CONNECTION ELEMENT FOR ADHERING TO A COMPONENT SURFACE AND PRODUCTION METHOD AND SECURING METHOD THEREFOR

    公开(公告)号:US20230256684A1

    公开(公告)日:2023-08-17

    申请号:US18138486

    申请日:2023-04-24

    发明人: Franz Drüke

    IPC分类号: B29C65/14 B29C65/48 B29C65/00

    摘要: A connection element for adhering to a component surface of a first component, such that a second component can be secured to the first component by the connection element, including a base element having an adhesive side with an adhesive surface, and a mounting structure. The base element consists of a thermoplastic with a temperature of continued use of at least 130° C., which can be poorly irradiated or cannot be irradiated with light, and has at least one irradiation region. The base element can be irradiated with light in this region in such a way that light energy penetrates the base element. The irradiation region, in cross-section, has a smaller thickness and a transmittance at least 20% with a light wavelength between 320 and 500 nm. Alternatively, the irradiation region is formed by a through-opening.

    Methods for Attaching Structures Using Ultraviolet and Visible Light Curing Adhesive
    7.
    发明申请
    Methods for Attaching Structures Using Ultraviolet and Visible Light Curing Adhesive 有权
    使用紫外线和可见光固化粘合剂粘附结构的方法

    公开(公告)号:US20140036353A1

    公开(公告)日:2014-02-06

    申请号:US13567949

    申请日:2012-08-06

    申请人: James R. Krogdahl

    发明人: James R. Krogdahl

    IPC分类号: B32B3/06 B29C71/04 B29C45/16

    摘要: An electronic device may be provided with electronic device structures such as housing structures and structures associated with electrical components. The electronic device structures may be attached to each other using ultraviolet and visible light curable adhesive. A layer of adhesive may be interposed between electronic device structures. A light source may generate ultraviolet light. The structures may include an ultraviolet-light-transparent structure through which the ultraviolet light passes to illuminate and cure the adhesive. The ultraviolet-light-transparent structure may form one of multiple shots of injection molded plastic in a device structure, may be formed using a plastic that is opaque at visible wavelengths, or may have a coating such as a metal coating to help reflect ultraviolet radiation onto the adhesive. Perforations in the coating may be used to pass ultraviolet radiation to the adhesive.

    摘要翻译: 电子设备可以设置有电子设备结构,例如与电气部件相关联的壳体结构和结构。 电子器件结构可以使用紫外线和可见光固化粘合剂彼此附接。 可以在电子器件结构之间插入一层粘合剂。 光源可产生紫外光。 该结构可以包括紫外光透射结构,紫外线通过该结构照射和固化粘合剂。 紫外光透明结构可以在器件结构中形成注射成型塑料的多次射击之一,可以使用在可见波长不透明的塑料形成,或者可以具有诸如金属涂层的涂层以帮助反射紫外线辐射 粘在胶上。 涂层中的穿孔可以用于将紫外线辐射传递到粘合剂。