B25J9/1694 , B25J11/0095 , B25J13/088 , G01B11/002 , G01B11/272 , H01L21/67259
摘要： Implementations disclosed describe an integrated sensor controller comprising a sensor circuit and a logic circuit. The sensor circuit includes a light source driver to generate a driving signal, a demultiplexer to produce, using the driving signal, a plurality of output driving signals to be delivered to one of a plurality of sensors, and an amplifier to: receive a first signal from a first sensor, the first signal being associated with a first event representative of a position of a substrate within a device manufacturing machine, and generate a second signal. The sensor circuit further includes an analog-to-digital converter to receive the second signal and generate a third signal. The logic circuit includes a memory device and a processing device coupled to the memory device, the processing device to obtain based on the third signal, information about the position of the substrate.
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公开(公告)号：US20240203767A1
公开(公告)日：2024-06-20
申请号：US18081897
申请日：2022-12-15
CPC分类号： H01L21/67276 , B25J11/0095 , B25J19/02 , G01P1/00 , G01P15/00 , G06F3/14 , G08B21/182
摘要： A system includes a controller, a substrate transfer device including one or more moveable members, and a vibration sensor assembly coupled to a member of the one or more moveable members. The vibration sensor assembly includes an accelerometer configured to detect vibration of the substrate transfer device and a processing device coupled to the accelerometer. The processing device is to receive vibration data from the accelerometer. The processing device is further to determine a vibration frequency peak of the vibration data. The vibration frequency peak corresponds to a critical frequency associated with the substrate transfer device. The processing device is further to determine that the vibration frequency peak exceeds a threshold magnitude, responsive to which the processing device is further to cause a data signal indicative of the vibration frequency peak to be transmitted to the controller.
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公开(公告)号：US20240170312A1
公开(公告)日：2024-05-23
申请号：US17991039
申请日：2022-11-21
CPC分类号： H01L21/67259 , H01L21/681 , H01L22/12
摘要： A system includes an optical sensor including an emitting element and a receiving element. The optical sensor is configured to detect an optical transmission ratio of a substrate responsive to a substrate support supporting the substrate in an optical path of the first optical sensor. The system further includes a processing device communicatively coupled to the optical sensor. The processing device is configured to determine an optical threshold based on the optical transmission ratio of the substrate. The processing device is further configured to determine a location of the substrate relative to a substrate-handling robot end effector based on sensor data output by a location sensor and the optical threshold.
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公开(公告)号：US20220055219A1
公开(公告)日：2022-02-24
申请号：US16947822
申请日：2020-08-19
摘要： Implementations disclosed describe an integrated sensor controller comprising a sensor circuit and a logic circuit. The sensor circuit includes a light source driver to generate a driving signal, a demultiplexer to produce, using the driving signal, a plurality of output driving signals to be delivered to one of a plurality of sensors, and an amplifier to: receive a first signal from a first sensor, the first signal being associated with a first event representative of a position of a substrate within a device manufacturing machine, and generate a second signal. The sensor circuit further includes an analog-to-digital converter to receive the second signal and generate a third signal. The logic circuit includes a memory device and a processing device coupled to the memory device, the processing device to obtain based on the third signal, information about the position of the substrate.
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