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公开(公告)号：US08425222B2
公开(公告)日：2013-04-23
申请号：US13202764
申请日：2010-02-04
IPC分类号： B29C45/33
CPC分类号： B29C45/36 , B29C45/561 , B29C2045/5645 , B29L2011/00 , B29L2011/0016
摘要： Taper portions 151 and 161 are provided in the cavity of a stationary side die 110 and the cavity of a movable side die 120 in an injection molding apparatus, respectively, and a floating mechanism 170 is provided so that one taper portions are able to freely follows the other taper portions while die clamping. This configuration makes it possible to correct axial misalignment in each of the cavities.
摘要翻译： 锥形部分151和161分别设置在固定侧模具110的空腔中，分别设置在注射成型设备中的可移动侧模具120的空腔中，并且浮动机构170设置成使得一个锥形部分能够自由地跟随 其他锥形部分同时夹紧。 这种构造使得可以校正每个空腔中的轴向未对准。
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公开(公告)号：US20120040044A1
公开(公告)日：2012-02-16
申请号：US13202764
申请日：2010-02-04
IPC分类号： B29C45/36
CPC分类号： B29C45/36 , B29C45/561 , B29C2045/5645 , B29L2011/00 , B29L2011/0016
摘要： Taper portions 151 and 161 are provided in the cavity of a stationary side die 110 and the cavity of a movable side die 120 in an injection molding apparatus, respectively, and a floating mechanism 170 is provided so that one taper portions are able to freely follows the other taper portions while die clamping. This configuration makes it possible to correct axial misalignment in each of the cavities.
摘要翻译： 锥形部分151和161分别设置在固定侧模具110的空腔中，分别设置在注射成型设备中的可移动侧模具120的空腔中，并且浮动机构170设置成使得一个锥形部分能够自由地跟随 其他锥形部分同时夹紧。 这种构造使得可以校正每个空腔中的轴向未对准。
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公开(公告)号：US07522355B2
公开(公告)日：2009-04-21
申请号：US11091290
申请日：2005-03-28
CPC分类号： G02B7/021 , B29C65/1403 , B29C65/1406 , B29C65/1412 , B29C65/1435 , B29C65/1477 , B29C65/1603 , B29C65/1606 , B29C65/1612 , B29C65/1635 , B29C65/1654 , B29C65/1677 , B29C66/21 , B29C66/543 , B29C66/545 , B29D11/00009 , B29L2011/0016 , Y10S359/90
摘要： In the case where a lens unit where two ore more transparent resin lenses are combined is constituted, at least one transparent resin lens contains infrared absorbent. When the lens unit is assembled, an infrared laser is emitted to a joined portion between the transparent resin lens and the other transparent resin lens. As a result, the emitted infrared ray is absorbed by the infrared absorbent, so that the transparent resin lenses are welded to each other. An opaque lens barrel which holds the entire lens unit and the transparent resin lenses are joined by welding.
摘要翻译： 在组合两个以上的透明树脂透镜的透镜单元的情况下，至少一个透明树脂透镜包含红外线吸收剂。 当组装透镜单元时，将红外激光发射到透明树脂透镜和另一透明树脂透镜之间的接合部分。 结果，发射的红外线被红外线吸收剂吸收，使得透明树脂透镜彼此焊接。 保持整个透镜单元和透明树脂透镜的不透明镜筒通过焊接而接合。
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公开(公告)号：US20100074815A1
公开(公告)日：2010-03-25
申请号：US12447392
申请日：2007-10-19
申请人： Kanji Sekihara , Masayoshi Uehira
发明人： Kanji Sekihara , Masayoshi Uehira
CPC分类号： B29C33/42 , B29C33/3878 , B81B2201/051 , B81C99/0085
摘要： Mold releasability of a molding die from a master is improved. The master is a mother body of the molding die. The master has a groove corresponding to a flow channel of a resin molded product, and the cross-section of the bottom surface portion of the groove is in the form of a curved surface.
摘要翻译： 提高了模具从母模的脱模性。 主人是模具的母体。 主机具有对应于树脂模制产品的流动通道的凹槽，并且凹槽的底表面部分的横截面为曲面形式。
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5.发明申请OPTICAL ELEMENT FORMING METAL MOLD AND METHOD OF MANUFACTURING OPTICAL ELEMENT FORMING METAL MOLD 有权形成金属模具的光学元件和制造金属模具的光学元件的制造方法公开(公告)号：US20080245475A1
公开(公告)日：2008-10-09
申请号：US12055499
申请日：2008-03-26
申请人： Masayoshi Uehira , Yuzo Nakatsuka
发明人： Masayoshi Uehira , Yuzo Nakatsuka
CPC分类号： B29C33/56 , B29C33/3828 , B29C45/372 , B29L2011/00 , Y10S425/808
摘要： A method of forming an optical element forming metal mold to form an optical element, having steps of: laminating a heat insulation layer 13 on a surface of the base member 11 where the optical element is formed; laminating an intermediate metal layer 14 on a surface of the heat insulation layer 13 by thermal spraying; laminating a surface forming layer 15, on which a surface shape to be transferred to the optical element is formed, on the intermediate metal layer 14; wherein the intermediate metal layer 14 is laminated in a way that parts of the heat insulation layer 13 are exposed substantially evenly from the intermediate layer 14.
摘要翻译： 一种形成光学元件形成金属模以形成光学元件的方法，具有以下步骤：在形成光学元件的基底构件11的表面上层压隔热层13; 通过热喷涂在绝热层13的表面上层压中间金属层14; 在中间金属层14上层叠形成有要转移到光学元件的表面形状的表面形成层15; 其中中间金属层14以使绝热层13的一部分从中间层14基本上均匀地露出的方式层压。
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6.发明授权公开(公告)号：US07922146B2
公开(公告)日：2011-04-12
申请号：US12055499
申请日：2008-03-26
申请人： Masayoshi Uehira , Yuzo Nakatsuka
发明人： Masayoshi Uehira , Yuzo Nakatsuka
IPC分类号： B29D11/00
CPC分类号： B29C33/56 , B29C33/3828 , B29C45/372 , B29L2011/00 , Y10S425/808
摘要： A method of forming an optical element forming metal mold to form an optical element, having steps of: laminating a heat insulation layer 13 on a surface of the base member 11 where the optical element is formed; laminating an intermediate metal layer 14 on a surface of the heat insulation layer 13 by thermal spraying; laminating a surface forming layer 15, on which a surface shape to be transferred to the optical element is formed, on the intermediate metal layer 14; wherein the intermediate metal layer 14 is laminated in a way that parts of the heat insulation layer 13 are exposed substantially evenly from the intermediate layer 14.
摘要翻译： 一种形成光学元件形成金属模以形成光学元件的方法，具有以下步骤：在形成光学元件的基底构件11的表面上层压隔热层13; 通过热喷涂在绝热层13的表面上层压中间金属层14; 在中间金属层14上层叠形成有要转移到光学元件的表面形状的表面形成层15; 其中中间金属层14以使绝热层13的一部分从中间层14基本上均匀地露出的方式层压。
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公开(公告)号：US20100012255A1
公开(公告)日：2010-01-21
申请号：US12528989
申请日：2008-02-21
申请人： Kanji Sekihara , Masayoshi Uehira
发明人： Kanji Sekihara , Masayoshi Uehira
CPC分类号： B01L3/502707 , B01J2219/00511 , B01J2219/00527 , B01J2219/00596 , B01J2219/00605 , B01J2219/0061 , B01J2219/00621 , B01J2219/00637 , B01L2200/0689 , B01L2300/0816 , B01L2300/0887 , B29C65/08 , B29C65/16 , B29C65/1654 , B29C65/48 , B29C66/0224 , B29C66/345 , B29C66/54 , B29C66/71 , B29C66/72324 , B29C66/81267 , B29C66/8322 , B29C66/91411 , B29C66/919 , B29C2793/00 , B29L2031/756 , B81B2201/051 , B81C1/00071 , B81C2203/032 , Y10S156/93 , Y10T156/1168 , B29K2083/00 , B29K2077/00 , B29K2069/00 , B29K2067/003 , B29K2033/20 , B29K2033/12 , B29K2031/04 , B29K2027/08 , B29K2027/06 , B29K2025/06 , B29K2023/12 , B29K2023/083 , B29K2023/06 , B29K2009/00
摘要： Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films (12, 22) representing the functional films on a surface having a flow path channel (11) of a microchip substrate (10) and on a surface having a flow path channel (21) of a microchip substrate (20) respectively; a second step of exfoliating the SiO2 films formed on the microchip substrates (10, 20) except the SiO2 films formed on the flow path channels (11, 21) by a cohesive member; and a third step of placing the microchip substrates (10, 20) one over another in such a way that the surfaces on which the flow path channels (11, 21) are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding.
摘要翻译： 提供了一种在流路通道中形成功能膜并结合树脂微芯片基板的微芯片制造方法。 该制造方法具有在具有微芯片基板（10）的流路通道（11）的表面上和具有流路通道（21）的表面上形成表示功能膜的SiO 2膜（12,22）的第一工序， 的微芯片基板（20）; 第二步骤，除了通过粘合构件在形成在流路通道（11,21）上的SiO 2膜之外，在微芯片基板（10,20）上形成的SiO 2膜剥离; 以及第三步骤，将微芯片基板（10,20）一个一个地放置成使得其上形成有流路通道（11,21）的表面朝向内部，并通过激光焊接，超声波 焊接或热压接合。
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公开(公告)号：US08268112B2
公开(公告)日：2012-09-18
申请号：US12532665
申请日：2008-03-19
申请人： Kanji Sekihara , Masayoshi Uehira
发明人： Kanji Sekihara , Masayoshi Uehira
IPC分类号： B29C65/16
CPC分类号： B29C66/1122 , B01L3/502707 , B01L2200/12 , B01L2300/0887 , B01L2300/12 , B29C65/1616 , B29C65/1635 , B29C65/1641 , B29C65/1654 , B29C65/1683 , B29C66/0042 , B29C66/006 , B29C66/348 , B29C66/41 , B29C66/53461 , B29C66/71 , B29C66/73161 , B29C66/733 , B29C66/7352 , B29C66/73921 , B29C66/8122 , B29C66/81265 , B29C66/81267 , B29C66/81268 , B29C66/8322 , B29C66/9161 , B29C66/919 , B29C66/929 , B29C66/934 , B29C66/939 , B29K2995/0027 , B29L2031/756 , B29K2905/00 , B29K2905/02 , B29K2905/12 , B29K2909/08 , B29K2833/12 , B29K2869/00 , B29K2033/12 , B29K2823/00 , B29K2023/00 , B29K2023/38 , B29K2069/00
摘要： A method for bonding resin members by laser welding in which melting of a resin member can be prevented on the contact surface with a base or a tool used for bonding. In the bonding method, a resin member (1) is mounted on a base (3) and a surface of the base (3) in contact with the resin member (1) is an optical mirror surface. A surface of the resin member (1) is coated with a light absorbing agent (4), a resin member (2) is placed thereon and then a laser light (10) is irradiated from the resin member (2) side in order to melt the resin on the bonding surface of the resin member (1) and the resin member (2), thereby bonding the resin members together. The laser light (11) penetrated through the bonding surface reaches the contact surface where the resin member (1) and the base (3) are in contact with each other, and since the laser light (11) penetrates the bonding surface without being scattered or absorbed, melting of the resin member can be prevented.
摘要翻译： 一种用于通过激光焊接来粘合树脂构件的方法，其中树脂构件的熔化可以在与用于结合的基座或工具的接触表面上被防止。 在接合方法中，树脂构件（1）安装在基座（3）上，与树脂构件（1）接触的基座（3）的表面是光学镜面。 树脂构件（1）的表面涂覆有光吸收剂（4），树脂构件（2）放置在其上，然后从树脂构件（2）侧照射激光（10），以便 在树脂构件（1）和树脂构件（2）的接合表面上熔化树脂，从而将树脂构件粘合在一起。 穿过接合表面的激光（11）到达树脂构件（1）和基底（3）彼此接触的接触表面，并且由于激光（11）不分散地穿透接合表面 或吸收，树脂部件的熔化。
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公开(公告)号：US20050219717A1
公开(公告)日：2005-10-06
申请号：US11091290
申请日：2005-03-28
CPC分类号： G02B7/021 , B29C65/1403 , B29C65/1406 , B29C65/1412 , B29C65/1435 , B29C65/1477 , B29C65/1603 , B29C65/1606 , B29C65/1612 , B29C65/1635 , B29C65/1654 , B29C65/1677 , B29C66/21 , B29C66/543 , B29C66/545 , B29D11/00009 , B29L2011/0016 , Y10S359/90
摘要： In the case where a lens unit where two ore more transparent resin lenses are combined is constituted, at least one transparent resin lens contains infrared absorbent. When the lens unit is assembled, an infrared laser is emitted to a joined portion between the transparent resin lens and the other transparent resin lens. As a result, the emitted infrared ray is absorbed by the infrared absorbent, so that the transparent resin lenses are welded to each other. An opaque lens barrel which holds the entire lens unit and the transparent resin lenses are joined by welding.
摘要翻译： 在组合两个以上的透明树脂透镜的透镜单元的情况下，至少一个透明树脂透镜包含红外线吸收剂。 当组装透镜单元时，将红外激光发射到透明树脂透镜和另一透明树脂透镜之间的接合部分。 结果，发射的红外线被红外线吸收剂吸收，使得透明树脂透镜彼此焊接。 保持整个透镜单元和透明树脂透镜的不透明镜筒通过焊接而接合。
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公开(公告)号：US07901527B2
公开(公告)日：2011-03-08
申请号：US12528989
申请日：2008-02-21
申请人： Kanji Sekihara , Masayoshi Uehira
发明人： Kanji Sekihara , Masayoshi Uehira
CPC分类号： B01L3/502707 , B01J2219/00511 , B01J2219/00527 , B01J2219/00596 , B01J2219/00605 , B01J2219/0061 , B01J2219/00621 , B01J2219/00637 , B01L2200/0689 , B01L2300/0816 , B01L2300/0887 , B29C65/08 , B29C65/16 , B29C65/1654 , B29C65/48 , B29C66/0224 , B29C66/345 , B29C66/54 , B29C66/71 , B29C66/72324 , B29C66/81267 , B29C66/8322 , B29C66/91411 , B29C66/919 , B29C2793/00 , B29L2031/756 , B81B2201/051 , B81C1/00071 , B81C2203/032 , Y10S156/93 , Y10T156/1168 , B29K2083/00 , B29K2077/00 , B29K2069/00 , B29K2067/003 , B29K2033/20 , B29K2033/12 , B29K2031/04 , B29K2027/08 , B29K2027/06 , B29K2025/06 , B29K2023/12 , B29K2023/083 , B29K2023/06 , B29K2009/00
摘要： Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films (12, 22) representing the functional films on a surface having a flow path channel (11) of a microchip substrate (10) and on a surface having a flow path channel (21) of a microchip substrate (20) respectively; a second step of exfoliating the SiO2 films formed on the microchip substrates (10, 20) except the SiO2 films formed on the flow path channels (11, 21) by a cohesive member; and a third step of placing the microchip substrates (10, 20) one over another in such a way that the surfaces on which the flow path channels (11, 21) are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding.
摘要翻译： 提供了一种在流路通道中形成功能膜并结合树脂微芯片基板的微芯片制造方法。 该制造方法具有在具有微芯片基板（10）的流路通道（11）的表面上和具有流路通道（21）的表面上形成表示功能膜的SiO 2膜（12,22）的第一工序， 的微芯片基板（20）; 第二步骤，除了通过粘合构件在形成在流路通道（11,21）上的SiO 2膜之外，在微芯片基板（10,20）上形成的SiO 2膜剥离; 以及第三步骤，将微芯片基板（10,20）一个一个地放置成使得其上形成有流路通道（11,21）的表面朝向内部，并通过激光焊接，超声波 焊接或热压接合。
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