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公开(公告)号：US06899604B2
公开(公告)日：2005-05-31
申请号：US10204600
申请日：2002-01-17
Applicant: Tetsuji Togawa , Ikutaro Noji , Shunichiro Kojima , Nobuyuki Takada
Inventor： Tetsuji Togawa , Ikutaro Noji , Shunichiro Kojima , Nobuyuki Takada
IPC: B24B41/047 , B24B49/16 , B24B53/007 , B24B53/017 , B24B53/02 , B24B53/12 , H01L21/304 , B24B7/00
CPC classification number: B24B53/017 , B24B41/047 , B24B49/16 , B24B53/02 , B24B53/12
Abstract: A dressing apparatus dresses a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer in a polishing apparatus. The dressing apparatus comprises a dresser body (31) connected to a dresser drive shaft (23) which is vertically movable, a dresser plate (32) which is vertically movable with respect to the dresser body (31), and a dressing member (22) held by the dresser plate (32) for dressing the polishing surface (1a).
Abstract translation: 修整装置用于抛光抛光装置中用于抛光诸如半导体晶片的工件的抛光台的抛光表面。 该修整装置包括连接到可上下移动的修整器驱动轴（23）的修整器主体（31），相对于修整器主体（31）可垂直移动的修整器板（32）和修整构件（22） ），其由修整器板（32）保持，用于修整抛光表面（1a）。
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公开(公告)号：US20070095659A1
公开(公告)日：2007-05-03
申请号：US10559724
申请日：2004-07-28
Applicant: Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
Inventor： Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
IPC: C25D17/00
CPC classification number: C25F7/00 , H01L21/32115
Abstract: The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can perform processing of a substrate without destroying devices formed in the substrate even when a fragile material is employed in the substrate and which can reduce non-uniformity in the contact pressure of an electrode member on a substrate during processing, thereby equalizing the processing amount in the entire processing surface of the substrate and the surface roughness after processing. The electrolytic processing apparatus includes: a substrate holder for holding a substrate; an electrode base provided with an electrode member for contact with the substrate, held by the substrate holder, in the presence of a liquid to effect processing of the substrate; and a support base for floatingly supporting the electrode base by a floating mechanism.
Abstract translation: 本发明提供一种电解处理装置和电解处理方法，其即使在基板中使用易碎材料，也可以在不破坏形成在基板中的装置的情况下进行基板的处理，并且可以降低基板的接触压力的不均匀性 电极部件在处理时在基板上，从而使基板的整个加工面的加工量与加工后的表面粗糙度相等。 电解处理装置包括：用于保持基板的基板保持件; 电极基体，设置有用于与所述基板接触的电极部件，所述电极部件由所述基板保持件保持在所述液体的存在下，以进行所述基板的加工; 以及用于通过浮动机构浮动地支撑电极基座的支撑基座。
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公开(公告)号：US20060234609A1
公开(公告)日：2006-10-19
申请号：US11452218
申请日：2006-06-14
Applicant: Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
Inventor： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
CPC classification number: B24B37/30 , B24B41/061
Abstract: The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
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公开(公告)号：US5014522A
公开(公告)日：1991-05-14
申请号：US510236
申请日：1990-04-17
Applicant: Ikutaro Noji , Masaki Kaiju , Hideyuki Sakamoto , Makoto Fukubayashi
Inventor： Ikutaro Noji , Masaki Kaiju , Hideyuki Sakamoto , Makoto Fukubayashi
CPC classification number: B60H1/321 , B60H1/00785 , B60H1/00864 , F04B27/1804 , F25B49/022 , B60H2001/3241 , B60H2001/3255 , B60H2001/3266 , B60H2001/327 , B60H2001/3282 , F04B2027/1813 , F04B2027/1827 , F04B2027/1831 , F04B2027/1854 , F04B2027/1859 , F04B2201/1201 , F04B2207/03
Abstract: An automotive air tempering apparatus for use in an automotive vehicle having a duct through which air is directed into a passenger compartment. The apparatus comprises an air chilling unit including an evaporator provided in the duct and a compressor having a displacement variable for supplying a controlled amount of refrigerant to the evaporator for chilling the air in the duct. A control unit controls the displacement of the compressor to bring the refrigerant temperature to a target value when air is introduced into the duct from the atmosphere. The control unit controls the displacement of the compressor to bring the chilled air temperature to a target value when air is introduced into the duct from the passenger compartment.
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公开(公告)号：US5014519A
公开(公告)日：1991-05-14
申请号：US510217
申请日：1990-04-17
Applicant: Ikutaro Noji , Masaki Kato , Masaki Kaiju , Ikuo Kinami
Inventor： Ikutaro Noji , Masaki Kato , Masaki Kaiju , Ikuo Kinami
CPC classification number: B60H1/3207 , F04B27/1804 , F25B49/022 , F04B2027/1813 , F04B2027/1831 , F04B2027/1854 , F04B2027/1859 , F04B2201/1201 , F04B2207/03
Abstract: An air tempering apparatus for use in an automotive vehicle having a duct through which air is directed into a passenger compartment. The apparatus comprises an air chilling unit having a variable refrigerating capacity of chilling the air in the duct, and an air reheating unit having a variable reheating capacity of reheating the chilled air in the duct. A control unit decreases the reheating capacity of the air heating unit as the chilled air temperature increases. The control unit decreases the refrigerating capacity of the air chilling means when the reheating capacity of the air reheating means is greater than a predetermined value and when the sensed humidity is less than a predetermined value.
Abstract translation: 一种用于机动车辆的空气回火设备，其具有通过空气导入乘客舱的管道。 该装置包括具有冷却管道中的空气的可变制冷能力的空气冷却单元和具有可再加热能力的空气再加热单元，该再加热能力使冷却空气在管道中再加热。 控制单元随着冷却空气温度升高而降低空气加热单元的再加热能力。 当空气再加热装置的再加热能力大于预定值时，并且当感测到的湿度小于预定值时，控制单元降低空气冷冻装置的制冷能力。
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Patent Agency Ranking
公开(公告)号：US07850509B2
公开(公告)日：2010-12-14
申请号：US12285936
申请日：2008-10-16
Applicant: Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
Inventor： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC: B24B7/22
CPC classification number: B24B37/30 , B24B41/061
Abstract: The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
Abstract translation: 本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于接触弹性垫的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。
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公开(公告)号：US07491117B2
公开(公告)日：2009-02-17
申请号：US11452218
申请日：2006-06-14
Applicant: Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
Inventor： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC: B24B7/22
CPC classification number: B24B37/30 , B24B41/061
Abstract: The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
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公开(公告)号：US20070187257A1
公开(公告)日：2007-08-16
申请号：US10592673
申请日：2005-03-16
Applicant: Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
Inventor： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
IPC: B23H7/00
CPC classification number: B24B37/04 , B23H5/08 , B24B53/017 , C25F3/02 , C25F7/00 , H01L21/32125
Abstract: An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness. The electrolytic processing apparatus including: a processing electrode capable of bringing into contact with or closing to a workpiece; a feeding electrode for feeding electricity to the workpiece; a contact member disposed between the workpiece and at least one of the processing electrode and the feeding electrode, the degree of deformation of said contact member by a contact load applied from the workpiece being smal
Abstract translation: 电解处理装置可以保持工件表面中的凹部和凸起部之间的电阻差，从而提供具有改善的平坦度的加工表面。 电解处理装置包括：能够与工件接触或闭合的处理电极; 用于向工件供电的供电电极; 设置在工件与处理电极和供电电极中的至少一个之间的接触构件，通过从工件施加的接触载荷为微小的所述接触构件的变形程度为小
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公开(公告)号：US5216895A
公开(公告)日：1993-06-08
申请号：US940135
申请日：1992-09-03
Applicant: Nobuyuki Kawai , Ikutaro Noji , Makoto Fukubayashi , Shozo Nakayama , Naoki Nakada , Kazuhiro Ishigami , Kazuya Takahashi
Inventor： Nobuyuki Kawai , Ikutaro Noji , Makoto Fukubayashi , Shozo Nakayama , Naoki Nakada , Kazuhiro Ishigami , Kazuya Takahashi
IPC: B60H1/32
CPC classification number: B60H1/3208
Abstract: In an engine idle speed control system associated with an air conditioner provided with an evaporator for evaporating a refrigerant compressed by a compressor actuated or deactuated by an engine near an evaporator freeze limit temperature, the engine idle speed is increased under consideration of thermal load applied to the compressor whenever the compressor is being actuated. The compressor 21 is deactuated when the temperature of air having passed through the evaporator 22 drops below a predetermined value, and actuated when the same temperature rises beyond another higher predetermined value. Whenever the compressor 21 has been deactuated, the time interval between the deactuation and the actuation of the compressor is measured. If the measured time interval is relatively short, since this indicates a relatively high thermal load applied to the compressor, the engine idle speed is increased. However, if the measured time interval is relatively long, since this indicates a relatively low thermal load, the engine idle speed is not increased, thus improving the fuel consumption rate and the compressor durability without frequently actuating and deactuating the compressor.
Abstract translation: 在与具有蒸发器的空调机相关联的发动机空转速度控制系统中，蒸发器用于蒸发由靠近蒸发器冻结极限温度的发动机致动或停止的压缩机压缩的制冷剂，考虑到施加到 当压缩机被致动时的压缩机。 当已经通过蒸发器22的空气的温度下降到预定值以下时，压缩机21被停止，并且当相同的温度升高到超过另一较高的预定值时被致动。 每当压缩机21已经停用时，测量压缩机的停止和致动之间的时间间隔。 如果测量的时间间隔相对较短，由于这表示施加到压缩机的相对较高的热负荷，所以发动机怠速提高。 然而，如果测量的时间间隔相对较长，则由于这表示相对低的热负荷，所以发动机怠速不增加，从而在不频繁地驱动和停止压缩机的情况下提高燃料消耗率和压缩机的耐久性。
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公开(公告)号：US07563356B2
公开(公告)日：2009-07-21
申请号：US10549324
申请日：2004-03-12
Applicant: Osamu Nabeya , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Ikutaro Noji
Inventor： Osamu Nabeya , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Ikutaro Noji
CPC classification number: C25F7/00
Abstract: A composite processing apparatus which can securely process a conductive material, such as a copper film, at a low surface pressure and a high rate while effectively preventing the formation of pits is disclosed. The composite processing apparatus includes: a substrate holder for holding a substrate; a processing table including a mechanical processing section for processing a surface of the substrate by a processing method involving a mechanical action; and an electrolytic processing section which is separate from the mechanical processing section. The electrolytic processing section includes a processing electrode with an ion exchanger, for processing the substrate by applying a voltage between the processing electrode and the substrate while keeping the ion exchanger (92) in contact with the substrate. The composite processing apparatus also includes a liquid supply section for supplying a liquid between the substrate and the processing electrode, and between the substrate and the mechanical processing section; and a drive section for moving the substrate and the processing table relative to each other.
Abstract translation: 公开了一种复合处理装置，其能够在有效地防止凹坑形成的同时，以低表面压力和高速度可靠地处理诸如铜膜的导电材料。 复合处理装置包括：用于保持基板的基板保持件; 一种处理台，包括用于通过涉及机械动作的处理方法来处理所述基板的表面的机械处理部分; 以及与机械加工部分开的电解处理部。 电解处理部包括具有离子交换器的处理电极，用于通过在保持离子交换器（92）与基板接触的同时在处理电极和基板之间施加电压来处理基板。 所述复合处理装置还包括用于在所述基板和所述处理电极之间以及所述基板和所述机械加工部之间供给液体的液体供给部; 以及用于相对于彼此移动所述基板和所述处理台的驱动部。
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