公开(公告)号：US09696097B2

公开(公告)日：2017-07-04

申请号：US14504021

申请日：2014-10-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Kallol Bera ,  Kim Vellore ,  Andrew Constant ,  Jacob Newman ,  Jeffrey Blahnik ,  Jason Schaller ,  William Weaver ,  Robert Vopat ,  Benjamin Riordon

IPC: E21B27/00 ,  F28F3/12 ,  H01L21/67 ,  H01L21/673

CPC classification number: F28F3/12 ,  H01L21/67109 ,  H01L21/67303

Abstract: Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.