发明授权
US07838332B2 Method of manufacturing a semiconductor package with a bump using a carrier
有权
使用载体制造具有凸块的半导体封装的方法
- 专利标题： Method of manufacturing a semiconductor package with a bump using a carrier
- 专利标题（中）： 使用载体制造具有凸块的半导体封装的方法
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申请号： US12324327申请日： 2008-11-26
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公开(公告)号： US07838332B2公开(公告)日： 2010-11-23
- 发明人: Soon Lock Goh , Chau Fatt Chiang
- 申请人： Soon Lock Goh , Chau Fatt Chiang
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dicke, Billig & Czaja, PLLC
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of manufacturing a semiconductor package with a bump using a carrier. One embodiment provides forming a bump on a carrier. A gap is formed in the carrier that undercuts the bump. A semiconductor chip is attached to the carrier. The chip is electrically connected to the bump. An encapsulant is deposited into the gap. The carrier is removed from the bump.
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