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    Window in thin polishing pad
    1.
    发明授权
    Window in thin polishing pad 有权

    公开(公告)号：US11161218B2

    公开(公告)日：2021-11-02

    申请号：US16252513

    申请日：2019-01-18

    Applicant: Applied Materials, Inc.

    Inventor： Yongqi Hu ,  Kadthala Ramaya Narendrnath ,  Thomas Lawrence Terry

    IPC: B24B37/20 ,  B24B37/22 ,  B24B37/24

    Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

    Carrier Head Membrane With Regions of Different Roughness
    2.
    发明申请
    Carrier Head Membrane With Regions of Different Roughness 审中-公开

    公开(公告)号：US20190118336A1

    公开(公告)日：2019-04-25

    申请号：US16227911

    申请日：2018-12-20

    Applicant: Applied Materials, Inc.

    Inventor： Young J. Paik ,  Ashish Bhatnagar ,  Kadthala Ramaya Narendrnath

    IPC: B24B37/30

    Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.

    Method of placing window in thin polishing pad
    5.
    发明授权
    Method of placing window in thin polishing pad 有权

    公开(公告)号：US10213894B2

    公开(公告)日：2019-02-26

    申请号：US15054849

    申请日：2016-02-26

    Applicant: Applied Materials, Inc.

    Inventor： Yongqi Hu ,  Kadthala Ramaya Narendrnath ,  Thomas Lawrence Terry

    IPC: B24B37/20

    Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

    Methods for bonding substrates
    6.
    发明授权
    Methods for bonding substrates 有权

    公开(公告)号：US10131126B2

    公开(公告)日：2018-11-20

    申请号：US15453456

    申请日：2017-03-08

    Applicant: Applied Materials, Inc.

    Inventor： Kadthala Ramaya Narendrnath ,  Gangadhar Sheelavant ,  Monika Agarwal ,  Ashish Bhatnagar

    IPC: B32B7/12 ,  B32B7/14 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  B32B37/12

    Abstract: Methods for fabricating and refurbishing an assembly are disclosed herein. The method begins by applying an adhesive layer onto a first substrate. A second substrate is placed onto the adhesive layer, thereby securing the two substrates together, the adhesive layer bounding at least one side of a channel that extends laterally between the substrates to an exterior of the assembly. And, the substrates and the adhesive layer are subjected to a bonding procedure and allowing outgassing of volatiles from the adhesive layer to escape from between the substrates through the channel, wherein the substrates bonded by the adhesive layer form a component for a semiconductor vacuum processing chamber.

    Electrostatic chuck refurbishment
    8.
    发明授权
    Electrostatic chuck refurbishment 有权

    公开(公告)号：US09669653B2

    公开(公告)日：2017-06-06

    申请号：US14209967

    申请日：2014-03-13

    Applicant: Applied Materials, Inc.

    Inventor： Vijay D. Parkhe ,  Kadthala Ramaya Narendrnath

    IPC: C03C15/00 ,  B44C1/22 ,  H01L21/461 ,  H01L21/304 ,  H01L21/683

    CPC classification number: H01L21/6833 ,  B24B37/042 ,  B24B37/26 ,  B24C1/04 ,  B24C1/06 ,  B44C1/221 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/3212 ,  H01L21/461

    Abstract: An indication that an electrostatic chuck has a gas leakage rate that exceeds a leakage threshold is received. A determination is made as to whether a first polishing procedure that polishes surface features on a surface of the electrostatic chuck without removing the surface features would reduce a thickness of the surface features to below a thickness threshold. The electrostatic chuck is polished using the first polishing procedure responsive to determining that the first polishing procedure would not reduce the thickness of the surface features to below the thickness threshold. Responsive to determining that the first polishing procedure would reduce the thickness of the surface features to below the thickness threshold, a second polishing procedure that removes the surface features from the surface of the electrostatic chuck is performed. After the second polishing procedure, new surface features are formed on the surface of the electrostatic chuck.

    ELECTROSTATIC CHUCK REFURBISHMENT
    9.
    发明申请
    ELECTROSTATIC CHUCK REFURBISHMENT 有权
    静电卡车改装

    公开(公告)号：US20140263176A1

    公开(公告)日：2014-09-18

    申请号：US14209967

    申请日：2014-03-13

    Applicant: Applied Materials, Inc.

    Inventor： Vijay D. Parkhe ,  Kadthala Ramaya Narendrnath

    IPC: B44C1/22

    CPC classification number: H01L21/6833 ,  B24B37/042 ,  B24B37/26 ,  B24C1/04 ,  B24C1/06 ,  B44C1/221 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/3212 ,  H01L21/461

    Abstract: An indication that an electrostatic chuck has a gas leakage rate that exceeds a leakage threshold is received. A determination is made as to whether a first polishing procedure that polishes surface features on a surface of the electrostatic chuck without removing the surface features would reduce a thickness of the surface features to below a thickness threshold. The electrostatic chuck is polished using the first polishing procedure responsive to determining that the first polishing procedure would not reduce the thickness of the surface features to below the thickness threshold. Responsive to determining that the first polishing procedure would reduce the thickness of the surface features to below the thickness threshold, a second polishing procedure that removes the surface features from the surface of the electrostatic chuck is performed. After the second polishing procedure, new surface features are formed on the surface of the electrostatic chuck.

    Abstract translation: 接收到静电卡盘具有超过泄漏阈值的气体泄漏率的指示。 确定在不去除表面特征的情况下抛光静电卡盘的表面上的表面特征的第一抛光过程是否将使表面特征的厚度减小到厚度阈值以下。 响应于确定第一抛光过程不会将表面特征的厚度减小到厚度阈值以下，使用第一抛光程序抛光静电卡盘。 响应于确定第一抛光过程将表面特征的厚度减小到厚度阈值以下，执行从静电卡盘的表面去除表面特征的第二抛光过程。 在第二次抛光过程之后，在静电卡盘的表面上形成新的表面特征。

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