公开(公告)号：US20040224528A1

公开(公告)日：2004-11-11

申请号：US10742424

申请日：2003-12-19

Applicant: Shipley Company, L.L.C.

Inventor： George P. Mirth

IPC: H01L021/31 ,  H01L021/469 ,  H01L021/4763

CPC classification number: G03F7/094 ,  G03F7/11 ,  H01L21/0271 ,  H01L21/0273 ,  H01L21/0337 ,  H01L21/31144 ,  H01L21/312 ,  H01L21/32139

Abstract: A method of manufacturing electronic devices containing one or more layers of materials that are sensitive to the strong chemicals used to remove cross-linked polymeric layers such as photoresists and antireflective coatings is provided. The cross-linked polymeric layers can be easily removed following etching through the use of certain removable layers disposed between the substrate and the cross-linked polymeric layers.

Abstract translation: 提供一种制造电子器件的方法，其包含对用于除去交联聚合物层（例如光致抗蚀剂和抗反射涂层）的强化学品敏感的一层或多层材料。 在通过使用设置在基底和交联聚合物层之间的某些可移除层的蚀刻之后，可以容易地除去交联的聚合物层。