Photocuring resin composition, medical device using same and method for manufacturing same
    1.
    发明申请
    Photocuring resin composition, medical device using same and method for manufacturing same 审中-公开
    光固化树脂组合物,使用其的医疗装置及其制造方法

    公开(公告)号:US20070082965A1

    公开(公告)日:2007-04-12

    申请号:US10536909

    申请日:2003-11-13

    IPC分类号: C08G59/68

    CPC分类号: G03F7/038

    摘要: It is an object of the present invention to provide a novel photo-curing composition which can be cured by light of a wide wavelength region including ultraviolet light or visible light, has such high sensitivity that it can be sufficiently cured by exposure to a small amount of light, can favorably form a fine pattern when used as a resist and provides a cured product having excellent heat resistance and insulating properties, and a negative photoresist composition using the photo-curing composition. It is another object of the present invention to provide a process for highly accurately and easily producing a polyimide thin film used for a medical instrument, and a medical instrument having the polyimide thin film. The photo-curing composition of the present invention comprises (A) a carbon cluster and/or its derivative, having a photosensitizing function, (B) a compound having plural heterocyclic rings in a molecule, and if necessary, (C) a photo-insensitive resin.

    摘要翻译: 本发明的目的是提供一种可通过包括紫外光或可见光在内的宽波长区域的光固化的新型光固化组合物,具有这样高的灵敏度,可以通过暴露于少量来充分固化 光可以有利地形成精细图案,并且提供具有优异的耐热性和绝缘性的固化产物,以及使用光固化组合物的负性光致抗蚀剂组合物。 本发明的另一个目的是提供一种用于高度准确且容易地制造用于医疗器械的聚酰亚胺薄膜和具有该聚酰亚胺薄膜的医疗器械的方法。 本发明的光固化性组合物包含(A)具有光敏作用的碳簇和/或其衍生物,(B)分子中具有多个杂环的化合物,根据需要,(C) 不敏感树脂。

    Composition and method for temporarily fixing solids
    3.
    发明申请
    Composition and method for temporarily fixing solids 审中-公开
    临时固定固体的组成和方法

    公开(公告)号:US20060275939A1

    公开(公告)日:2006-12-07

    申请号:US11501713

    申请日:2006-08-10

    IPC分类号: H01L21/00

    摘要: The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.

    摘要翻译: 本发明涉及一种暂时且牢固地将两种固体彼此固定的方法以及该方法中使用的组合物,该方法是暂时固定的方法,其包括用液晶化合物临时固定两种固体,或 包含液晶化合物的组合物。 该方法用于临时固定用于化学机械抛光的焊盘的方法,例如,当固体是用于晶片的化学机械抛光的焊盘时,抛光固定在基板的表面上的半导体器件的晶片 用于半导体器件,另一个是用于固定焊盘的基板。

    Epoxy group-containing resin compositions
    6.
    发明授权
    Epoxy group-containing resin compositions 失效
    含环氧基团的树脂组合物

    公开(公告)号:US5399604A

    公开(公告)日:1995-03-21

    申请号:US094436

    申请日:1993-07-21

    摘要: An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained from (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and optionally (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided another epoxy-group containing thermosetting resin composition which contains the above component (A), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.

    摘要翻译: 含有环氧基的热固性树脂组合物,其包含(A)由(a)选自不饱和羧酸和不饱和羧酸酐中的至少一种的成分得到的共聚物,(b)含环氧基的不饱和化合物,(c) 单烯烃不饱和化合物和任选的(d)共轭二烯不饱和化合物,和(B)用于溶解上述共聚物的有机溶剂。 还提供另一种含环氧基的热固性树脂组合物,其含有上述组分(A),(C)具有至少一个烯属不饱和双键的可聚合化合物和(D)光聚合引发剂。 这些含环氧基的热固性树脂组合物的保存稳定性优异。