公开(公告)号：US11791176B2

公开(公告)日：2023-10-17

申请号：US16665343

申请日：2019-10-28

Applicant: Applied Materials, Inc.

Inventor： Michael Honan ,  David Blahnik ,  Robert Brent Vopat ,  Jeffrey Blahnik ,  Charles Carlson

IPC: H01L21/67 ,  H01L21/673 ,  F27D7/02 ,  H01L21/324 ,  C30B33/02 ,  C30B35/00

CPC classification number: H01L21/67109 ,  C30B33/02 ,  C30B35/00 ,  F27D7/02 ,  H01L21/324 ,  H01L21/67248 ,  H01L21/67323

Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.

公开(公告)号：US12249522B2

公开(公告)日：2025-03-11

申请号：US18244041

申请日：2023-09-08

Applicant: Applied Materials, Inc.

Inventor： Michael Honan ,  David Blahnik ,  Robert Brent Vopat ,  Jeffrey Blahnik ,  Charles Carlson

IPC: H01L21/67 ,  C30B33/02 ,  C30B35/00 ,  F27D7/02 ,  H01L21/324 ,  H01L21/673

Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.

公开(公告)号：US20230420275A1

公开(公告)日：2023-12-28

申请号：US18244041

申请日：2023-09-08

Applicant: Applied Materials, Inc.

Inventor： Michael Honan ,  David Blahnik ,  Robert Brent Vopat ,  Jeffrey Blahnik ,  Charles Carlson

IPC: H01L21/67 ,  H01L21/673 ,  F27D7/02 ,  H01L21/324 ,  C30B33/02 ,  C30B35/00

CPC classification number: H01L21/67109 ,  H01L21/67323 ,  F27D7/02 ,  H01L21/324 ,  H01L21/67248 ,  C30B33/02 ,  C30B35/00

Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.

公开(公告)号：US20180190535A1

公开(公告)日：2018-07-05

申请号：US15851096

申请日：2017-12-21

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jeffrey Blahnik

IPC: H01L21/687 ,  H01L21/677 ,  G06F9/30

CPC classification number: H01L21/68764 ,  B25J9/042 ,  B25J9/043 ,  G06F9/30032 ,  H01L21/67196 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67763 ,  H01L21/68707

Abstract: Apparatus and methods for rotating wafers during processing include a wafer rotation assembly with a support fixture connected to a shaft and a wafer transfer assembly with a robot blade with an opening therethrough, the opening sized to allow the support surface of the support fixture to pass through the opening. A first actuator is connected to the wafer rotation assembly to rotate the support fixture assembly about an axis of the shaft. A second actuator is connected to the wafer rotation assembly to move the support fixture assembly a stroke distance along the axis of the shaft. Process kits including the wafer rotation assemblies and robot blades with openings can used to retrofit existing mainframe processing chambers.

公开(公告)号：US10186449B2

公开(公告)日：2019-01-22

申请号：US15851096

申请日：2017-12-21

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jeffrey Blahnik

IPC: H01L21/687 ,  H01L21/677 ,  G06F9/30 ,  B25J9/04 ,  H01L21/67

Abstract: Apparatus and methods for rotating wafers during processing include a wafer rotation assembly with a support fixture connected to a shaft and a wafer transfer assembly with a robot blade with an opening therethrough, the opening sized to allow the support surface of the support fixture to pass through the opening. A first actuator is connected to the wafer rotation assembly to rotate the support fixture assembly about an axis of the shaft. A second actuator is connected to the wafer rotation assembly to move the support fixture assembly a stroke distance along the axis of the shaft. Process kits including the wafer rotation assemblies and robot blades with openings can used to retrofit existing mainframe processing chambers.

公开(公告)号：US09696097B2

公开(公告)日：2017-07-04

申请号：US14504021

申请日：2014-10-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Kallol Bera ,  Kim Vellore ,  Andrew Constant ,  Jacob Newman ,  Jeffrey Blahnik ,  Jason Schaller ,  William Weaver ,  Robert Vopat ,  Benjamin Riordon

IPC: E21B27/00 ,  F28F3/12 ,  H01L21/67 ,  H01L21/673

CPC classification number: F28F3/12 ,  H01L21/67109 ,  H01L21/67303

Abstract: Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.