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公开(公告)号：US11551951B2
公开(公告)日：2023-01-10
申请号：US16867362
申请日：2020-05-05
Applicant: APPLIED MATERIALS, INC.
Inventor： Paul Zachary Wirth , Kiyki-Shiy Shang , Mikhail Taraboukhine
IPC: H01L21/67
Abstract: A method for controlling a temperature of a substrate support assembly is provided. A first direct current (DC) power is supplied to a heating element embedded in a zone of the substrate support assembly included in a processing chamber. A voltage is measured across the heating element. Similarly, a current is measured through the heating element. A temperature of the zone of the substrate support assembly is determined based on the voltage across the heating element and the current through the heating element. A temperature difference between the determined temperature of the zone and a target temperature for the zone is determined. A second DC power to deliver to the heating element is determined to achieve the target temperature based at least in part on the temperature difference. The second DC power is supplied to the heating element to cause the temperature of the zone to be modified to the target temperature.
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2.发明公开公开(公告)号：US20240014825A1
公开(公告)日：2024-01-11
申请号：US17862278
申请日：2022-07-11
Applicant: Applied Materials, Inc.
Inventor： Mikhail Taraboukhine , Oleg Serebryanov , Alexander Goldin , Vilen Nestorov
IPC: H03M1/10
CPC classification number: H03M1/1014
Abstract: Embodiments disclosed herein include a method of calibrating a tool for converting photonic signals to electrical signals. In an embodiment, the method comprises connecting a calibration module to a calibrated current source, finding a transfer function for a plurality of modes with the calibration module, and storing the transfer functions in a lookup table.
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公开(公告)号：US11862499B2
公开(公告)日：2024-01-02
申请号：US16947822
申请日：2020-08-19
Applicant: Applied Materials, Inc.
CPC classification number: H01L21/681 , B25J9/1694 , B25J11/0095 , B25J13/088 , G01B11/002 , G01B11/272 , H01L21/67259
Abstract: Implementations disclosed describe an integrated sensor controller comprising a sensor circuit and a logic circuit. The sensor circuit includes a light source driver to generate a driving signal, a demultiplexer to produce, using the driving signal, a plurality of output driving signals to be delivered to one of a plurality of sensors, and an amplifier to: receive a first signal from a first sensor, the first signal being associated with a first event representative of a position of a substrate within a device manufacturing machine, and generate a second signal. The sensor circuit further includes an analog-to-digital converter to receive the second signal and generate a third signal. The logic circuit includes a memory device and a processing device coupled to the memory device, the processing device to obtain based on the third signal, information about the position of the substrate.
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4.发明授权公开(公告)号：US12160243B2
公开(公告)日：2024-12-03
申请号：US17862278
申请日：2022-07-11
Applicant: Applied Materials, Inc.
Inventor： Mikhail Taraboukhine , Oleg Serebryanov , Alexander Goldin , Vilen Nestorov
IPC: H03M1/10
Abstract: Embodiments disclosed herein include a method of calibrating a tool for converting photonic signals to electrical signals. In an embodiment, the method comprises connecting a calibration module to a calibrated current source, finding a transfer function for a plurality of modes with the calibration module, and storing the transfer functions in a lookup table.
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公开(公告)号：US20220055219A1
公开(公告)日：2022-02-24
申请号：US16947822
申请日：2020-08-19
Applicant: Applied Materials, Inc.
Abstract: Implementations disclosed describe an integrated sensor controller comprising a sensor circuit and a logic circuit. The sensor circuit includes a light source driver to generate a driving signal, a demultiplexer to produce, using the driving signal, a plurality of output driving signals to be delivered to one of a plurality of sensors, and an amplifier to: receive a first signal from a first sensor, the first signal being associated with a first event representative of a position of a substrate within a device manufacturing machine, and generate a second signal. The sensor circuit further includes an analog-to-digital converter to receive the second signal and generate a third signal. The logic circuit includes a memory device and a processing device coupled to the memory device, the processing device to obtain based on the third signal, information about the position of the substrate.
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Patent Agency Ranking
公开(公告)号：US20210351051A1
公开(公告)日：2021-11-11
申请号：US16867362
申请日：2020-05-05
Applicant: APPLIED MATERIALS, INC.
Inventor： Paul Zachary Wirth , Kiyki-Shiy Shang , Mikhail Taraboukhine
IPC: H01L21/67
Abstract: A method for controlling a temperature of a substrate support assembly is provided. A first direct current (DC) power is supplied to a heating element embedded in a zone of the substrate support assembly included in a processing chamber. A voltage is measured across the heating element. Similarly, a current is measured through the heating element. A temperature of the zone of the substrate support assembly is determined based on the voltage across the heating element and the current through the heating element. A temperature difference between the determined temperature of the zone and a target temperature for the zone is determined. A second DC power to deliver to the heating element is determined to achieve the target temperature based at least in part on the temperature difference. The second DC power is supplied to the heating element to cause the temperature of the zone to be modified to the target temperature.
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公开(公告)号：US12283500B2
公开(公告)日：2025-04-22
申请号：US18634628
申请日：2024-04-12
Applicant: APPLIED MATERIALS, INC.
Inventor： Paul Zachary Wirth , Kiyki-Shiy Shang , Mikhail Taraboukhine
IPC: H01L21/67
Abstract: A direct current (DC) power is supplied to a heating element embedded into a substrate support assembly (SSA). A voltage across the heating element and a current through the heating element is measured as the DC power is supplied to the heating element. A resistance of the heating element is determined based on the measured voltage and current. A temperature measurement for the heating element and/or a zone including the heating element is obtained based on signal(s) of a temperature sensor. A temperature model is updated based on the determined resistance and the obtained temperature measurement. The heating element embedded in the SSA and/or an additional heating element embedded in the SSA or in another SSA is controlled based on the updated temperature model during a substrate process.
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公开(公告)号：US20240258140A1
公开(公告)日：2024-08-01
申请号：US18634628
申请日：2024-04-12
Applicant: APPLIED MATERIALS, INC.
Inventor： Paul Zachary Wirth , Kiyki-Shiy Shang , Mikhail Taraboukhine
IPC: H01L21/67
CPC classification number: H01L21/67248 , H01L21/67017 , H01L21/67103
Abstract: A direct current (DC) power is supplied to a heating element embedded into a substrate support assembly (SSA). A voltage across the heating element and a current through the heating element is measured as the DC power is supplied to the heating element. A resistance of the heating element is determined based on the measured voltage and current. A temperature measurement for the heating element and/or a zone including the heating element is obtained based on signal(s) of a temperature sensor. A temperature model is updated based on the determined resistance and the obtained temperature measurement. The heating element embedded in the SSA and/or an additional heating element embedded in the SSA or in another SSA is controlled based on the updated temperature model during a substrate process.
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公开(公告)号：US20230154773A1
公开(公告)日：2023-05-18
申请号：US18093763
申请日：2023-01-05
Applicant: APPLIED MATERIALS, INC.
Inventor： Paul Zachary Wirth , Kiyki-Shiy Shang , Mikhail Taraboukhine
IPC: H01L21/67
CPC classification number: H01L21/67248 , H01L21/67017 , H01L21/67103
Abstract: A direct current (DC) power is supplied to heating elements embedded in zones of a substrate support assembly (SSA) of a processing chamber. A determination is made, based on a voltage measured across the heating elements and a current measured through the heating elements as the DC power is supplied to the heating elements, that the temperature of the SSA does not satisfy a temperature condition. A zone of the SSA that is at a temperature that does not correspond to a target temperature for the zone based on the temperature condition is identified based on the measured voltage and the measured current. The DC power supplied to the heating elements embedded within the identified zone is modified to cause the temperature of the zone to be modified to the target temperature and the temperature of the substrate support assembly to satisfy the temperature condition.
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公开(公告)号：US11984333B2
公开(公告)日：2024-05-14
申请号：US18093763
申请日：2023-01-05
Applicant: APPLIED MATERIALS, INC.
Inventor： Paul Zachary Wirth , Kiyki-Shiy Shang , Mikhail Taraboukhine
IPC: H01L21/67
CPC classification number: H01L21/67248 , H01L21/67017 , H01L21/67103
Abstract: A direct current (DC) power is supplied to heating elements embedded in zones of a substrate support assembly (SSA) of a processing chamber. A determination is made, based on a voltage measured across the heating elements and a current measured through the heating elements as the DC power is supplied to the heating elements, that the temperature of the SSA does not satisfy a temperature condition. A zone of the SSA that is at a temperature that does not correspond to a target temperature for the zone based on the temperature condition is identified based on the measured voltage and the measured current. The DC power supplied to the heating elements embedded within the identified zone is modified to cause the temperature of the zone to be modified to the target temperature and the temperature of the substrate support assembly to satisfy the temperature condition.
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