公开(公告)号：US08922029B2

公开(公告)日：2014-12-30

申请号：US13363396

申请日：2012-02-01

申请人： Atsushi Hiraishi ,  Toshio Sugano ,  Masahiro Yamaguchi ,  Yoji Nishio ,  Tsutomu Hara ,  Koichiro Aoki

发明人： Atsushi Hiraishi ,  Toshio Sugano ,  Masahiro Yamaguchi ,  Yoji Nishio ,  Tsutomu Hara ,  Koichiro Aoki

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  G11C5/06 ,  G11C5/04 ,  G11C8/14 ,  H05K1/18

CPC分类号： G11C5/063 ,  G11C5/04 ,  G11C8/14 ,  H05K1/181 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/10159 ,  Y02P70/611

摘要： An address signal line having a stub structure connects between at least three memory elements and a data transferring element and transmits address signals for the memory elements. An address terminal of the data transferring element has an impedance lower than a characteristic impedance of the address signal line. A wiring length TL0 from the data transferring element to a first branch point S1 where a branch line is branched at a shortest distance from the data transferring element is configured to become equal to or greater than a wiring length TL1 from the first branch point S1 to a second branch point S2 where a second branch line is branched. A wiring length TL3 from the second branch point S2 to a third branch point S3 where a third branch line is branched is configured to become greater than the wiring lengths TL0 and TL1.

摘要翻译： 具有短截线结构的地址信号线连接在至少三个存储器元件和数据传输元件之间，并传送存储器元件的地址信号。 数据传送元件的地址端子的阻抗低于地址信号线的特性阻抗。 从数据传送元件到分支线从数据传送元件到最短距离分支的第一分支点S1的布线长度TL0被配置成等于或大于从第一分支点S1到布线长度TL1 第二分支点S2，其中第二支线被分支。 从第二分支点S2到分支第三分支线的第三分支点S3的布线长度TL3被配置为变得大于布线长度TL0和TL1。

公开(公告)号：US08461690B2

公开(公告)日：2013-06-11

申请号：US12969909

申请日：2010-12-16

申请人： Masanori Yoshida ,  Daisuke Tsuji ,  Masahito Yamato ,  Jun Sasaki ,  Kaoru Sonobe ,  Akira Ide ,  Masahiro Yamaguchi

发明人： Masanori Yoshida ,  Daisuke Tsuji ,  Masahito Yamato ,  Jun Sasaki ,  Kaoru Sonobe ,  Akira Ide ,  Masahiro Yamaguchi

IPC分类号： H01L29/40

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3135 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes a chip stacked body where a plurality of semiconductor chips are stacked, and penetration electrodes respectively formed in the semiconductor chips are electrically interconnected in stacking order of the semiconductor chips, a first support member that is disposed to face a first semiconductor chip formed in one end of the chip stacked body, and including electrodes electrically connected to the penetration electrodes of the first semiconductor chip, and a wiring board that is disposed to face a second semiconductor chip formed in an end opposed to the one end of the chip stacked body, and including external electrodes on a surface opposed to a surface facing the second semiconductor chip that is to be electrically connected to the penetration electrodes of the second semiconductor chip.

摘要翻译： 一种半导体器件包括堆叠多个半导体芯片的芯片堆叠体，并且分别形成在半导体芯片中的穿透电极以半导体芯片的堆叠顺序电互连，第一支撑构件设置为面对第一半导体芯片 形成在所述芯片堆叠体的一端，并且包括电连接到所述第一半导体芯片的穿透电极的电极以及配置为面对形成在与所述芯片的所述一端相对的端部的第二半导体芯片的布线板 并且在与要与第二半导体芯片的贯通电极电连接的与第二半导体芯片相对的表面相对的表面上包括外部电极。

公开(公告)号：US08298941B2

公开(公告)日：2012-10-30

申请号：US13026830

申请日：2011-02-14

申请人： Masahiro Yamaguchi

发明人： Masahiro Yamaguchi

IPC分类号： H01L21/44

CPC分类号： H01L21/76898 ,  H01L23/3192 ,  H01L23/481 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L27/105 ,  H01L27/10894 ,  H01L2224/03462 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05094 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/11462 ,  H01L2224/1162 ,  H01L2224/13009 ,  H01L2224/13021 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3511 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device includes, but is not limited to, the following processes. A seed layer is formed over a substrate. The seed layer includes first, second, and third portions. A first electrode covering the first portion of the seed layer is formed without forming an electrode on the second and third portions of the seed layer. The third portion of the seed layer is removed so that the first and second portions remain over the substrate, and the first and second portions are separated from each other.

摘要翻译： 制造半导体器件的方法包括但不限于以下处理。 种子层形成在衬底上。 种子层包括第一，第二和第三部分。 形成覆盖种子层的第一部分的第一电极，而不在种子层的第二和第三部分上形成电极。 去除种子层的第三部分，使得第一和第二部分保留在衬底上，并且第一和第二部分彼此分离。

公开(公告)号：US20120243725A1

公开(公告)日：2012-09-27

申请号：US13392737

申请日：2010-08-25

申请人： Kanemori Takai ,  Atsuhito Horino ,  Tomonari Kaneko ,  Masahiro Yamaguchi

发明人： Kanemori Takai ,  Atsuhito Horino ,  Tomonari Kaneko ,  Masahiro Yamaguchi

IPC分类号： H04R1/10

CPC分类号： H04R1/1016

摘要： An earphone is disclosed. The earphone comprises an external auditory meatus insertion member, a casing and a driver unit. At least a part of the external auditory meatus insertion member is insertable into an external auditory meatus. The external auditory meatus insertion member is attached to the casing. The driver unit is disposed within the casing to generate sounds. The casing includes a front space formed in front of the driver unit, a sound guide hole in communication with the front end of the front space to cause sounds to impinge on the external auditory meatus, and a rear space formed in the rear of the driver unit.

摘要翻译： 公开了一种耳机。 耳机包括外耳道插入构件，外壳和驱动单元。 外耳道插入部件的至少一部分可插入外耳道。 外耳道插入构件附接到外壳。 驱动器单元设置在壳体内以产生声音。 壳体包括形成在驱动器单元前面的前部空间，与前部空间的前端连通的声音引导孔，使得声音撞击在外部耳道上，以及形成在驾驶员后部的后部空间 单元。

公开(公告)号：US08209091B2

公开(公告)日：2012-06-26

申请号：US12516243

申请日：2008-01-21

申请人： Shunji Morichika ,  Katsuaki Morita ,  Masahiro Yamaguchi ,  Mitsuaki Hoshi ,  Kousuke Katahira

发明人： Shunji Morichika ,  Katsuaki Morita ,  Masahiro Yamaguchi ,  Mitsuaki Hoshi ,  Kousuke Katahira

IPC分类号： A01B69/00

CPC分类号： B62D1/265 ,  B61B10/04

摘要： According to a steering control method, before starting, a pattern steering angle table on which pattern steering angles for the front and rear wheels at respective change points of the track are listed is prepared in view of a track condition, etc. from a departure point to a destination point, a vehicle is steered in accordance with a pattern steering angle read from the table, a track widthwise position of the vehicle on running is detected so as to calculate correcting steering angles by which the track widthwise position of the vehicle coincides with a desired position, and the correcting steering angles are added to pattern steering angles so as to obtain desired steering angles by which the front wheels are steered. The pattern steering angle, the corrected steering angle and the desired steering angle are calculated for each of the front and rear wheels, independent from each other.

摘要翻译： 根据转向控制方法，在开始之前，根据轨迹条件等从出发点准备在其上列出轨道的各个变化点处的前轮和后轮的图形转向角的图案转向角度表 到目的地点，根据从桌子读取的图案转向角来转向车辆，检测行驶中的车辆的轨道宽度方向位置，以计算车辆的轨道宽度方向与车辆的轨迹横向位置一致的校正转向角度 将期望的位置和校正转向角加到图形转向角上，以获得转向前轮的期望的转向角度。 为彼此独立地计算前轮和后轮中的每一个的图案转向角，修正转向角和期望的转向角。

公开(公告)号：US08161889B2

公开(公告)日：2012-04-24

申请号：US12373429

申请日：2006-11-16

申请人： Shunji Morichika ,  Katsuaki Morita ,  Hiroyuki Kono ,  Hiroyuki Mochidome ,  Hiroshi Yamashita ,  Masahiro Yamaguchi ,  Kosuke Katahira

发明人： Shunji Morichika ,  Katsuaki Morita ,  Hiroyuki Kono ,  Hiroyuki Mochidome ,  Hiroshi Yamashita ,  Masahiro Yamaguchi ,  Kosuke Katahira

IPC分类号： B61F9/00

CPC分类号： B62D1/265 ,  B61F9/00

摘要： The present invention provides the structure of a bogie for a vehicle in a track type transportation system in which the vehicle runs along a predetermined track, which can be simplified, and lightweight and which can be run at a high speed with the maintainability therefor being enhanced, comprising a guide rail 14 laid on the track 12, guide wheels 51 capable of traveling being made into contact with the guide rail 14, a guide arm 48 attached thereto with the guide wheels 51, and a guide wheel support bracket 52 for supporting the guide arm 48 arranged underneath an axle 22 of the vehicle so that the guide arm 48 is pivotable around a pivotal vertical support shat 56, left and right of the vehicle, and the guide arm 48, the guide wheels 51 and the guide wheel support bracket 52 constitute a unit structure which is attached to the axle 22 or a bogie frame 26 of the vehicle.

摘要翻译： 本发明提供了一种轨道式运输系统中的车辆转向架的结构，其中车辆沿预定轨道行驶，其可以简化且重量轻并且可以以高速运行，并且其可维护性被增强 包括布置在轨道12上的导轨14，能够与导轨14接触的行进导向轮51，与引导轮51连接的引导臂48和用于支撑导向轮51的导轮支撑支架52 引导臂48布置在车辆的车轴22的下方，使得引导臂48围绕车辆左右的枢转垂直支撑柄56枢转，并且引导臂48，引导轮51和引导轮支撑支架 52构成连接到车辆22的车轴22或转向架框架26的单元结构。

公开(公告)号：US20110207322A1

公开(公告)日：2011-08-25

申请号：US13026830

申请日：2011-02-14

申请人： Masahiro YAMAGUCHI

发明人： Masahiro YAMAGUCHI

IPC分类号： H01L21/768

CPC分类号： H01L21/76898 ,  H01L23/3192 ,  H01L23/481 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L27/105 ,  H01L27/10894 ,  H01L2224/03462 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05094 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/11462 ,  H01L2224/1162 ,  H01L2224/13009 ,  H01L2224/13021 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3511 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device includes, but is not limited to, the following processes. A seed layer is formed over a substrate. The seed layer includes first, second, and third portions. A first electrode covering the first portion of the seed layer is formed without forming an electrode on the second and third portions of the seed layer. The third portion of the seed layer is removed so that the first and second portions remain over the substrate, and the first and second portions are separated from each other.

摘要翻译： 制造半导体器件的方法包括但不限于以下处理。 种子层形成在衬底上。 籽晶层包括第一，第二和第三部分。 形成覆盖种子层的第一部分的第一电极，而不在种子层的第二和第三部分上形成电极。 去除种子层的第三部分，使得第一和第二部分保留在衬底上，并且第一和第二部分彼此分离。

公开(公告)号：US20110147945A1

公开(公告)日：2011-06-23

申请号：US12969909

申请日：2010-12-16

申请人： Masanori YOSHIDA ,  Daisuke Tsuji ,  Masahito Yamato ,  Jun Sasaki ,  Kaoru Sonobe ,  Akira Ide ,  Masahiro Yamaguchi

发明人： Masanori YOSHIDA ,  Daisuke Tsuji ,  Masahito Yamato ,  Jun Sasaki ,  Kaoru Sonobe ,  Akira Ide ,  Masahiro Yamaguchi

IPC分类号： H01L23/52

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3135 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes a chip stacked body where a plurality of semiconductor chips are stacked, and penetration electrodes respectively formed in the semiconductor chips are electrically interconnected in stacking order of the semiconductor chips, a first support member that is disposed to face a first semiconductor chip formed in one end of the chip stacked body, and including electrodes electrically connected to the penetration electrodes of the first semiconductor chip, and a wiring board that is disposed to face a second semiconductor chip formed in an end opposed to the one end of the chip stacked body, and including external electrodes on a surface opposed to a surface facing the second semiconductor chip that is to be electrically connected to the penetration electrodes of the second semiconductor chip.

摘要翻译： 一种半导体器件包括堆叠多个半导体芯片的芯片堆叠体，并且分别形成在半导体芯片中的穿透电极以半导体芯片的堆叠顺序电互连，第一支撑构件设置为面对第一半导体芯片 形成在所述芯片堆叠体的一端，并且包括电连接到所述第一半导体芯片的穿透电极的电极以及配置为面对形成在与所述芯片的所述一端相对的端部的第二半导体芯片的布线板 并且在与要与第二半导体芯片的贯通电极电连接的与第二半导体芯片相对的表面相对的表面上包括外部电极。

公开(公告)号：US20110130932A1

公开(公告)日：2011-06-02

申请号：US12954023

申请日：2010-11-24

申请人： Kenji Takenaka ,  Hirohide Matsushima ,  Osamu Tani ,  Tomomichi Nose ,  Masahiro Yamaguchi

发明人： Kenji Takenaka ,  Hirohide Matsushima ,  Osamu Tani ,  Tomomichi Nose ,  Masahiro Yamaguchi

IPC分类号： F16H59/36

CPC分类号： F16H63/50 ,  F16H59/24 ,  F16H59/30 ,  F16H59/38 ,  F16H2059/144

摘要： A vehicle control system includes a determiner configured to determine whether or not a driver has performed a predetermined acceleration or deceleration operation; a detector configured to detect a value of at least one of a relative rotational position and relative rotational speed of an input shaft and an output shaft, the input shaft being positioned upstream of an engagement portion of driving power transmission members which are engaged with each other with a slack on a driving power transmission path, and the output shaft being positioned downstream of the engagement portion, and a controller configured to execute control for accelerating or decelerating the input shaft or the output shaft to reduce at least one of a contact speed and transmission torque of the driving power transmission members based on the value detected by the detector, if the determiner determines that the driver has performed the acceleration or deceleration operation.

摘要翻译： 车辆控制系统包括确定器，其被配置为确定驾驶员是否已经执行了预定的加速或减速操作; 检测器，其被配置为检测输入轴和输出轴的相对旋转位置和相对转速中的至少一个的值，所述输入轴位于彼此接合的驱动动力传递部件的接合部分的上游 在驱动动力传递路径上具有松弛，并且输出轴位于接合部分的下游，以及控制器，被配置为执行用于加速或减速输入轴或输出轴的控制，以减少接触速度和 如果确定器确定驾驶员已经执行了加速或减速操作，则基于由检测器检测到的值，驱动动力传递构件的传递扭矩。

公开(公告)号：US07804272B2

公开(公告)日：2010-09-28

申请号：US11936916

申请日：2007-11-08

申请人： Katsuaki Morita ,  Masaya Mitake ,  Masahiro Yamaguchi ,  Masaomi Yamada ,  Hiroshi Yamashita ,  Kousuke Katahira

发明人： Katsuaki Morita ,  Masaya Mitake ,  Masahiro Yamaguchi ,  Masaomi Yamada ,  Hiroshi Yamashita ,  Kousuke Katahira

IPC分类号： H01M10/46

CPC分类号： B60M7/00 ,  B60L5/005 ,  B60L11/182 ,  H01F38/14 ,  H02J5/005 ,  H02J7/025 ,  H02J50/10 ,  H02J50/70 ,  Y02T10/7005 ,  Y02T10/7072 ,  Y02T90/122 ,  Y02T90/14

摘要： A noncontact type power feeder system for feeding a power to a mobile object, in which a power feeding portion and a power receiving portion can be easily manufactured at low costs and which can transmit a high power. The noncontact type power feeder system for a mobile object, comprises a power feeding portion provided in a surface on which the mobile object runs, and a power receiving portion provided in the lower part of the mobile object at a position facing to the power supply portion, the each of the power feeding portion and the power receiving portion is composed of windings formed in an oval shape, and a magnetic planar core formed therein with a recess in which the windings are accommodated so that the longitudinal direction of the oval shape of the windings is extended along the travel direction of the mobile object, the planer core is composed of several planar blocks each having a rectangular surface, several blocks being laid so that long sides of the rectangular surfaces are extended in the travel direction of the mobile object, in which several blocks are also laid in the direction orthogonal to the travel direction, and several blocks being superposed one upon another, the recess of the planar core is defined by thick wall parts in which the planar cores are superposed on the surface of the planar core, outside and inside of the oval shape part of the windings.

摘要翻译： 一种用于向移动物体供电的非接触型馈电系统，其中能够以低成本容易地制造馈电部分和电力接收部分，并且可以传输高功率。 用于移动物体的非接触型馈电系统包括设置在移动物体运行的表面上的供电部分和设置在可移动物体的下部的电力接收部分，该电力接收部分在面向电源部分的位置处 所述供电部和所述电力接收部中的每一个由形成为椭圆形的绕组构成，并且形成有形成有所述绕组的凹部的磁性平面磁芯，使得所述绕组被容纳的椭圆形的纵向方向 绕组沿着移动物体的移动方向延伸，平面芯由几个平面块组成，每个平面块具有矩形表面，若干块被放置成使矩形表面的长边在移动物体的行进方向上延伸， 其中几个块也沿着与行进方向正交的方向放置，并且几个块彼此叠置在一起 平面芯由厚壁部分限定，其中平面芯叠加在平面芯的表面上，绕组的椭圆形部分的外部和内部。