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    Tape expansion apparatus
    2.
    发明申请
    Tape expansion apparatus 审中-公开
    磁带扩展装置

    公开(公告)号：US20060180136A1

    公开(公告)日：2006-08-17

    申请号：US11091404

    申请日：2005-03-29

    申请人： Yusuke Nagai ,  Naoki Ohmiya ,  Kentaro Iizuka

    发明人： Yusuke Nagai ,  Naoki Ohmiya ,  Kentaro Iizuka

    IPC分类号： H01L21/687

    CPC分类号： H01L21/67132

    摘要： A tape expansion apparatus for expanding a holding tape, which is mounted on an annular frame and to which a wafer having a plurality of areas sectioned by a plurality of dividing lines is affixed, comprising a frame holding means for holding the annular frame; a plurality of tape holding means for nipping an area between the inner periphery of the annular frame and the wafer of the holding tape mounted on the annular frame held on the frame holding means; and a tape expansion means for moving the plurality of tape holding means in radial directions.

    摘要翻译： 一种用于扩展固定带的带扩张装置，该固定带安装在环形框架上，并且具有由多个划分线分割的多个区域的晶片固定到该固定带上，包括用于保持环形框架的框架保持装置; 用于夹持环形框架的内周和安装在保持在框架保持装置上的环形框架上的保持带的晶片之间的区域的多个带子保持装置; 以及用于沿径向方向移动多个带固定装置的带子扩展装置。

    Wafer dividing method
    4.
    发明授权
    Wafer dividing method 有权
    晶圆分割法

    公开(公告)号：US07179722B2

    公开(公告)日：2007-02-20

    申请号：US11047619

    申请日：2005-02-02

    申请人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

    发明人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

    IPC分类号： H01L21/301

    CPC分类号： H01L21/3043 ,  H01L21/30625 ,  H01L21/78 ,  H01L2221/68336

    摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, which comprises: a protective member affixing step for affixing a protective member to the front surface of the wafer; a polishing step for polishing the back surface of the wafer having the protective member affixed to the front surface; a deteriorated layer formation step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines from the polished back surface side of the wafer; a frame holding step for affixing the back surface of the wafer in which the deteriorated layers have been formed along the dividing lines, to a dicing tape mounted on an annular frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed, of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a pick up step for picking up the chips from the stretched dicing tape.

    摘要翻译： 沿着划分线划分具有由在前表面上形成为格子图案的分割线划分的区域中形成的功能元件的晶片的方法，该方法包括：保护构件固定步骤，用于将保护构件固定到 晶圆; 抛光步骤，用于抛光具有固定到前表面的保护构件的晶片的背面; 劣化层形成步骤，通过沿晶片的抛光后表面侧沿分割线施加能够穿过晶片的脉冲激光束，沿着晶片内部的分割线形成劣化层; 用于将已经形成有劣化层的晶片的背面沿分割线固定到安装在环形框架上的切割带的框架保持步骤; 分割步骤，通过沿保持在框架上的晶片沿已经形成有劣化层的划分线施加外力沿分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及从拉伸的切割胶带拾取芯片的拾取步骤。

    Wafer dividing method
    5.
    发明申请
    Wafer dividing method 有权
    晶圆分割法

    公开(公告)号：US20050170616A1

    公开(公告)日：2005-08-04

    申请号：US11047619

    申请日：2005-02-02

    申请人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

    发明人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

    IPC分类号： H01L21/304 ,  H01L21/306 ,  H01L21/78 ,  H01L21/301 ,  H01L21/46

    CPC分类号： H01L21/3043 ,  H01L21/30625 ,  H01L21/78 ,  H01L2221/68336

    摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, which comprises: a protective member affixing step for affixing a protective member to the front surface of the wafer; a polishing step for polishing the back surface of the wafer having the protective member affixed to the front surface; a deteriorated layer formation step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines from the polished back surface side of the wafer; a frame holding step for affixing the back surface of the wafer in which the deteriorated layers have been formed along the dividing lines, to a dicing tape mounted on an annular frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed, of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a pick up step for picking up the chips from the stretched dicing tape.

    摘要翻译： 沿着划分线划分具有由在前表面上形成为格子图案的分割线划分的区域中形成的功能元件的晶片的方法，该方法包括：保护构件固定步骤，用于将保护构件固定到 晶圆; 抛光步骤，用于抛光具有固定到前表面的保护构件的晶片的背面; 劣化层形成步骤，通过沿晶片的抛光后表面侧沿分割线施加能够穿过晶片的脉冲激光束，沿着晶片内部的分割线形成劣化层; 用于将已经形成有劣化层的晶片的背面沿分割线固定到安装在环形框架上的切割带的框架保持步骤; 分割步骤，通过沿保持在框架上的晶片沿已经形成有劣化层的划分线施加外力沿分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及从拉伸的切割胶带拾取芯片的拾取步骤。

    Wafer dividing method and apparatus
    6.
    发明授权
    Wafer dividing method and apparatus 有权
    晶圆分割方法和装置

    公开(公告)号：US07063083B2

    公开(公告)日：2006-06-20

    申请号：US11183828

    申请日：2005-07-19

    申请人： Naoki Ohmiya ,  Yusuke Nagai ,  Masaru Nakamura

    发明人： Naoki Ohmiya ,  Yusuke Nagai ,  Masaru Nakamura

    IPC分类号： B28D1/00 ,  B26F3/00

    CPC分类号： B28D5/0052 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0023 ,  Y10T225/325

    摘要： A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed on the front surface in a lattice pattern, along the dividing lines, comprising: a tape affixing step for affixing a protective tape to one surface side of the wafer; a holding step for positioning a first suction-holding member and a second suction-holding member on both sides of a dividing line and suction-holding the wafer on the first suction-holding member and the second suction-holding member through the protective tape; and a dividing step for moving the first suction-holding member and the second suction-holding member in a direction for separating them from each other to exert tensile force in a direction perpendicular to the dividing line.

    摘要翻译： 沿着分割线沿着形成在前表面上的多个分割线以强度减小的晶片以格子图案分割晶片的方法，包括：用于将保护带固定到晶片的一个表面侧的带固定步骤; 保持步骤，用于在分隔线的两侧定位第一吸持保持构件和第二吸持保持构件，并且通过保护带将第一吸引保持构件和第二吸持保持构件上的晶片吸持保持; 以及分割步骤，用于使第一吸持保持部件和第二吸持保持部件沿彼此分离的方向移动，以在与分割线垂直的方向上施加张力。

    Wafer dividing method
    7.
    发明申请
    Wafer dividing method 有权
    晶圆分割法

    公开(公告)号：US20050170613A1

    公开(公告)日：2005-08-04

    申请号：US11047585

    申请日：2005-02-02

    申请人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

    发明人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

    IPC分类号： B23K26/00 ,  B23K26/40 ,  B23K101/40 ,  B28D5/00 ,  H01L21/301 ,  H01L21/46 ,  H01L21/68 ,  H01L21/78 ,  H05K3/00

    CPC分类号： H01L21/6836 ,  B23K26/40 ,  B23K26/57 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052 ,  H01L21/78 ,  H01L2221/68327

    摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, comprising: a frame holding step for affixing the back surface of the wafer to a dicing tape mounted on an annular frame; a deteriorated layer forming step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines, from the side of the front surface of the wafer held on the frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a picking up step for picking up each chip from the expanded dicing tape.

    摘要翻译： 沿着分割线划分具有由在前表面上以格子图案形成的分割线划分的区域中形成的功能元件的晶片的方法，包括：框架保持步骤，用于将晶片的背面固定到切割带 安装在环形框架上; 劣化层形成步骤，用于通过从晶片的前表面侧沿分割线施加能够穿过晶片的脉冲激光束沿晶片内部的分割线形成劣化层; 在框架上举行 分割步骤，通过沿着由保持在框架上的晶片形成劣化层的分割线施加外力，沿着分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及用于从扩展的切割胶带拾取每个芯片的拾取步骤。

    Wafer dividing method
    8.
    发明授权
    Wafer dividing method 有权
    晶圆分割法

    公开(公告)号：US07449396B2

    公开(公告)日：2008-11-11

    申请号：US11047585

    申请日：2005-02-02

    申请人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

    发明人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

    IPC分类号： H01L21/301

    CPC分类号： H01L21/6836 ,  B23K26/40 ,  B23K26/57 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052 ,  H01L21/78 ,  H01L2221/68327

    摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, comprising: a frame holding step for affixing the back surface of the wafer to a dicing tape mounted on an annular frame; a deteriorated layer forming step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines, from the side of the front surface of the wafer held on the frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a picking up step for picking up each chip from the expanded dicing tape.

    摘要翻译： 沿着分割线划分具有由在前表面上以格子图案形成的分割线划分的区域中形成的功能元件的晶片的方法，包括：框架保持步骤，用于将晶片的背面固定到切割带 安装在环形框架上; 劣化层形成步骤，用于通过从晶片的前表面侧沿分割线施加能够穿过晶片的脉冲激光束沿晶片内部的分割线形成劣化层; 在框架上举行 分割步骤，通过沿着由保持在框架上的晶片形成劣化层的分割线施加外力，沿着分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及用于从扩展的切割胶带拾取每个芯片的拾取步骤。

    Wafer dividing method and apparatus
    9.
    发明申请
    Wafer dividing method and apparatus 有权

    公开(公告)号：US20060016443A1

    公开(公告)日：2006-01-26

    申请号：US11183828

    申请日：2005-07-19

    申请人： Naoki Ohmiya ,  Yusuke Nagai ,  Masaru Nakamura

    发明人： Naoki Ohmiya ,  Yusuke Nagai ,  Masaru Nakamura

    IPC分类号： B28D1/02

    CPC分类号： B28D5/0052 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0023 ,  Y10T225/325

    摘要： A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed on the front surface in a lattice pattern, along the dividing lines, comprising: a tape affixing step for affixing a protective tape to one surface side of the wafer; a holding step for positioning a first suction-holding member and a second suction-holding member on both sides of a dividing line and suction-holding the wafer on the first suction-holding member and the second suction-holding member through the protective tape; and a dividing step for moving the first suction-holding member and the second suction-holding member in a direction for separating them from each other to exert tensile force in a direction perpendicular to the dividing line.

    Wafer dividing method
    10.
    发明申请
    Wafer dividing method 审中-公开
    晶圆分割法

    公开(公告)号：US20060084239A1

    公开(公告)日：2006-04-20

    申请号：US11246103

    申请日：2005-10-11

    申请人： Yusuke Nagai ,  Kentaro Iizuka

    发明人： Yusuke Nagai ,  Kentaro Iizuka

    IPC分类号： H01L21/78 ,  H01L21/301

    CPC分类号： H01L21/6835 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68336

    摘要： A method of dividing a wafer having a plurality of dividing lines formed in a lattice pattern on the front surface, into individual chips along the dividing lines, the method comprising: a deteriorated layer forming step for forming a deteriorated layer in the inside of the wafer by applying a laser beam capable of passing through the wafer along the dividing lines; a wafer supporting step for putting one surface side of the wafer on a support tape which is mounted on an annular frame and shrinks by an external stimulus; a wafer-dividing step for dividing the wafer along the dividing lines where the deteriorated layer has been formed by exerting external force to the wafer which has been put on the support tape; and a chip spacing formation step for shrinking the shrink area between the inner periphery of the annular frame and the area, to which the wafer is affixed, in the support tape affixed to the divided wafer, by exerting an external stimulus to the shrink area.

    摘要翻译： 一种将沿着分割线将具有以格状图案形成的多个分割线的晶片分割为分割线的各个芯片的方法，该方法包括：劣化层形成步骤，用于在晶片内部形成劣化层 通过施加能够沿分割线穿过晶片的激光束; 用于将晶片的一个表面侧放置在安装在环形框架上并通过外部刺激收缩的支撑带上的晶片支撑步骤; 晶片分割步骤，用于通过对已经放置在支撑带上的晶片施加外力沿着已经形成有劣化层的分割线分割晶片; 以及芯片间隔形成步骤，用于通过向收缩区域施加外部刺激，将环形框架的内周边和晶片固定到的区域之间的收缩区域收缩在固定到分割晶片的支撑带中。