公开(公告)号：US20200381286A1

公开(公告)日：2020-12-03

申请号：US16986192

申请日：2020-08-05

Applicant: Applied Materials, Inc.

Inventor： Young J. Paik ,  Melvin Barrentine ,  Abhijit Y. Desai ,  Hai Nguyen ,  Ashish Bhatnagar ,  Rajkumar Alagarsamy

IPC: H01L21/683 ,  B24B37/30

Abstract: A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is larger than the recess into which it fits, such that the compression forms a conformal seal inside the recess. The bead may also be left uncoated to enhance adhesion of the bead to the surface of the groove. The surface of the cover may be roughened to reduce adhesion of the substrate to the cover without using a non-stick coating.

公开(公告)号：US20170243779A1

公开(公告)日：2017-08-24

申请号：US15592038

申请日：2017-05-10

Applicant: Applied Materials, Inc.

Inventor： Young J. Paik ,  Melvin Barrentine ,  Abhijit Y. Desai ,  Hai Nguyen ,  Ashish Bhatnagar ,  Rajkumar Alagarsamy

IPC: H01L21/683 ,  B24B37/30

CPC classification number: H01L21/6838 ,  B24B37/30 ,  H01L21/0201 ,  H01L21/30625 ,  Y10T428/24355 ,  Y10T428/24612

Abstract: A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is larger than the recess into which it fits, such that the compression forms a conformal seal inside the recess. The bead may also be left uncoated to enhance adhesion of the bead to the surface of the groove. The surface of the cover may be roughened to reduce adhesion of the substrate to the cover without using a non-stick coating.