公开(公告)号：US20040259025A1

公开(公告)日：2004-12-23

申请号：US10819686

申请日：2004-04-05

Applicant: Shipley Company, L.L.C.

Inventor： George G. Barclay ,  Stefan J. Caporale ,  Robert J. Kavanagh ,  Nick Pugliano

IPC: G03C001/76

CPC classification number: G03F7/0392 ,  G03F7/0382 ,  G03F7/0395 ,  G03F7/0397 ,  Y10S430/106

Abstract: The invention includes new polymers and methods for providing such polymers and photoresists that comprises the polymers. Methods of the invention include those that comprise providing a reaction mixture and adding over the course of a polymerization reaction one or more polymerization reagents to the reaction mixture to provide the polymer. Photoresists containing a polymer of the invention can exhibit significantly improved lithographic properties.

Abstract translation: 本发明包括用于提供包含聚合物的这种聚合物和光致抗蚀剂的新聚合物和方法。 本发明的方法包括提供反应混合物并在聚合反应过程中向反应混合物中加入一种或多种聚合试剂以提供聚合物的方法。 含有本发明聚合物的光致抗蚀剂可显示出显着改善的平版印刷性能。

公开(公告)号：US20040258847A1

公开(公告)日：2004-12-23

申请号：US10723218

申请日：2003-11-26

Applicant: Shipley Company, L.L.C.

Inventor： Martin W. Bayes ,  Raymund W. M. Kwok

IPC: C25D021/06 ,  C25D021/16 ,  C25D021/18

CPC classification number: C23C18/31 ,  C23C18/1617 ,  C23C18/1683 ,  C23C18/36 ,  C25D21/12

Abstract: A method to determine and monitor concentrations of inert metal plating components in metal plating baths. An inert indictor is included in the bath composition and the concentration of the inert indictor is monitored during plating. The change in the concentration of the inert indicator is used to determine the change in the concentration of inert bath components.

Abstract translation: 确定和监测金属电镀液中惰性金属电镀组分浓度的方法。 在浴组合物中包括惰性指示剂，并且在电镀期间监测惰性指示剂的浓度。 惰性指示剂浓度的变化用于确定惰性浴组分浓度的变化。

公开(公告)号：US20040253450A1

公开(公告)日：2004-12-16

申请号：US10696552

申请日：2003-10-29

Applicant: Shipley Company, L.L.C.

Inventor： Masaru Seita ,  Hideki Tsuchida ,  Masaaki Imanari ,  Yoshihiro Sugita ,  Andre Egli ,  William Brasch

IPC: B32B009/04 ,  B05D001/18

CPC classification number: C23C18/30 ,  C23C18/40 ,  H05K3/181 ,  Y10T428/31504

Abstract: This invention provides a process for electroless copper plating without using formaldehyde and an electroless copper plating solution which is used in the process. To this end, there is disclosed a process for electroless copper plating, which treatment comprises depositing a palladium or palladium-tin catalyst on a resin substrate, and then treating said resin substrate having the catalyst deposited thereon with a formaldehyde-free electroless copper plating solution that contains copper ions and a reducing agent, wherein the need for an accelerating treatment of a catalyst after said catalyst depositing treatment is obviated. The productivity of a copper-resin composite material is dramatically enhanced by the process of the present invention, because a copper thin layer can be formed on the resin substrate in a short time, even if an accelerating treatment for a catalyst is not performed in a separate process.

Abstract translation: 本发明提供一种无需使用甲醛的化学镀铜方法和该方法中使用的化学镀铜溶液。 为此，公开了一种无电镀铜方法，该方法包括在树脂基板上沉积钯或钯 - 锡催化剂，然后用不含甲醛的化学镀铜溶液处理其上沉积有催化剂的催化剂的树脂基材 其含有铜离子和还原剂，其中消除了在所述催化剂沉积处理之后催化剂的加速处理的需要。 通过本发明的方法，铜树脂复合材料的生产率显着提高，因为即使不在催化剂中进行催化剂的加速处理，也可以在短时间内在树脂基板上形成铜薄层 单独的过程。

公开(公告)号：US20040231757A1

公开(公告)日：2004-11-25

申请号：US10873523

申请日：2004-06-21

Applicant: Shipley Company, L.L.C.

Inventor： Craig S. Allen ,  John Schemenaur ,  David D. Senk ,  Marc Langlois ,  Xiaodong Hu ,  Jan Tzyy-Jiuan Hwang ,  Jud Ready ,  Trifon Tomov

IPC: C22C005/04

CPC classification number: H05K1/167 ,  H01C7/006 ,  H01C7/06 ,  H01C17/08 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0361 ,  Y10T428/261 ,  Y10T428/31678

Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent of iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.

Abstract translation: 公开了包含铂和约5至约70摩尔％的铱，钌或其混合物的电阻材料，其基于铂为100％计算。

公开(公告)号：US20040224528A1

公开(公告)日：2004-11-11

申请号：US10742424

申请日：2003-12-19

Applicant: Shipley Company, L.L.C.

Inventor： George P. Mirth

IPC: H01L021/31 ,  H01L021/469 ,  H01L021/4763

CPC classification number: G03F7/094 ,  G03F7/11 ,  H01L21/0271 ,  H01L21/0273 ,  H01L21/0337 ,  H01L21/31144 ,  H01L21/312 ,  H01L21/32139

Abstract: A method of manufacturing electronic devices containing one or more layers of materials that are sensitive to the strong chemicals used to remove cross-linked polymeric layers such as photoresists and antireflective coatings is provided. The cross-linked polymeric layers can be easily removed following etching through the use of certain removable layers disposed between the substrate and the cross-linked polymeric layers.

Abstract translation: 提供一种制造电子器件的方法，其包含对用于除去交联聚合物层（例如光致抗蚀剂和抗反射涂层）的强化学品敏感的一层或多层材料。 在通过使用设置在基底和交联聚合物层之间的某些可移除层的蚀刻之后，可以容易地除去交联的聚合物层。

公开(公告)号：US20040218889A1

公开(公告)日：2004-11-04

申请号：US10726052

申请日：2003-12-02

Applicant: Shipley Company, L.L.C.

Inventor： James G. Shelnut ,  Matthew L. Moynihan ,  Omari Patterson

IPC: G02B006/00

CPC classification number: G02B6/138

Abstract: Provided are methods of forming optical waveguides. The methods involve: (a) forming over a substrate a layer of a photodefinable composition; (b) exposing a portion of the layer to actinic radiation; (c) developing the exposed layer to form a waveguide core structure; and (d) heating the waveguide core structure to a temperature and for a time effective to reflow the structure such that it becomes at least partially rounded in cross-section. Also provided are optical waveguides formed from the described methods and electronic devices including one or more of the optical waveguides.

Abstract translation: 提供了形成光波导的方法。 所述方法包括：（a）在基底上形成可光分解组合物的层; （b）将该层的一部分暴露于光化辐射; （c）显影曝光层以形成波导芯结构; 和（d）将波导芯结构加热到有效地回流结构的温度和时间，使得其在横截面中变得至少部分为圆形。 还提供了由所述方法形成的光波导和包括一个或多个光波导的电子器件。

公开(公告)号：US20040217008A1

公开(公告)日：2004-11-04

申请号：US10723219

申请日：2003-11-26

Applicant: Shipley Company, L.L.C.

Inventor： Hideki Tsuchida ,  Masaru Kusaka ,  Shinjiro Hayashi

IPC: C25D003/38

CPC classification number: C25D21/18 ,  C25D3/38 ,  H01L21/2885 ,  H01L21/76877 ,  H05K3/423

Abstract: A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of nullXnullSnullYnull, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and X and Y may be the same only when they are a carbon atom, and by contacting the electrolytic copper plating solution with ozone is disclosed.

Abstract translation: 一种电解镀铜方法，其特征在于，使用包含含有-XSY-结构的化合物的电解镀铜溶液，其中X和Y独立地选自氢原子，碳原子，硫原子，氮原子和氧原子，X和 Y可以相同，只要它们是碳原子，并且通过使电解铜电镀溶液与臭氧接触。

公开(公告)号：US20040209200A1

公开(公告)日：2004-10-21

申请号：US10844125

申请日：2004-05-12

Applicant: Shipley Company, L.L.C.

Inventor： Gerald B. Wayton ,  Peter Trefonas III ,  Suzanne Coley ,  Tomoki Kurihara

IPC: G03C001/76

CPC classification number: C09D167/00 ,  G03F7/091 ,  Y10T428/31786

Abstract: In a first aspect, organic coating compositions are provided, particularly spin-on antireflective coating compositions, that contain a polyester resin component. In a further aspect, coating compositions are provided that contain a resin component obtained by polymerization of a multi-hydroxy compound. Coating compositions of the invention are particularly useful employed in combination with an overcoated photoresist layer to manufacture integrated circuits.

Abstract translation: 在第一方面，提供了含有聚酯树脂组分的有机涂料组合物，特别是旋涂抗反射涂料组合物。 在另一方面，提供含有通过聚合多羟基化合物获得的树脂组分的涂料组合物。 本发明的涂料组合物特别可用于与外涂光致抗蚀剂层组合以制造集成电路。

公开(公告)号：US20040209188A1

公开(公告)日：2004-10-21

申请号：US10847679

申请日：2004-05-17

Applicant: Shipley Company, L.L.C.

Inventor： Charles R. Szmanda ,  Anthony Zampini

IPC: G03C001/76

CPC classification number: H05K3/381 ,  C08J7/02 ,  C23C18/2006 ,  C23C18/24 ,  G03F7/0046 ,  G03F7/0048 ,  G03F7/0392 ,  G03F7/0395 ,  G03F7/0397 ,  H05K3/0055 ,  Y10S430/113

Abstract: New photoresists are provides that are suitable for short wavelength imaging, particularly sub-170 nm such as 157 nm. Resists of the invention comprise a fluorine-containing polymer, a photoactive component, and a solvent component. Preferred solvents for use on the resists of the invention can maintain the resist components in solution and include one or more preferably two or more (i.e. blends) of solvents. In particularly preferred solvent blends of the invention, each blend member evaporates at substantially equal rates, whereby the resist composition maintains a substantially constant concentration of each blend member.

Abstract translation: 提供适用于短波长成像的新型光致抗蚀剂，特别是亚170nm，例如157nm。 本发明的抗菌剂包括含氟聚合物，光敏组分和溶剂组分。 用于本发明抗蚀剂的优选溶剂可以将抗蚀剂组分保持在溶液中，并且包括溶剂的一种或多种（即共混物）。 在本发明的特别优选的溶剂共混物中，每个共混构件以基本上相等的速率蒸发，由此抗蚀剂组合物保持每个共混构件的基本恒定的浓度。

公开(公告)号：US20040161699A1

公开(公告)日：2004-08-19

申请号：US10783631

申请日：2004-02-20

Applicant: Shipley Company, L.L.C.

Inventor： James W. Thackeray ,  Angelo A. Lamola

IPC: G03F007/20 ,  G03F007/40 ,  G03F007/038

CPC classification number: G03F7/0382 ,  G03F7/004 ,  G03F7/0045 ,  G03F7/0226 ,  G03F7/038 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/40

Abstract: The present invention provides radiation sensitive compositions and methods that comprise novel means for providing relief images of enhanced resolution. In one aspect the invention provides a method for controlling diffusion of photogenerated acid comprising adding a polar compound to a radiation sensitive composition and applying a layer of the composition to a substrate; exposing the composition layer to activating radiation whereby a latent image is generated comprising a distribution of acid moieties complexed with the polar compound; and treating the exposed composition layer to provide an activating amount of acid.

Abstract translation: 本发明提供了辐射敏感组合物和方法，其包括用于提供增强分辨率的浮雕图像的新型装置。 在一个方面，本发明提供了一种控制光生酸扩散的方法，包括将极性化合物加入到辐射敏感组合物中，并将该组合物的一层施加到基底上; 将组合物层暴露于激活辐射，由此产生包含与极性化合物络合的酸部分的分布的潜像; 并处理暴露的组合物层以提供活化量的酸。