公开(公告)号：US11161218B2

公开(公告)日：2021-11-02

申请号：US16252513

申请日：2019-01-18

Applicant: Applied Materials, Inc.

Inventor： Yongqi Hu ,  Kadthala Ramaya Narendrnath ,  Thomas Lawrence Terry

IPC: B24B37/20 ,  B24B37/22 ,  B24B37/24

Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

公开(公告)号：US20180056479A1

公开(公告)日：2018-03-01

申请号：US15686667

申请日：2017-08-25

Applicant: Applied Materials, Inc.

Inventor： Yongqi Hu ,  Thomas Lawrence Terry

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/687 ,  H01L21/67 ,  G05B19/19

CPC classification number: B24B37/345 ,  B24B41/005 ,  G05B19/19 ,  G05B2219/31276 ,  H01L21/30625 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67219 ,  H01L21/67259 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67778 ,  H01L21/68707

Abstract: A semiconductor fabrication system includes a chemical mechanical polishing system, a cassette holding area enclosed by a wall and having a door openable by an operator to place one or more cassettes into the cassette holding area, a robot configured to transfer substrates between a cassette in the cassette holding area to the chemical mechanical polishing system, a computer controller configured to cause the robot to move to a home position, a circuit breaker in a power supply line to the robot, a door sensor to detect whether the door is open, a robot presence sensor to detect whether the robot is in the home position, and control circuitry configured to receive signals from the door sensor and the robot presence sensor and cause the circuit breaker to cut power to the robot if the door is open and the robot is not in the home position.

公开(公告)号：US20220023990A1

公开(公告)日：2022-01-27

申请号：US17494631

申请日：2021-10-05

Applicant: Applied Materials, Inc.

Inventor： Yongqi Hu ,  Kadthala Ramaya Narendrnath ,  Thomas Lawrence Terry

IPC: B24B37/20 ,  B24B37/22 ,  B24B37/24

Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

公开(公告)号：US20170246722A1

公开(公告)日：2017-08-31

申请号：US15054849

申请日：2016-02-26

Applicant: Applied Materials, Inc.

Inventor： Yongqi Hu ,  Kadthala Ramaya Narendrnath ,  Thomas Lawrence Terry

IPC: B24B37/20

CPC classification number: B24B37/205

Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

公开(公告)号：US10213894B2

公开(公告)日：2019-02-26

申请号：US15054849

申请日：2016-02-26

Applicant: Applied Materials, Inc.

Inventor： Yongqi Hu ,  Kadthala Ramaya Narendrnath ,  Thomas Lawrence Terry

IPC: B24B37/20

Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

公开(公告)号：US11826875B2

公开(公告)日：2023-11-28

申请号：US17494631

申请日：2021-10-05

Applicant: Applied Materials, Inc.

Inventor： Yongqi Hu ,  Kadthala Ramaya Narendrnath ,  Thomas Lawrence Terry

IPC: B24B37/20 ,  B24B37/22 ,  B24B37/24

CPC classification number: B24B37/205 ,  B24B37/22 ,  B24B37/24

Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

公开(公告)号：US20190152017A1

公开(公告)日：2019-05-23

申请号：US16252513

申请日：2019-01-18

Applicant: Applied Materials, Inc.

Inventor： Yongqi Hu ,  Kadthala Ramaya Narendrnath ,  Thomas Lawrence Terry

IPC: B24B37/20

Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

公开(公告)号：US08734202B2

公开(公告)日：2014-05-27

申请号：US13899242

申请日：2013-05-21

Applicant: Applied Materials, Inc.

Inventor： David James Lischka ,  Thomas Lawrence Terry

IPC: B24B1/00

CPC classification number: B24B37/345 ,  B24B37/005

Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.

Abstract translation: 本发明的实施例通常提供了用于在化学机械抛光系统中转移衬底的负载杯。 负载杯包括改进的基板边缘检测机构，以确保基板存在并且正确地定位在负载杯中以转移到抛光头。 在一个实施例中，提供了杠杆致动的边缘检测机构。 在一个实施例中，基板的边缘接触与传感器接触的杠杆，以检测基板存在并且被正确定位以与抛光头交换。 本发明的实施例提供可靠的检测，同时在衬底传送期间减少与衬底的特征侧的接触。