公开(公告)号：US20190118336A1

公开(公告)日：2019-04-25

申请号：US16227911

申请日：2018-12-20

Applicant: Applied Materials, Inc.

Inventor： Young J. Paik ,  Ashish Bhatnagar ,  Kadthala Ramaya Narendrnath

IPC: B24B37/30

Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.

公开(公告)号：US09960019B2

公开(公告)日：2018-05-01

申请号：US14270993

申请日：2014-05-06

Applicant: Applied Materials, Inc.

Inventor： Sandhya Arun ,  Prashanth Kodigepalli ,  Padma Gopalakrishnan ,  Ashish Bhatnagar ,  Dan Martin ,  Christopher Heath John Hossack

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  C23C14/34 ,  C23C14/50

CPC classification number: H01J37/32798 ,  C23C14/34 ,  C23C14/50 ,  H01J37/32495 ,  H01J37/32623 ,  H01J37/32642 ,  H01L21/67069 ,  H01L21/6831 ,  H01L21/68735

Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring body having a top planar surface and a bottom planar surface, and an outer ring body having a top surface, a bottom surface substantially parallel to the top surface, and an inside surface that extends between the top surface and the bottom surface, the inside surface having a roof covering a portion of the inner ring body when the inner ring body is disposed adjacent the roof, wherein the inner ring body can be flipped into a different position so that a portion of the inner ring body that is not covered by the roof provides a substantially planar surface.

公开(公告)号：US20230356353A1

公开(公告)日：2023-11-09

申请号：US18351260

申请日：2023-07-12

Applicant: Applied Materials, Inc.

Inventor： Young J. Paik ,  Ashish Bhatnagar ,  Kadthala Ramaya Narendrnath

IPC: B24B37/30 ,  B24B37/32 ,  H01L21/321

CPC classification number: B24B37/30 ,  B24B37/32 ,  H01L21/3212

Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.

公开(公告)号：US11738421B2

公开(公告)日：2023-08-29

申请号：US17240917

申请日：2021-04-26

Applicant: Applied Materials, Inc.

Inventor： Young J. Paik ,  Ashish Bhatnagar ,  Kadthala Ramaya Narendrnath

IPC: H01L21/321 ,  B24B41/06 ,  B24B7/20 ,  B24B37/30 ,  B24B37/32

CPC classification number: B24B37/30 ,  B24B37/32 ,  H01L21/3212

Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.

公开(公告)号：US11007619B2

公开(公告)日：2021-05-18

申请号：US16227911

申请日：2018-12-20

Applicant: Applied Materials, Inc.

Inventor： Young J. Paik ,  Ashish Bhatnagar ,  Kadthala Ramaya Narendrnath

IPC: B24B37/30 ,  B24B37/32 ,  H01L21/321

Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.

公开(公告)号：US09627231B2

公开(公告)日：2017-04-18

申请号：US14015650

申请日：2013-08-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Kadthala Ramaya Narendrnath ,  Gangadhar Sheelavant ,  Monika Agarwal ,  Ashish Bhatnagar

IPC: B32B7/12 ,  B32B3/20 ,  H01L21/67 ,  B32B7/14 ,  H01L21/683 ,  H01L21/687

CPC classification number: B32B37/1292 ,  B32B7/14 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6835 ,  H01L21/68785 ,  H01L2221/68318 ,  H01L2221/68381 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/83862 ,  H01L2224/83877 ,  H01L2224/98 ,  H01L2924/15151 ,  Y10T156/10 ,  Y10T279/23 ,  Y10T428/24851 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly.

公开(公告)号：US20210245323A1

公开(公告)日：2021-08-12

申请号：US17240917

申请日：2021-04-26

Applicant: Applied Materials, Inc.

Inventor： Young J. Paik ,  Ashish Bhatnagar ,  Kadthala Ramaya Narendrnath

IPC: B24B37/30

Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.

公开(公告)号：US20200381286A1

公开(公告)日：2020-12-03

申请号：US16986192

申请日：2020-08-05

Applicant: Applied Materials, Inc.

Inventor： Young J. Paik ,  Melvin Barrentine ,  Abhijit Y. Desai ,  Hai Nguyen ,  Ashish Bhatnagar ,  Rajkumar Alagarsamy

IPC: H01L21/683 ,  B24B37/30

Abstract: A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is larger than the recess into which it fits, such that the compression forms a conformal seal inside the recess. The bead may also be left uncoated to enhance adhesion of the bead to the surface of the groove. The surface of the cover may be roughened to reduce adhesion of the substrate to the cover without using a non-stick coating.

公开(公告)号：US10177014B2

公开(公告)日：2019-01-08

申请号：US14050196

申请日：2013-10-09

Applicant: Applied Materials, Inc.

Inventor： Govinda Raj ,  Daniel Martin ,  Robert T. Hirahara ,  Ashish Bhatnagar ,  Bopanna Vasanth ,  Prashanth Rao ,  Kadthala R. Narendrnath

IPC: H01L21/67 ,  H01L21/687 ,  C23C16/00 ,  C23F1/00 ,  H01L21/306

Abstract: An apparatus for a substrate support heater and associated chamber components having reduced energy losses are provided. In one embodiment, a substrate support heater is provided. The substrate support heater includes a heater body having a first surface to receive a substrate and a second surface opposing the first surface, a heating element disposed in the heater body between the first surface and the second surface, and a thermal barrier disposed on the second surface of the heater body, wherein the thermal barrier comprises a first layer and a second layer disposed on the first layer.

公开(公告)号：US10131126B2

公开(公告)日：2018-11-20

申请号：US15453456

申请日：2017-03-08

Applicant: Applied Materials, Inc.

Inventor： Kadthala Ramaya Narendrnath ,  Gangadhar Sheelavant ,  Monika Agarwal ,  Ashish Bhatnagar

IPC: B32B7/12 ,  B32B7/14 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  B32B37/12

Abstract: Methods for fabricating and refurbishing an assembly are disclosed herein. The method begins by applying an adhesive layer onto a first substrate. A second substrate is placed onto the adhesive layer, thereby securing the two substrates together, the adhesive layer bounding at least one side of a channel that extends laterally between the substrates to an exterior of the assembly. And, the substrates and the adhesive layer are subjected to a bonding procedure and allowing outgassing of volatiles from the adhesive layer to escape from between the substrates through the channel, wherein the substrates bonded by the adhesive layer form a component for a semiconductor vacuum processing chamber.