公开(公告)号：US08945990B2

公开(公告)日：2015-02-03

申请号：US13454115

申请日：2012-04-24

申请人： Holger Torwesten ,  Manfred Mengel ,  Stefan Schmid ,  Soon Lock Goh ,  Swee Kah Lee

发明人： Holger Torwesten ,  Manfred Mengel ,  Stefan Schmid ,  Soon Lock Goh ,  Swee Kah Lee

IPC分类号： H01L21/00

CPC分类号： H01L23/3121 ,  H01L23/296 ,  H01L23/3142 ,  H01L23/492 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48609 ,  H01L2224/48611 ,  H01L2224/48639 ,  H01L2224/48709 ,  H01L2224/48711 ,  H01L2224/48739 ,  H01L2224/48809 ,  H01L2224/48811 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83411 ,  H01L2224/83439 ,  H01L2224/83805 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85214 ,  H01L2224/85409 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2224/85805 ,  H01L2224/8592 ,  H01L2224/85939 ,  H01L2924/00011 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2224/83205

摘要： Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip opposite to the carrier; depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer including tin or indium; depositing a second adhesion layer on the first adhesion layer, the second adhesion layer including a silane organic material; and depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip.

摘要翻译： 实施例提供了形成芯片封装的方法。 该方法可以包括在载体上附加至少一个芯片，该芯片包括在芯片的与载体相对的表面上的多个芯片焊盘; 在所述载体上和所述芯片的所述芯片焊盘上沉积第一粘合层，所述第一粘附层包括锡或铟; 在第一粘合层上沉积第二粘合层，第二粘合层包括硅烷有机材料; 以及在所述第二粘合层和所述芯片上沉积层压层或封装层。

公开(公告)号：US20100129964A1

公开(公告)日：2010-05-27

申请号：US12324327

申请日：2008-11-26

申请人： Soon Lock Goh ,  Chau Fatt Chiang

发明人： Soon Lock Goh ,  Chau Fatt Chiang

IPC分类号： H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/49513 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor package with a bump using a carrier. One embodiment provides forming a bump on a carrier. A gap is formed in the carrier that undercuts the bump. A semiconductor chip is attached to the carrier. The chip is electrically connected to the bump. An encapsulant is deposited into the gap. The carrier is removed from the bump.

摘要翻译： 使用载体制造具有凸块的半导体封装的方法。 一个实施例提供在载体上形成凸块。 在载体上形成凹陷凸起的间隙。 半导体芯片附着在载体上。 芯片电连接到凸块。 密封剂沉积在间隙中。 载体从凸块上移除。

公开(公告)号：US08304295B2

公开(公告)日：2012-11-06

申请号：US12820821

申请日：2010-06-22

申请人： Soon Lock Goh ,  Swee Kah Lee ,  Chin Wei Ronnie Tan

发明人： Soon Lock Goh ,  Swee Kah Lee ,  Chin Wei Ronnie Tan

IPC分类号： H01L21/00

CPC分类号： H01L23/3107 ,  H01L21/568 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/82001 ,  H01L2224/85001 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/45099 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01049

摘要： Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad and a second opening underneath the second pad. A first bump is arranged in the first opening and a second bump is arranged in the second opening, wherein the encapsulation mechanically locks the first bump to the first pad and the second bump to the second pad.

摘要翻译： 公开了一种电子设备封装的装置和方法。 电子器件封装包括第一焊盘，第二焊盘和围绕第一焊盘和第二焊盘的封装，其中封装包括第一焊盘下方的第一开口和第二焊盘下方的第二开口。 第一凸起布置在第一开口中，并且第二凸起布置在第二开口中，其中封装将第一凸起机械地锁定到第一焊盘，将第二凸起机械地锁定到第二焊盘。

公开(公告)号：US20110309493A1

公开(公告)日：2011-12-22

申请号：US12820821

申请日：2010-06-22

申请人： Soon Lock Goh ,  Swee Kah Lee ,  Chin Wei Ronnie Tan

发明人： Soon Lock Goh ,  Swee Kah Lee ,  Chin Wei Ronnie Tan

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L23/3107 ,  H01L21/568 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/82001 ,  H01L2224/85001 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/45099 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01049

摘要： Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad and a second opening underneath the second pad. A first bump is arranged in the first opening and a second bump is arranged in the second opening, wherein the encapsulation mechanically locks the first bump to the first pad and the second bump to the second pad.

摘要翻译： 公开了一种电子设备封装的装置和方法。 电子器件封装包括第一焊盘，第二焊盘和围绕第一焊盘和第二焊盘的封装，其中封装包括第一焊盘下方的第一开口和第二焊盘下方的第二开口。 第一凸起布置在第一开口中，并且第二凸起布置在第二开口中，其中封装将第一凸起机械地锁定到第一焊盘，将第二凸起机械地锁定到第二焊盘。

公开(公告)号：US07955901B2

公开(公告)日：2011-06-07

申请号：US11867329

申请日：2007-10-04

申请人： Henrik Ewe ,  Stefan Landau ,  Klaus Schiess ,  Robert Bergmann ,  Alvin Wee Beng Tatt ,  Soon Lock Goh ,  Joachim Mahler ,  Boris Plikat ,  Reimund Engl

发明人： Henrik Ewe ,  Stefan Landau ,  Klaus Schiess ,  Robert Bergmann ,  Alvin Wee Beng Tatt ,  Soon Lock Goh ,  Joachim Mahler ,  Boris Plikat ,  Reimund Engl

IPC分类号： H01L23/48

CPC分类号： H01L23/3107 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/24998 ,  H01L2224/32245 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00

摘要： A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as far as the inner housing plane was a leaving free the source and gate contact areas on the top side of the semiconductor chip and also was partly leaving free the top sides of the corresponding external contacts.

摘要翻译： 公开了一种具有表面安装平坦的外部接触区域的功率半导体模块的制造方法。 至少一个功率半导体芯片由其后侧固定在漏极外部触点上。 绝缘层覆盖半导体芯片的侧边缘上方的顶侧，只要内壳平面离开半导体芯片的顶侧上的源极和栅极接触区域，并且还部分地释放出半导体芯片的顶侧 相应的外部联系人。

公开(公告)号：US07838332B2

公开(公告)日：2010-11-23

申请号：US12324327

申请日：2008-11-26

申请人： Soon Lock Goh ,  Chau Fatt Chiang

发明人： Soon Lock Goh ,  Chau Fatt Chiang

IPC分类号： H01L21/00

CPC分类号： H01L23/3107 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/49513 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor package with a bump using a carrier. One embodiment provides forming a bump on a carrier. A gap is formed in the carrier that undercuts the bump. A semiconductor chip is attached to the carrier. The chip is electrically connected to the bump. An encapsulant is deposited into the gap. The carrier is removed from the bump.

摘要翻译： 使用载体制造具有凸块的半导体封装的方法。 一个实施例提供在载体上形成凸块。 在载体上形成凹陷凸起的间隙。 半导体芯片附着在载体上。 芯片电连接到凸块。 密封剂沉积在间隙中。 载体从凸块上移除。

公开(公告)号：US20130277813A1

公开(公告)日：2013-10-24

申请号：US13454115

申请日：2012-04-24

申请人： Holger Torwesten ,  Manfred Mengel ,  Stefan Schmid ,  Soon Lock Goh ,  Swee Kah Lee

发明人： Holger Torwesten ,  Manfred Mengel ,  Stefan Schmid ,  Soon Lock Goh ,  Swee Kah Lee

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L23/3121 ,  H01L23/296 ,  H01L23/3142 ,  H01L23/492 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48609 ,  H01L2224/48611 ,  H01L2224/48639 ,  H01L2224/48709 ,  H01L2224/48711 ,  H01L2224/48739 ,  H01L2224/48809 ,  H01L2224/48811 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83411 ,  H01L2224/83439 ,  H01L2224/83805 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85214 ,  H01L2224/85409 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2224/85805 ,  H01L2224/8592 ,  H01L2224/85939 ,  H01L2924/00011 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2224/83205

摘要： Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip opposite to the carrier; depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer including tin or indium; depositing a second adhesion layer on the first adhesion layer, the second adhesion layer including a silane organic material; and depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip.

摘要翻译： 实施例提供了形成芯片封装的方法。 该方法可以包括在载体上附加至少一个芯片，该芯片包括在芯片的与载体相对的表面上的多个芯片焊盘; 在所述载体上和所述芯片的所述芯片焊盘上沉积第一粘合层，所述第一粘附层包括锡或铟; 在第一粘合层上沉积第二粘合层，第二粘合层包括硅烷有机材料; 以及在所述第二粘合层和所述芯片上沉积层压层或封装层。

公开(公告)号：US20090093090A1

公开(公告)日：2009-04-09

申请号：US11867329

申请日：2007-10-04

申请人： Henrik Ewe ,  Stefan Landau ,  Klaus Schiess ,  Robert Bergmann ,  Alvin Wee Beng Tatt ,  Soon Lock Goh ,  Joachim Mahler ,  Boris Plikat ,  Reimund Engl

发明人： Henrik Ewe ,  Stefan Landau ,  Klaus Schiess ,  Robert Bergmann ,  Alvin Wee Beng Tatt ,  Soon Lock Goh ,  Joachim Mahler ,  Boris Plikat ,  Reimund Engl

IPC分类号： H01L21/56

CPC分类号： H01L23/3107 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/24998 ,  H01L2224/32245 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00

摘要： A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as far as the inner housing plane was a leaving free the source and gate contact areas on the top side of the semiconductor chip and also was partly leaving free the top sides of the corresponding external contacts.

摘要翻译： 公开了一种具有表面安装平坦的外部接触区域的功率半导体模块的制造方法。 至少一个功率半导体芯片由其后侧固定在漏极外部触点上。 绝缘层覆盖半导体芯片的侧边缘上方的顶侧，只要内壳平面离开半导体芯片的顶侧上的源极和栅极接触区域，并且还部分地释放出半导体芯片的顶侧 相应的外部联系人。