-
公开(公告)号：US07063083B2
公开(公告)日：2006-06-20
申请号：US11183828
申请日：2005-07-19
申请人： Naoki Ohmiya , Yusuke Nagai , Masaru Nakamura
发明人： Naoki Ohmiya , Yusuke Nagai , Masaru Nakamura
CPC分类号： B28D5/0052 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/50 , B28D5/0011 , B28D5/0023 , Y10T225/325
摘要： A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed on the front surface in a lattice pattern, along the dividing lines, comprising: a tape affixing step for affixing a protective tape to one surface side of the wafer; a holding step for positioning a first suction-holding member and a second suction-holding member on both sides of a dividing line and suction-holding the wafer on the first suction-holding member and the second suction-holding member through the protective tape; and a dividing step for moving the first suction-holding member and the second suction-holding member in a direction for separating them from each other to exert tensile force in a direction perpendicular to the dividing line.
摘要翻译： 沿着分割线沿着形成在前表面上的多个分割线以强度减小的晶片以格子图案分割晶片的方法，包括：用于将保护带固定到晶片的一个表面侧的带固定步骤; 保持步骤，用于在分隔线的两侧定位第一吸持保持构件和第二吸持保持构件，并且通过保护带将第一吸引保持构件和第二吸持保持构件上的晶片吸持保持; 以及分割步骤，用于使第一吸持保持部件和第二吸持保持部件沿彼此分离的方向移动，以在与分割线垂直的方向上施加张力。
-
公开(公告)号：US20050170613A1
公开(公告)日：2005-08-04
申请号：US11047585
申请日：2005-02-02
IPC分类号： B23K26/00 , B23K26/40 , B23K101/40 , B28D5/00 , H01L21/301 , H01L21/46 , H01L21/68 , H01L21/78 , H05K3/00
CPC分类号： H01L21/6836 , B23K26/40 , B23K26/57 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B28D5/0052 , H01L21/78 , H01L2221/68327
摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, comprising: a frame holding step for affixing the back surface of the wafer to a dicing tape mounted on an annular frame; a deteriorated layer forming step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines, from the side of the front surface of the wafer held on the frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a picking up step for picking up each chip from the expanded dicing tape.
摘要翻译： 沿着分割线划分具有由在前表面上以格子图案形成的分割线划分的区域中形成的功能元件的晶片的方法，包括：框架保持步骤，用于将晶片的背面固定到切割带 安装在环形框架上; 劣化层形成步骤，用于通过从晶片的前表面侧沿分割线施加能够穿过晶片的脉冲激光束沿晶片内部的分割线形成劣化层; 在框架上举行 分割步骤，通过沿着由保持在框架上的晶片形成劣化层的分割线施加外力，沿着分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及用于从扩展的切割胶带拾取每个芯片的拾取步骤。
-
公开(公告)号：US07557904B2
公开(公告)日：2009-07-07
申请号：US11360814
申请日：2006-02-24
申请人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
发明人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
CPC分类号： G03F7/707 , B23K26/40 , B23K37/0408 , B23K2101/40 , B23K2103/50 , B25B11/005 , B28D5/0094 , H01L21/6838
摘要： A wafer holding mechanism for holding a wafer affixed to a frame with a tape utilizing a suction force. The wafer holding mechanism includes a suction body, a wafer holder with a holding surface for holding the wafer via the tape, and a suction unit with a suction portion disposed at an outer peripheral edge of the wafer holder. The suction portion transmits a suction force across the holding surface though the outer peripheral edge of the wafer holder such that when the suction portion is covered and sealed by the tape, the wafer holder is held at the suction unit and the wafer is held at the holding surface.
摘要翻译： 一种晶片保持机构，用于利用吸力将带有胶带的胶片固定在框架上。 晶片保持机构包括抽吸体，具有用于通过带保持晶片的保持表面的晶片保持器和具有设置在晶片保持器的外周边缘处的抽吸部分的抽吸单元。 抽吸部分穿过保持表面穿过晶片保持器的外周边缘传递吸力，使得当吸引部分被带覆盖和密封时，晶片保持器被保持在抽吸单元处，并且晶片保持在 保持表面。
-
公开(公告)号：US20060180136A1
公开(公告)日：2006-08-17
申请号：US11091404
申请日：2005-03-29
申请人： Yusuke Nagai , Naoki Ohmiya , Kentaro Iizuka
发明人： Yusuke Nagai , Naoki Ohmiya , Kentaro Iizuka
IPC分类号： H01L21/687
CPC分类号： H01L21/67132
摘要： A tape expansion apparatus for expanding a holding tape, which is mounted on an annular frame and to which a wafer having a plurality of areas sectioned by a plurality of dividing lines is affixed, comprising a frame holding means for holding the annular frame; a plurality of tape holding means for nipping an area between the inner periphery of the annular frame and the wafer of the holding tape mounted on the annular frame held on the frame holding means; and a tape expansion means for moving the plurality of tape holding means in radial directions.
摘要翻译： 一种用于扩展固定带的带扩张装置，该固定带安装在环形框架上，并且具有由多个划分线分割的多个区域的晶片固定到该固定带上，包括用于保持环形框架的框架保持装置; 用于夹持环形框架的内周和安装在保持在框架保持装置上的环形框架上的保持带的晶片之间的区域的多个带子保持装置; 以及用于沿径向方向移动多个带固定装置的带子扩展装置。
-
5.发明申请公开(公告)号：US20060030129A1
公开(公告)日：2006-02-09
申请号：US11190966
申请日：2005-07-28
申请人： Naoki Ohmiya , Kentaro Iizuka , Yusuke Nagai
发明人： Naoki Ohmiya , Kentaro Iizuka , Yusuke Nagai
IPC分类号： H01L21/78
CPC分类号： H01L21/67132 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , H01L21/6835 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2924/3512
摘要： A method of dividing an adhesive film mounted on the back surface of a wafer having a plurality of streets formed on the front surface in a lattice pattern and function elements formed in a plurality of areas sectioned by the plurality of streets, along the streets in a state where the wafer is put on the surface of a protective tape mounted on an annular frame, wherein the adhesive film is cooled and the protective tape is expanded to divide the adhesive film along the peripheries of the function elements.
摘要翻译： 将安装在具有在前表面上形成的多个街道的晶片的背面上的粘合膜分割成格子图案的方法和形成在由多个街道分割的多个区域中的功能元件沿着街道 其中晶片被放置在安装在环形框架上的保护带的表面上，其中粘合剂膜被冷却并且保护带被扩张以沿着功能元件的周边划分粘合剂膜。
-
公开(公告)号：US20050170616A1
公开(公告)日：2005-08-04
申请号：US11047619
申请日：2005-02-02
IPC分类号： H01L21/304 , H01L21/306 , H01L21/78 , H01L21/301 , H01L21/46
CPC分类号： H01L21/3043 , H01L21/30625 , H01L21/78 , H01L2221/68336
摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, which comprises: a protective member affixing step for affixing a protective member to the front surface of the wafer; a polishing step for polishing the back surface of the wafer having the protective member affixed to the front surface; a deteriorated layer formation step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines from the polished back surface side of the wafer; a frame holding step for affixing the back surface of the wafer in which the deteriorated layers have been formed along the dividing lines, to a dicing tape mounted on an annular frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed, of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a pick up step for picking up the chips from the stretched dicing tape.
摘要翻译： 沿着划分线划分具有由在前表面上形成为格子图案的分割线划分的区域中形成的功能元件的晶片的方法，该方法包括：保护构件固定步骤，用于将保护构件固定到 晶圆; 抛光步骤，用于抛光具有固定到前表面的保护构件的晶片的背面; 劣化层形成步骤，通过沿晶片的抛光后表面侧沿分割线施加能够穿过晶片的脉冲激光束，沿着晶片内部的分割线形成劣化层; 用于将已经形成有劣化层的晶片的背面沿分割线固定到安装在环形框架上的切割带的框架保持步骤; 分割步骤，通过沿保持在框架上的晶片沿已经形成有劣化层的划分线施加外力沿分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及从拉伸的切割胶带拾取芯片的拾取步骤。
-
公开(公告)号：US20050009307A1
公开(公告)日：2005-01-13
申请号：US10876519
申请日：2004-06-28
IPC分类号： B23K26/00 , B23K26/04 , B23K26/08 , B23K26/36 , B23K101/40 , C30B1/00 , H01L21/02 , H01L21/20 , H01L21/301 , H01L21/302 , H01L21/304 , H01L21/3105 , H01L21/311 , H01L21/321 , H01L21/3213 , H01L21/68 , H01L23/544 , H05K3/02
CPC分类号： B23K26/0861 , B23K26/04 , H01L21/31105 , H01L21/32131 , H01L23/544 , H01L2223/54453 , H01L2223/5446 , H01L2924/0002 , H01L2924/00
摘要： A laser beam processing method for a semiconductor wafer having a low-dielectric insulating film formed on the front surface of a semiconductor substrate, a plurality of circuits sectioned by streets formed in a lattice pattern, and metal patterns for testing partially formed on each street, comprising: a laser beam processing step for applying a laser beam to the positions of the areas at which the metal patterns are located and the area of the low-dielectric insulating film under different processing conditions to remove the metal patterns and the low-dielectric insulating film.
摘要翻译： 一种用于半导体晶片的激光束处理方法，该半导体晶片具有形成在半导体衬底的前表面上的低介电绝缘膜，由格子图案形成的街道划分的多个电路以及部分地形成在每个街道上的用于测试的金属图案， 包括：激光束处理步骤，用于在不同的处理条件下将激光束施加到金属图案所在的区域的位置和低介电常数绝缘膜的面积以去除金属图案和低介电绝缘体 电影。
-
公开(公告)号：US07602071B2
公开(公告)日：2009-10-13
申请号：US11190966
申请日：2005-07-28
申请人： Naoki Ohmiya , Kentaro Iizuka , Yusuke Nagai
发明人： Naoki Ohmiya , Kentaro Iizuka , Yusuke Nagai
IPC分类号： H01L23/28
CPC分类号： H01L21/67132 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , H01L21/6835 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2924/3512
摘要： A method of dividing an adhesive film mounted on the back surface of a wafer having a plurality of streets formed on the front surface in a lattice pattern and function elements formed in a plurality of areas sectioned by the plurality of streets, along the streets in a state where the wafer is put on the surface of a protective tape mounted on an annular frame, wherein the adhesive film is cooled and the protective tape is expanded to divide the adhesive film along the peripheries of the function elements.
摘要翻译： 将安装在具有在前表面上形成的多个街道的晶片的背面上的粘合膜分割成格子图案的方法和形成在由多个街道分割的多个区域中的功能元件沿着街道 其中晶片被放置在安装在环形框架上的保护带的表面上，其中粘合剂膜被冷却并且保护带被扩张以沿着功能元件的周边划分粘合剂膜。
-
公开(公告)号：US6010396A
公开(公告)日：2000-01-04
申请号：US118061
申请日：1998-07-17
申请人： Naoki Ohmiya
发明人： Naoki Ohmiya
CPC分类号： B23D59/001 , B24B27/0683 , B24B55/04 , B28D5/0076 , B28D5/022
摘要： Disclosed is a blade cover in a cutting apparatus comprising a chuck table for holding a workpiece to be cut and cutting means for cutting the workpiece, which comprises a spindle having a rotary blade detachably attached thereto and a spindle housing for rotatably holding the spindle. The blade cover is fixed to the spindle housing on its front side, and it comprises: a rear nozzle assembly for flushing water to the rotary blade on its rear side; a front nozzle assembly for flushing water to the rotary blade on its front side; and blade detecting means for detecting the condition of the rotary blade. The front nozzle assembly is adapted to be put selectively in operative or inoperative position, and the blade detecting means is adapted to be put selectively in operative or inoperative position in unison with the front nozzle assembly. With this arrangement the rotary blade can be changed readily.
摘要翻译： 公开了一种切割装置中的刀片盖，包括用于保持要切割的工件的卡盘台和用于切割工件的切割装置，该切割装置包括具有可拆卸地附接到其上的旋转刀片的主轴和用于可旋转地保持主轴的主轴壳体。 刀片盖在其前侧固定到主轴壳体，它包括：后喷嘴组件，用于将水冲入其后侧的旋转叶片; 前喷嘴组件，用于将水冲入其前侧的旋转叶片; 以及用于检测旋转叶片的状况的叶片检测装置。 前喷嘴组件适于选择性地放置在操作或不工作的位置，并且叶片检测装置适于与前喷嘴组件一致地选择性地放置在操作或非操作位置。 通过这种布置，可以容易地改变旋转刀片。
-
公开(公告)号：US07179722B2
公开(公告)日：2007-02-20
申请号：US11047619
申请日：2005-02-02
IPC分类号： H01L21/301
CPC分类号： H01L21/3043 , H01L21/30625 , H01L21/78 , H01L2221/68336
摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, which comprises: a protective member affixing step for affixing a protective member to the front surface of the wafer; a polishing step for polishing the back surface of the wafer having the protective member affixed to the front surface; a deteriorated layer formation step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines from the polished back surface side of the wafer; a frame holding step for affixing the back surface of the wafer in which the deteriorated layers have been formed along the dividing lines, to a dicing tape mounted on an annular frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed, of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a pick up step for picking up the chips from the stretched dicing tape.
摘要翻译： 沿着划分线划分具有由在前表面上形成为格子图案的分割线划分的区域中形成的功能元件的晶片的方法，该方法包括：保护构件固定步骤，用于将保护构件固定到 晶圆; 抛光步骤，用于抛光具有固定到前表面的保护构件的晶片的背面; 劣化层形成步骤，通过沿晶片的抛光后表面侧沿分割线施加能够穿过晶片的脉冲激光束，沿着晶片内部的分割线形成劣化层; 用于将已经形成有劣化层的晶片的背面沿分割线固定到安装在环形框架上的切割带的框架保持步骤; 分割步骤，通过沿保持在框架上的晶片沿已经形成有劣化层的划分线施加外力沿分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及从拉伸的切割胶带拾取芯片的拾取步骤。
-
-
-
-
-
-
-
-
-
搜索结果
15 条记录 (耗时 0.015 秒)
