公开(公告)号：US09960019B2

公开(公告)日：2018-05-01

申请号：US14270993

申请日：2014-05-06

Applicant: Applied Materials, Inc.

Inventor： Sandhya Arun ,  Prashanth Kodigepalli ,  Padma Gopalakrishnan ,  Ashish Bhatnagar ,  Dan Martin ,  Christopher Heath John Hossack

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  C23C14/34 ,  C23C14/50

CPC classification number: H01J37/32798 ,  C23C14/34 ,  C23C14/50 ,  H01J37/32495 ,  H01J37/32623 ,  H01J37/32642 ,  H01L21/67069 ,  H01L21/6831 ,  H01L21/68735

Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring body having a top planar surface and a bottom planar surface, and an outer ring body having a top surface, a bottom surface substantially parallel to the top surface, and an inside surface that extends between the top surface and the bottom surface, the inside surface having a roof covering a portion of the inner ring body when the inner ring body is disposed adjacent the roof, wherein the inner ring body can be flipped into a different position so that a portion of the inner ring body that is not covered by the roof provides a substantially planar surface.