Abstract:
A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer.
Abstract:
Method and system to centrally monitor the quality of images of financial documents. Embodiments of the present invention can provide a way to monitor and evaluate the quality of images of financial documents stored for remote access by financial institutions. In some embodiments, a standard quality analysis of at least some of the images is performed, and, based on the quality analysis, suspect images are identified to a responsible entity. For at least some of the images, a decisioning result from the responsible entity is recorded in association with information identifying the images. The quality analysis can be applied based on exclusion criteria such as an amount threshold, certain routing information, etc. The suspect images can be identified by sending a quality results file to the responsible entity, and a decisioning result can be received in a decisioning results file.
Abstract:
A field programmable gate array, an access lead network coupled to the FPGA, and a plurality of memories electrically coupled to the access lead network. The FPGA, access lead network, and plurality of memories are arranged and configured to operate with a variable word width, namely with a word width between 1 and a maximum number of bits. The absolute maximum word width may be as large as m.times.N where m is the number of word width bits per memory chip and N is the number of memory chips.
Abstract:
A field programmable gate array, an access lead network coupled to the FPGA, and a plurality of memories electrically coupled to the access lead network. The FPGA, access lead network, and plurality of memories are arranged and configured to operate with a variable word width, namely with a word width between 1 and a maximum number of bits. The absolute maximum word width may be as large as m.times.N where m is the number of word width bits per memory chip and N is the number of memory chips.
Abstract:
An alignment device for use in welding which includes a saddle style support which rests upon a first pipe. A second pipe is clamped to the saddle style support in an orientation substantially perpendicular to the first pipe upon which the saddle style support rests. The second pipe serves as a carrier member of a fitting, such as a weldolet. Cinch straps can be used with the saddle style support to facilitate welding on the underside of horizontal pipes or on vertical pipes.
Abstract:
An apparatus and method for mounting a plurality of plates onto a carrier sheet includes a table mounted on a stationary base, each plate having a first and a second registration mark thereon. A first camera assembly is moveably attached to a support adjacent the table and is connected to a first video monitor for viewing the first registration marks. A second video camera is moveably attached to the support adjacent the table and is connected to a second video monitor for viewing the second registration marks. Linear actuators are connected to the first and the second camera assemblies and to the table for independently moving each camera assembly relative to the table. A motion controller is connected to the linear actuators for sending moving signals thereto, and generates at least two moving signals corresponding to the two registration marks for each plate. Each plate is positioned on the carrier sheet beneath the first and the second camera assemblies so that the first registration mark aligns with a cross-hair image on the first video monitor and the second registration mark aligns with a cross-hair image on the second video monitor.
Abstract:
A field programmable gate array, an access lead network coupled to the FPGA, and a plurality of memories electrically coupled to the access lead network. The FPGA, access lead network, and plurality of memories are arranged and configured to operate with a variable word width, namely with a word width between 1 and a maximum number of bits. The absolute maximum word width may be as large as m*N where m is the number of word width bits per memory chip and N is the number of memory chips.
Abstract:
A field programmable gate array, an access lead network coupled to the FPGA, and a plurality of memories electrically coupled to the access lead network. The FPGA, access lead network, and plurality of memories are arranged and configured to operate with a variable word width, namely with a word width between 1 and a maximum number of bits. The absolute maximum word width may be as large as m.times.N where m is the number of word width bits per memory chip and N is the number of memory chips.