A direct current (DC) power is supplied to heating elements embedded in zones of a substrate support assembly (SSA) of a processing chamber. A determination is made, based on a voltage measured across the heating elements and a current measured through the heating elements as the DC power is supplied to the heating elements, that the temperature of the SSA does not satisfy a temperature condition. A zone of the SSA that is at a temperature that does not correspond to a target temperature for the zone based on the temperature condition is identified based on the measured voltage and the measured current. The DC power supplied to the heating elements embedded within the identified zone is modified to cause the temperature of the zone to be modified to the target temperature and the temperature of the substrate support assembly to satisfy the temperature condition.