公开(公告)号：US20250125181A1

公开(公告)日：2025-04-17

申请号：US18486072

申请日：2023-10-12

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Onkara Swamy Kora Siddaramaiah ,  David Benjaminson ,  Ryan Pakulski ,  Anh N. Nguyen ,  Son T. Nguyen ,  Prashanth Rao

IPC: H01L21/683 ,  H01L21/67

Abstract: Exemplary semiconductor processing chambers may include a chamber body. The chambers may include a showerhead positioned atop the body. The chambers may include an electrostatic chuck assembly disposed within the body. The assembly may include a puck that may include a first plate including an electrically insulating material and that defines a substrate support surface. The puck may include a multi-zone heating assembly thermally coupled with the first plate. The puck may include bipolar electrodes. The puck may include a second plate that defines cooling channels. The assembly may include an insulator beneath the second plate. The assembly may include a base plate beneath the insulator. The assembly may include a shaft that may include a heater rod coupled with the heating assembly. The shaft may include a cooling fluid lumen fluidly coupled with the cooling channels. The shaft may include a power rod electrically coupled with a bipolar electrode.

公开(公告)号：US10177014B2

公开(公告)日：2019-01-08

申请号：US14050196

申请日：2013-10-09

Applicant: Applied Materials, Inc.

Inventor： Govinda Raj ,  Daniel Martin ,  Robert T. Hirahara ,  Ashish Bhatnagar ,  Bopanna Vasanth ,  Prashanth Rao ,  Kadthala R. Narendrnath

IPC: H01L21/67 ,  H01L21/687 ,  C23C16/00 ,  C23F1/00 ,  H01L21/306

Abstract: An apparatus for a substrate support heater and associated chamber components having reduced energy losses are provided. In one embodiment, a substrate support heater is provided. The substrate support heater includes a heater body having a first surface to receive a substrate and a second surface opposing the first surface, a heating element disposed in the heater body between the first surface and the second surface, and a thermal barrier disposed on the second surface of the heater body, wherein the thermal barrier comprises a first layer and a second layer disposed on the first layer.