摘要:
An angular velocity sensor element is provided which is capable of preventing even transmission of sudden externally-applied vibration to an element portion by absorbing the vibration. An angular velocity sensor element 2 according to the present embodiment has a fixing portion 21 in the form of a frame, an element portion 20 disposed in the frame of the fixing portion 21 and having vibrating arms 21 to 24 in a drive system and a detection system, and a connecting portion 25 formed as a fixed-fixed beam having its both ends connected to the fixing portion 21 and having its intermediate portion connected to the element portion 20.
摘要:
An angular velocity sensor of a horizontally located type, in which influence of a translational acceleration applied thereto from a lateral direction is readily removed and a fixed portion thereof is easily fixed, is provided. It includes a fixed portion fixed to the top surface of a sensor element supporting portion of a casing, an upper detection arm portion and a lower detection arm portion respectively connected to the fixed portion on sides opposite to each other and extending along a plane parallel to the top surface of the sensor element supporting portion, and a pair of upper vibration arms connected to the fixed portion with the upper detection arm portion in between. The fixed portion includes one or more slits extending at least in a direction intersecting with the extending direction of the upper detection arm portion.
摘要:
An angular velocity sensing element is provided, which is able to prevent breakage of an oscillation arm even when an excessively large shock is given. An angular velocity sensing element 2 according to the present embodiment includes oscillation arms 22, 23 and 24 formed of a semiconductor material, and a stopper member provided to limit the oscillation range of the oscillation arms. As such a stopper member, a first stopper member 25 is provided, for example, which limits the oscillation range of the oscillation arms at least within a single plane of the arms. Fixing portions 21, the oscillation arms 22, 23 and 24 and the first stopper member 25 are integrally formed by processing a semiconductor material, such as silicon.
摘要:
A film bulk acoustic wave resonator of the invention includes a substrate; a resonant structure provided on the substrate constituted by a lower electrode, a piezoelectric film and an upper electrode; and an acoustic multilayer of a plurality of reflective films provided between the substrate and the resonant structure. At least one of the reflective films of the acoustic multilayer has a specified crystal plane orientation, and an X-ray rocking curve full width at half maximum that is preferably not greater than 10 degrees, and more preferably is not greater than 3 degrees. This makes it possible to obtain better resonance characteristics than in the case of the prior art, by increasing the efficiency with which bulk waves propagating towards the substrate are reflected.
摘要:
An electronic device includes a substrate, a lower conductive film formed on the substrate and a functional film formed on the lower conductive film. In the present invention, an adhesion of the lower conductive film on the side of the substrate is greater than or equal to 0.1 N/cm. The electronic device according to this invention exhibits high mechanical strength that makes it very reliable. This is because the invention prevents the physical exfoliation of the lower conductive film that is apt to occur during or after fabrication of the electronic device when the adhesion of the lower conductive film is lower than 0.1 N/cm.
摘要:
The first object of the invention is to provide means that enables a perovskite oxide thin film having (100) orientation, (001) orientation or (111) orientation to be easily obtained, and the second object of the invention is to provide a multilayer thin film comprising a unidirectionally oriented metal thin film of good crystallinity. The multilayer thin film according to the first embodiment of the invention comprises a buffer layer and a perovskite oxide thin film present thereon. The interface between the buffer layer and the perovskite oxide thin film is made up of a {111} facet plane. Substantially parallel to the facet plane there is present a {110} face of a cubic, rhombohedral, tetragonal or orthorhombic crystal of the perovskite oxide thin film, a {101} face of the tetragonal or orthorhombic crystal or a {011} face of the orthorhombic crystal. The multilayer thin film according to the second embodiment of the invention comprises a metal thin film that is a cubic (100) unidirectionally oriented epitaxial film, and a buffer layer where a {111} facet plane is present on the interface of the buffer layer in contact with the metal thin film.
摘要:
On a single crystal substrate such as silicon, a ferroelectric thin film having a YMnO.sub.3 hexagonal crystal structure, composed mainly of a rare earth element (inclusive of scandium and yttrium), manganese and oxygen, and c-plane oriented parallel to the substrate surface is formed, preferably with an epitaxial oxide film or conductive epitaxial film being interposed therebetween. It is suitable for gate type non-volatile memory devices having MFIS and MFMIS structures.
摘要:
In rapidly cooling a large diameter metal pipe for quenching purposes, the essential requirements for ensuring uniform cooling of the pipe, namely, the jet velocity and the dip angle and transverse angle of jets of the cooling water directed against the surface of the pipe from a large number of spray nozzles contained in each of a first and second ring header encircling the pipe, and the distance between the circumferential line defined on the pipe by connecting the points of impingement onto the pipe surface of the water jets sprayed in the direction of the second header from the spray nozzles of the first header and the similar circumferential line defined on the pipe by connecting the points of impingement onto the pipe surface of the water jets sprayed in the direction of the first header from the spray nozzles of the rear second header, are specified with numerical values.
摘要:
An angular velocity sensing element is provided, which is able to prevent breakage of an oscillation arm even when an excessively large shock is given. An angular velocity sensing element 2 according to the present embodiment includes oscillation arms 22, 23 and 24 formed of a semiconductor material, and a stopper member provided to limit the oscillation range of the oscillation arms. As such a stopper member, a first stopper member 25 is provided, for example, which limits the oscillation range of the oscillation arms at least within a single plane of the arms. Fixing portions 21, the oscillation arms 22, 23 and 24 and the first stopper member 25 are integrally formed by processing a semiconductor material, such as silicon.
摘要:
The present invention provides an electronic device with improved characteristics and a method of making the electronic device. In a method of making an electronic device (piezoelectric device) 74 according to the present invention, an outer edge R1 of a piezoelectric film 52A formed on an electrode film 46A of a laminate 60 is located inside an outer edge R2 of the electrode film 46A. For this reason, in removal of a monocrystalline Si substrate 14 from a multilayer board 61, where an etching solution permeates between polyimide 72 and laminate 60, the etching solution circumvents the electrode film 46A before it reaches the piezoelectric film 52A. Namely, a route A of the etching solution to the piezoelectric film 52A is significantly extended by the electrode film 46A. In the method of making the electronic device 74, therefore, the etching solution is less likely to reach the piezoelectric film 52A. It significantly suppresses a situation of dissolution of the piezoelectric film 52A and realizes improvement in characteristics of the piezoelectric device 74 made.