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8 条记录 (耗时 0.013 秒)

    System for forming patterns on a multi-curved surface
    1.
    发明授权
    System for forming patterns on a multi-curved surface 有权
    用于在多曲面上形成图案的系统

    公开(公告)号：US07979144B2

    公开(公告)日：2011-07-12

    申请号：US12249642

    申请日：2008-10-10

    申请人： Sankerlingam Rajendran ,  Billy D. Ables

    发明人： Sankerlingam Rajendran ,  Billy D. Ables

    IPC分类号： G06F19/00

    CPC分类号： H01Q15/0013 ,  B23K26/032 ,  B23K26/0823 ,  B23K26/0853 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/36 ,  B23K2103/12 ,  B23K2103/30 ,  B23K2103/50 ,  H01Q1/425

    摘要： According to one embodiment, a pattern forming system includes a patterning tool, a multi-axis robot, and a simulation tool that are coupled to a pattern forming tool that is executed on a suitable computing system. The pattern forming tool receives a contour measurement from the patterning tool and transmits the measured contour to the simulation tool to model the electrical characteristics of a conductive pattern or a dielectric pattern on the measured contour. Upon receipt of the modeled characteristics, the pattern forming system may adjust one or more dimensions of the pattern according to the model, and subsequently create, using the patterning tool, the corrected pattern on the surface.

    摘要翻译： 根据一个实施例，图案形成系统包括图案化工具，多轴机器人和耦合到在合适的计算系统上执行的图案形成工具的模拟工具。 图案形成工具从图案形成工具接收轮廓测量，并将所测量的轮廓传送到模拟工具，以模拟测量轮廓上的导电图案或电介质图案的电特性。 在接收到建模的特征时，图案形成系统可以根据模型调整图案的一个或多个尺寸，并且随后使用图案形成工具在表面上产生校正图案。

    Solid hermetic via and bump fabrication
    2.
    发明授权
    Solid hermetic via and bump fabrication 有权
    坚固的气密通孔和凸块制造

    公开(公告)号：US06583058B1

    公开(公告)日：2003-06-24

    申请号：US09326215

    申请日：1999-06-04

    申请人： Sankerlingam Rajendran ,  Rajiv S. Shah ,  Van T. Vo

    发明人： Sankerlingam Rajendran ,  Rajiv S. Shah ,  Van T. Vo

    IPC分类号： H01L2144

    CPC分类号： H01L24/12 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/11 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2924/00

    摘要： A method of forming an electrically conductive via with bumps on both sides of a substrate wherein there is provided a substrate having a pair of opposing surfaces and a via extending between the opposing surfaces. A layer of a material capable of forming a seed for receiving thereon a plating material is provided on one of the surfaces extending to the via. The structure is then placed into an electroplating bath, preferably gold-containing, to electroplate the walls of the via. The electroplated material is then heated to a temperature above its flow or melting temperature in a reducing atmosphere for a time sufficient to cause the electroplated material to fill the via and any voids within the via. The step of heating the electroplated material is preferably to a temperature at least 10 degrees C. above its flow or melting temperature of the electroplated material. The reducing atmosphere is from about 5 percent to 100 percent hydrogen and the remainder preferably nitrogen. The step of electroplating can include electroplating of sufficient electroplated material in the via to provide a bump on at least one of the surfaces heating.

    摘要翻译： 在衬底的两侧形成具有凸起的导电通孔的方法，其中提供了具有一对相对表面的衬底和在相对表面之间延伸的通孔。 在延伸到通孔的一个表面上提供能够形成用于接收电镀材料的种子的材料层。 然后将该结构放置在电镀浴中，优选含金，以电镀通孔的壁。 然后将电镀材料在还原气氛中加热至高于其流动或熔融温度的温度足以使电镀材料填充通孔和通孔内的任何空隙的时间。 加热电镀材料的步骤优选至高于其电镀材料的流动或熔化温度至少10摄氏度的温度。 还原气氛为约5％至100％的氢气，其余为氮气。 电镀步骤可以包括在通孔中电镀足够的电镀材料，以在加热的至少一个表面上提供凸块。

    Wet-tip die for EFG cyrstal growth apparatus
    3.
    发明授权
    Wet-tip die for EFG cyrstal growth apparatus 失效
    用于EFG胰岛生长装置的湿尖模具

    公开(公告)号：US5102494A

    公开(公告)日：1992-04-07

    申请号：US670279

    申请日：1991-03-15

    申请人： David S. Harvey ,  Dana L. Winchester ,  Brian H. Mackintosh ,  Sankerlingam Rajendran

    发明人： David S. Harvey ,  Dana L. Winchester ,  Brian H. Mackintosh ,  Sankerlingam Rajendran

    IPC分类号： C30B15/34

    CPC分类号： C30B15/34 ,  Y10T117/104

    摘要： A novel capillary die and crystal growing method are provided for growing a hollow crystalline body by EFG. Inner and outer annular moats surround the die tip. Passageways are provided for supplying melt to those moats from a crucible, so that melt in said moats will wet and cover the inner and outer exterior surfaces of the die tip during growth of a hollow crystalline body. The novel die may be constructed so as to have a lower die tip and a shorter capillary than EFG dies heretofore used to successfully grow hollow bodies. The die design facilitates keeping the temperature of the die tip substantially uniform about its circumference, thereby improving the uniformity of thickness of the wall of the crystalline body grown from a film of melt on the die tip. The moats reduce the likelihood of the growth process being interrupted or adversely affected by flooding of the die. In the event the growth meniscus breaks, liquid silicon is captured in the moats, thereby preventing or reducing the likelihood of flooding of the die and associated growth apparatus.

    摘要翻译： 提供了一种新颖的毛细管模头和晶体生长方法，用于通过EFG生长中空晶体。 内外环形护城河环绕模头。 通道设置用于从坩埚向这些护城河供应熔体，使得在中空结晶体的生长期间，所述护城河中的熔体将湿润并覆盖模头顶部的内外表面。 新颖的模具可以构造成具有比迄今为止用于成功生长中空体的EFG模具更低的模头和更短的毛细管。 模具设计有利于保持模头尖端的温度在其周边上基本均匀，从而提高从模头上的熔体膜生长的结晶体的壁厚度的均匀性。 护城河减少了生长过程被模具淹水中断或不利影响的可能性。 在生长半月板破裂的情况下，液态硅被捕获在护城河中，从而防止或降低了模具和相关生长装置的淹水的可能性。

    Wet-tip die for EFG crystal growth apparatus
    5.
    发明授权
    Wet-tip die for EFG crystal growth apparatus 失效
    用于EFG晶体生长装置的湿尖模具

    公开(公告)号：US5037622A

    公开(公告)日：1991-08-06

    申请号：US553903

    申请日：1990-07-13

    申请人： David S. Harvey ,  Dana L. Winchester ,  Brian H. Mackintosh ,  Sankerlingam Rajendran

    发明人： David S. Harvey ,  Dana L. Winchester ,  Brian H. Mackintosh ,  Sankerlingam Rajendran

    IPC分类号： C30B15/34 ,  H01L21/208

    CPC分类号： C30B15/34 ,  Y10T117/104 ,  Y10T117/1052

    摘要： A novel capillary die and crystal growing method are provided for growing a hollow crystalline body by EFG. Inner and outer annular moats surround the die tip. Passageways are provided for supplying melt to those moats from a crucible, so that melt in said moats will wet and cover the inner and outer exterior surfaces of the die tip during growth of a hollow crystalline body. The novel die may be constructed so as to have a lower die tip and a shorter capillary than EFG dies heretofore used to successfully grow hollow bodies. The die design facilitates keeping the temperature of the die tip substantially uniform about its circumference, thereby improving the uniformity of thickness of the wall of the crystalline body grown from a film of melt on the die tip. The moats reduce the likelihood of the growth process being interrupted or adversely affected by flooding of the die. In the event the growth meniscus breaks, liquid silicon is captured in the moats, thereby preventing or reducing the likelihood of flooding of the die and associated growth apparatus.

    摘要翻译： 提供了一种新颖的毛细管模头和晶体生长方法，用于通过EFG生长中空晶体。 内外环形护城河环绕模头。 通道设置用于从坩埚向这些护城河供应熔体，使得在中空结晶体的生长期间，所述护城河中的熔体将湿润并覆盖模头顶部的内外表面。 新颖的模具可以构造成具有比迄今为止用于成功生长中空体的EFG模具更低的模头和更短的毛细管。 模具设计有利于保持模头尖端的温度在其周边上基本均匀，从而提高从模头上的熔体膜生长的结晶体的壁厚度的均匀性。 护城河减少了生长过程被模具淹水中断或不利影响的可能性。 在生长半月板破裂的情况下，液态硅被捕获在护城河中，从而防止或降低了模具和相关生长装置的淹水的可能性。

    System for Forming Patterns on a Multi-Curved Surface
    7.
    发明申请
    System for Forming Patterns on a Multi-Curved Surface 有权
    在多曲面上形成图案的系统

    公开(公告)号：US20090110265A1

    公开(公告)日：2009-04-30

    申请号：US12249642

    申请日：2008-10-10

    申请人： Sankerlingam Rajendran ,  Billy D. Ables

    发明人： Sankerlingam Rajendran ,  Billy D. Ables

    IPC分类号： G06K9/00

    CPC分类号： H01Q15/0013 ,  B23K26/032 ,  B23K26/0823 ,  B23K26/0853 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/36 ,  B23K2103/12 ,  B23K2103/30 ,  B23K2103/50 ,  H01Q1/425

    摘要： According to one embodiment, a pattern forming system includes a patterning tool, a multi-axis robot, and a simulation tool that are coupled to a pattern forming tool that is executed on a suitable computing system. The pattern forming tool receives a contour measurement from the patterning tool and transmits the measured contour to the simulation tool to model the electrical characteristics of a conductive pattern or a dielectric pattern on the measured contour. Upon receipt of the modeled characteristics, the pattern forming system may adjust one or more dimensions of the pattern according to the model, and subsequently create, using the patterning tool, the corrected pattern on the surface.

    摘要翻译： 根据一个实施例，图案形成系统包括图案化工具，多轴机器人和耦合到在合适的计算系统上执行的图案形成工具的模拟工具。 图案形成工具从图案形成工具接收轮廓测量，并将所测量的轮廓传送到模拟工具，以模拟测量轮廓上的导电图案或电介质图案的电特性。 在接收到建模的特征时，图案形成系统可以根据模型调整图案的一个或多个尺寸，并且随后使用图案形成工具在表面上产生校正图案。