发明授权
US08304295B2 Method of manufacturing an electronic device with a package locking system
有权
制造具有封装锁定系统的电子设备的方法
- 专利标题： Method of manufacturing an electronic device with a package locking system
- 专利标题（中）： 制造具有封装锁定系统的电子设备的方法
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申请号： US12820821申请日： 2010-06-22
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公开(公告)号： US08304295B2公开(公告)日： 2012-11-06
- 发明人: Soon Lock Goh , Swee Kah Lee , Chin Wei Ronnie Tan
- 申请人： Soon Lock Goh , Swee Kah Lee , Chin Wei Ronnie Tan
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad and a second opening underneath the second pad. A first bump is arranged in the first opening and a second bump is arranged in the second opening, wherein the encapsulation mechanically locks the first bump to the first pad and the second bump to the second pad.
公开/授权文献
- US20110309493A1 Electronic Device Package Locking System and Method 公开/授权日：2011-12-22
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