Lamp driver for low pressure environment

    公开(公告)号:US10332763B2

    公开(公告)日:2019-06-25

    申请号:US14987378

    申请日:2016-01-04

    Abstract: Embodiments of the present disclosure relate to a lamp driver for lamps used as a source of heat radiation in a thermal processing chamber. The lamp driver includes a power source, at least two DC/DC converters, each DC/DC converter connected with the power source in series, a direct connection between the at least two DC/DC converters, and a line that is attached to the direct connection and attachable to a reference voltage. A plurality of the lamp drivers may be utilized to power a plurality of lamps positioned in a grounded lamphead assembly. The electrical potential between the lamps and the grounded lamphead assembly is reduced, which reduces the risk of arcing between the lamps and the lamphead assembly.

    Lamp failure detector
    5.
    发明授权
    Lamp failure detector 有权
    灯泡故障检测器

    公开(公告)号:US09345118B2

    公开(公告)日:2016-05-17

    申请号:US14532895

    申请日:2014-11-04

    CPC classification number: H05B37/036 H05B37/038

    Abstract: Apparatus and methods for detecting lamp failure in a rapid thermal processing (RTP) tool are provided. Lamp failure detection systems are provided that can accommodate DC and/or AC voltages. The systems sample voltage signals along a circuit path formed by at least two serially connected lamps, calculate a voltage drop across the first lamp of the at least two serially connected lamps based on the sampled voltage signals, and determine whether a lamp failure has occurred based on a relationship between the voltage drop across the first lamp and a total voltage applied to the circuit path.

    Abstract translation: 提供了一种用于在快速热处理(RTP)工具中检测灯泡故障的装置和方法。 提供可以适应直流和/或交流电压的灯故障检测系统。 所述系统沿着由至少两个串联连接的灯形成的电路路径采样电压信号,基于所采样的电压信号计算出至少两个串联灯的第一灯两端的电压降,并确定是否已经发生灯故障 关于第一灯上的电压降与施加到电路路径的总电压之间的关系。

    Direct current lamp driver for substrate processing

    公开(公告)号:US10734257B2

    公开(公告)日:2020-08-04

    申请号:US13866505

    申请日:2013-04-19

    Abstract: Methods and apparatus for heating a substrate in a process chamber are provided herein. In some embodiments, an apparatus for heating a substrate in a process chamber includes a lamp group comprising one or more sets of lamps to provide radiant energy to heat a substrate when disposed in the process chamber, wherein each set of lamps comprises a plurality of lamps wired in series, and wherein each set of lamps is wired in parallel with respect to other sets of the one or more sets of lamps; an alternating current (AC) power source to produce an AC input waveform; and a lamp driver to power the lamp group, the lamp driver including a rectifier coupled to the AC power source to convert the AC input waveform to DC voltage; and a direct current to direct current (DC/DC) converter to reduce voltage of the DC power.

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