公开(公告)号：US08836177B2

公开(公告)日：2014-09-16

申请号：US13193706

申请日：2011-07-29

Applicant: Seongmin Lee ,  Sangok Park ,  Sangjun Min ,  Kyoungho Yoo ,  Taejin Jung ,  Taemin Ha ,  Seungki Kim

Inventor： Seongmin Lee ,  Sangok Park ,  Sangjun Min ,  Kyoungho Yoo ,  Taejin Jung ,  Taemin Ha ,  Seungki Kim

IPC: H02K41/03 ,  H02K41/035

CPC classification number: G02B7/04 ,  G02B7/023 ,  H02K5/04 ,  H02K41/035 ,  H02K41/0356 ,  H04N5/2252 ,  H04N5/2254 ,  H04N5/44

Abstract: A VCM (voice coil motor) is disclosed, the VCM including: a rotor including a lens-accommodating, both ends opened cylindrical bobbin and a coil block including a coil wound on a periphery of the bobbin; a stator including a cylindrical yoke formed with a lens-exposing opening, a plurality of magnets disposed inside the yoke and opposite to the coil block, and a magnet fixing member disposed inside the yoke to fix the plurality of magnets; and an elastic member elastically supporting the bobbin.

Abstract translation: 公开了一种VCM（音圈马达），该VCM包括：转子，其包括透镜容纳部，两端开口的圆柱形线轴和包括缠绕在线轴的周边的线圈的线圈块; 定子，其包括形成有透镜露出开口的圆柱形磁轭，设置在所述磁轭内并与所述线圈块相对的多个磁体，以及磁体固定部件，其设置在所述磁轭内部以固定所述多个磁体; 以及弹性构件，其弹性地支撑所述筒管。

公开(公告)号：US08378476B2

公开(公告)日：2013-02-19

申请号：US12731870

申请日：2010-03-25

Applicant: SeongMin Lee ,  SeongHun Mun ,  Byung Joon Han

Inventor： SeongMin Lee ,  SeongHun Mun ,  Byung Joon Han

IPC: H01L23/02

CPC classification number: H01L23/49827 ,  H01L23/31 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00

Abstract: A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate having a component side and a system side; coupling a first integrated circuit die on the component side; coupling stacking interconnects on the component side around the first integrated circuit die; forming a package body on the component side, the first integrated circuit die, and the stacking interconnects; forming vertical insertion cavities through the package body and on the stacking interconnects; and forming a trench, in the package body, adjacent to the vertical insertion cavities for reducing a package warping stress.

Abstract translation: 一种集成电路封装系统的制造方法，包括：制造具有元件侧和系统侧的基底封装基板; 在组件侧耦合第一集成电路管芯; 在第一集成电路管芯周围的部件侧耦合堆叠互连; 在组件侧形成封装体，第一集成电路管芯和堆叠互连; 通过封装主体和堆叠互连件形成垂直插入腔; 以及在所述封装体中形成与所述垂直插入腔相邻的沟槽，以减小包装翘曲应力。

公开(公告)号：US08130512B2

公开(公告)日：2012-03-06

申请号：US12273541

申请日：2008-11-18

Applicant: In Sang Yoon ,  SeongMin Lee ,  Sungmin Song

Inventor： In Sang Yoon ,  SeongMin Lee ,  Sungmin Song

IPC: H01R9/00

CPC classification number: H05K1/144 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09709 ,  H05K2201/09972 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of manufacturing an integrated circuit package system including: providing a circuit board having an interconnect thereon; mounting a first device offset on the circuit board; and applying a first encapsulant of a first thickness over the first device, the first encapsulant of a second thickness thinner than the first thickness over the remainder of the circuit board with the interconnect exposed, or a second encapsulant of a third thickness over a second device on an opposite surface of the circuit board and differently offset from the first device.

Abstract translation: 一种制造集成电路封装系统的方法，包括：提供其上具有互连的电路板; 在电路板上安装第一设备偏移; 以及在所述第一装置上施加第一厚度的第一密封剂，所述第一密封剂的第二厚度比所述电路板的剩余部分薄于所述第一厚度，所述第一厚度在所述第一装置上暴露，或者在第二装置上具有第三厚度的第二密封剂 在电路板的相对表面上，并且与第一器件不同地偏移。

公开(公告)号：US20090243072A1

公开(公告)日：2009-10-01

申请号：US12056402

申请日：2008-03-27

Applicant: Jong-Woo Ha ,  Flynn Carson ,  BumJoon Hong ,  SeongMin Lee

Inventor： Jong-Woo Ha ,  Flynn Carson ,  BumJoon Hong ,  SeongMin Lee

IPC: H01L23/538 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked integrated circuit package system includes: providing a base integrated circuit package, and mounting a top integrated circuit package having a top interposer and a top encapsulation with a cavity therein or the cavity as a space between top intra-stack interconnects and the top interposer, with the top interposer exposed by the cavity, over the base integrated circuit package.

Abstract translation: 堆叠集成电路封装系统包括：提供基底集成电路封装，以及安装具有顶部插入件的顶部集成电路封装和其中具有空腔的顶部封装或空腔作为顶部堆叠间互连和顶部插入件之间的空间 ，顶部插入器由腔体暴露在基极集成电路封装上。

公开(公告)号：US07521297B2

公开(公告)日：2009-04-21

申请号：US11276948

申请日：2006-03-17

Applicant: SeongMin Lee ,  SeungYun Ahn ,  Koo Hong Lee

Inventor： SeongMin Lee ,  SeungYun Ahn ,  Koo Hong Lee

IPC: H01L21/00

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A multichip package system is provided forming a substrate having a plurality of molding transfer channel, connecting a first integrated circuit die on a top side of the substrate, connecting a second integrated circuit die on a bottom side of the substrate, and concurrently encapsulating the first integrated circuit die and the second integrated circuit die with a molding compound flow through the plurality of the molding transfer channels.

Abstract translation: 提供了一种多芯片封装系统，其形成具有多个成型传送沟道的基板，将基板的顶侧上的第一集成电路管芯连接，在基板的底侧连接第二集成电路管芯，并且同时封装第一 集成电路管芯和具有模制复合物的第二集成电路管芯流过多个模制传输通道。

公开(公告)号：US20070194423A1

公开(公告)日：2007-08-23

申请号：US11307722

申请日：2006-02-17

Applicant: Choong Bin Yim ,  Sungmin Song ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

Inventor： Choong Bin Yim ,  Sungmin Song ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

IPC: H01L23/02

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/01005 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A stacked integrated circuit package-in-package system is provided forming a first integrated circuit spacer package including a mold compound with a recess provided therein, stacking the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween, and attaching a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.

Abstract translation: 提供一种堆叠式集成电路封装封装系统，其形成第一集成电路间隔件封装，其包括设置在其中的凹部的模具化合物，其中第一集成电路间隔件封装在基板上的集成电路管芯上，凹部位于其间， 以及附接从所述凹部延伸并连接在所述集成电路管芯和所述衬底之间的第一电互连。

公开(公告)号：US09294183B2

公开(公告)日：2016-03-22

申请号：US14352067

申请日：2012-10-16

Applicant: Seongmin Lee ,  Sukho Lee ,  Duckjoong Kim ,  Yongsin Kim ,  Jaeseang Lee ,  Hyungseok Choi ,  Dhongwoon Jang ,  Haehyeon Baek

Inventor： Seongmin Lee ,  Sukho Lee ,  Duckjoong Kim ,  Yongsin Kim ,  Jaeseang Lee ,  Hyungseok Choi ,  Dhongwoon Jang ,  Haehyeon Baek

IPC: H04B7/15 ,  H04B7/14 ,  H04W88/04 ,  H04B7/26 ,  H04W84/18

CPC classification number: H04B7/14 ,  H04B7/2606 ,  H04W84/18 ,  H04W88/04

Abstract: The present invention relates to a distributed transmission and reception system, and an expanded wireless network. The distributed transmission and reception system according to one embodiment of the present invention comprises a distributed transmission system, a distributed reception system, and a distributed relay system. A source signal of a source radio is divided into a plurality of signals through the distributed transmission system, is relayed through an associate's radio, and can be distributed into and transmitted to other networks which are located out of a distance range. A destination radio positioned in another network can restore the original signal of the outgoing radio with the help of relay from the associate's radio via the distributed reception system. The associate's radio providing help in relay amplifies only a part of the source signal, and thus the intensity of the signal can be enhanced. Accordingly, when the outputs of associate's radio providing help in relay are combined, the combined associate's radio function as a high-power radio, and thereby having a greater capability than the original distance range capability. When a distributed transmission system and a distributed reception system operate within one network, a distributed relay system is constructed. The distributed relay system relays a signal arriving at another network to be transmitted to yet another network, thereby consequentially, expanding a wireless network area.

Abstract translation: 本发明涉及分布式发送和接收系统以及扩展无线网络。 根据本发明的一个实施例的分布式发送和接收系统包括分布式传输系统，分布式接收系统和分布式中继系统。 源无线电的源信号通过分布式传输系统被分成多个信号，通过伙伴的无线电中继，并且可以分布到位于距离范围之外的其他网络并传输到其他网络。 位于另一网络中的目的地无线电设备可以借助于来自分组接收系统的无线电伙伴的继电器恢复出站无线电的原始信号。 辅助无线电提供对继电器的帮助仅放大源信号的一部分，从而可以增强信号的强度。 因此，当联合无线电提供有助于继电器的输出被组合时，组合的关联无线电功能作为大功率无线电，从而具有比原始距离范围能力更大的能力。 当分布式传输系统和分布式接收系统在一个网络内工作时，构建分布式中继系统。 分布式中继系统将到达另一网络的信号中继发送到另一个网络，从而相应地扩展无线网络区域。

公开(公告)号：US20120241921A1

公开(公告)日：2012-09-27

申请号：US13071228

申请日：2011-03-24

Applicant: SeongMin Lee ,  Sungmin Song ,  SeongHun Mun

Inventor： SeongMin Lee ,  Sungmin Song ,  SeongHun Mun

IPC: H01L23/488 ,  H01L21/50

CPC classification number: H01L23/3128 ,  H01L23/552 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a bottom substrate; attaching a first integrated circuit die to the bottom substrate; forming an interposer including: forming an intermediate substrate; forming a shield on the intermediate substrate; and applying a wire-in-film adhesive to the shield; and attaching the interposer to the first integrated circuit die with the wire-in-film adhesive.

Abstract translation: 一种集成电路封装系统的制造方法，包括：提供底部基板; 将第一集成电路管芯附接到底部基板; 形成中间层，包括：形成中间基板; 在中间基板上形成屏蔽; 以及将膜线胶粘剂施加到所述护罩上; 以及用所述线内胶粘剂将所述插入件附接到所述第一集成电路模具。

公开(公告)号：US08129832B2

公开(公告)日：2012-03-06

申请号：US11927646

申请日：2007-10-29

Applicant: Flynn Carson ,  In Sang Yoon ,  SeongMin Lee ,  JoHyun Bae

Inventor： Flynn Carson ,  In Sang Yoon ,  SeongMin Lee ,  JoHyun Bae

IPC: H01L23/48

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L24/28 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/078 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A mountable integrated circuit package system includes: providing a carrier; mounting a first integrated circuit device over the carrier; mounting a substrate over the first integrated circuit device with the substrate having a conductor-free recess; connecting a first electrical interconnect under the conductor-free recess electrically connecting the carrier and the first integrated circuit device; and forming a package encapsulation over the carrier, the first integrated circuit device, the first electrical interconnect, the conductor-free recess, and partially exposing the substrate.

Abstract translation: 一种可安装的集成电路封装系统，包括：提供载体; 在载体上安装第一集成电路装置; 将衬底安装在第一集成电路器件上，衬底具有无导体凹槽; 在所述无导体凹部下方连接电连接所述载体和所述第一集成电路器件的第一电互连; 以及在所述载体，所述第一集成电路器件，所述第一电互连，所述无导体凹部以及部分地暴露所述衬底之后形成封装封装。

公开(公告)号：US08124451B2

公开(公告)日：2012-02-28

申请号：US11859359

申请日：2007-09-21

Applicant: Sungmin Song ,  SeongMin Lee ,  WonJun Ko

Inventor： Sungmin Song ,  SeongMin Lee ,  WonJun Ko

IPC: H01L21/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/3185 ,  H01L21/565 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3511 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit packaging system comprising: fabricating an interposer array having an access opening; fabricating a base package substrate sheet; attaching a first integrated circuit die over the base package substrate sheet; mounting the interposer array over the first integrated circuit die; and singulating a base package from the base package substrate sheet and the interposer array by cutting the access opening generally through the center.

Abstract translation: 一种集成电路封装系统，包括：制造具有进入开口的插入器阵列; 制造基底包装基片; 将第一集成电路管芯安装在所述基底封装基板上; 将所述插入器阵列安装在所述第一集成电路管芯上; 以及通过大致穿过所述中心切割所述通路开口，从所述基底封装基板和所述插入器阵列分割基底封装。