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    PROCESSING APPARATUS HAVING FOUR PROCESSING UNITS
    1.
    发明申请
    PROCESSING APPARATUS HAVING FOUR PROCESSING UNITS 有权
    具有四个加工单元的加工设备

    公开(公告)号：US20120088441A1

    公开(公告)日：2012-04-12

    申请号：US13271731

    申请日：2011-10-12

    申请人： Satoshi Yamanaka ,  Toshiyasu Rikiishi ,  Nobuyuki Takada

    发明人： Satoshi Yamanaka ,  Toshiyasu Rikiishi ,  Nobuyuki Takada

    IPC分类号： B24B41/06

    CPC分类号： B24B37/30 ,  B24B7/228 ,  H01L21/304

    摘要： A processing apparatus including a turn table rotatably provided and having an opening; at least five chuck tables provided on the turn table, each chuck table having a holding surface for holding a workpiece; a support bed inserted through the opening of the turn table; four processing unit supporting mechanisms each including a first support column provided on the outside of the turn table, a second support column provided on the support bed, and a support member mounted to the first and second support columns; four processing units respectively supported to the four processing unit supporting mechanisms, the four processing units respectively corresponding to four ones of the at least five chuck tables; and four feeding units for respectively moving the four processing units in a direction perpendicular to the holding surfaces of the chuck tables.

    摘要翻译： 一种加工设备，包括可旋转地设置并具有开口的转台; 设置在转台上的至少五个卡盘台，每个卡盘台具有用于保持工件的保持表面; 通过转台的开口插入的支撑床; 四个处理单元支撑机构，每个包括设置在转台的外侧上的第一支撑柱，设置在支撑床上的第二支撑柱和安装到第一和第二支撑柱的支撑构件; 四个处理单元分别支撑在四个处理单元支撑机构上，四个处理单元分别对应于至少五个卡盘表中的四个; 以及四个进给单元，用于分别沿着与卡盘台的保持表面垂直的方向移动四个处理单元。

    Polishing apparatus
    2.
    发明申请
    Polishing apparatus 有权
    抛光设备

    公开(公告)号：US20050159082A1

    公开(公告)日：2005-07-21

    申请号：US11078495

    申请日：2005-03-14

    申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

    发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

    IPC分类号： B24B37/04 ,  H01L21/306 ,  B24B49/00

    CPC分类号： B24B37/345 ,  B24B37/042 ,  H01L21/30625

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

    摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构 在至少三个清洁装置之间。 抛光装置还包括旋转输送器，其设置在可由所述顶环接近的位置，并且具有从旋转运送器的旋转中心定位在预定圆周上的多个部分，用于保持工件。

    Substrate holding apparatus
    3.
    发明申请
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US20050118935A1

    公开(公告)日：2005-06-02

    申请号：US11028629

    申请日：2005-01-05

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  B24B41/06 ,  H01L21/304 ,  B24B1/00

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

    Polishing apparatus
    6.
    发明授权
    Polishing apparatus 有权
    抛光设备

    公开(公告)号：US06558226B1

    公开(公告)日：2003-05-06

    申请号：US09643882

    申请日：2000-08-23

    申请人： Nobuyuki Takada ,  Tetsuji Togawa

    发明人： Nobuyuki Takada ,  Tetsuji Togawa

    IPC分类号： B24B500

    CPC分类号： B24B37/105 ,  B24B53/017

    摘要： There is disclosed a polishing apparatus comprising: a polishing table having a first axis and a counterweight provided on the polishing table. The polishing table is adapted to be subjected to a circular orbital motion in which the first axis of the polishing table is rotated about an orbit center axis while the orientation of the polishing table is kept substantially constant. The counterweight cancels a centrifugal force generated by the circular orbital motion of the polishing table.

    摘要翻译： 公开了一种抛光装置，包括：抛光台，其具有设置在抛光台上的第一轴和配重。 抛光台适于进行圆周轨道运动，其中抛光台的第一轴线围绕轨道中心轴线旋转，同时抛光台的取向基本保持不变。 配重消除由抛光台的圆周轨道运动产生的离心力。

    Substrate holding apparatus
    8.
    发明授权
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US07850509B2

    公开(公告)日：2010-12-14

    申请号：US12285936

    申请日：2008-10-16

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B7/22

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于接触弹性垫的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

    Carrier device in polishing apparatus and method for controlling carrier device
    10.
    发明授权
    Carrier device in polishing apparatus and method for controlling carrier device 有权
    抛光装置中的载体装置及载体装置的控制方法

    公开(公告)号：US06241578B1

    公开(公告)日：2001-06-05

    申请号：US09357843

    申请日：1999-07-21

    申请人： Tetsuji Togawa ,  Nobuyuki Takada

    发明人： Tetsuji Togawa ,  Nobuyuki Takada

    IPC分类号： B24B900

    CPC分类号： B24D15/02 ,  B24B37/013 ,  B24B41/061 ,  B24B49/16

    摘要： A carrier device is adapted for use in a polishing apparatus with a turntable having a polishing surface. The carrier device includes a carrier for carrying an article to be polished and a control device operatively associated with the carrier. The control device includes an actuator operable to cause the carrier to urge the article against the polishing surace of the turntable to polish the article, a sensor operatively associated with the actuator and operable to sense a pressure as applied to the article when the article is urged against the polishing surface of the turntable and a control unit operatively associated with the actuator and the sensor so as to monitor the pressure during a polishing operation. The control unit is operable to control operation of the actuator in response to the pressure as monitored so as to keep the pressure at a target level and halt the polishing operation when the pressure is deviated from a predetermined range over a predetermined period of time.

    摘要翻译： 载体装置适用于具有抛光表面的转台的抛光装置。 载体装置包括用于承载待抛光制品的载体和与载体可操作地相关联的控制装置。 所述控制装置包括致动器，所述致动器可操作以使所述载体将所述物品推向所述转盘的抛光轮廓以抛光所述物品，所述传感器与所述致动器可操作地相关联并且可操作以感测当所述物品被推动时施加到所述物品上的压力 抵靠转盘的抛光表面和与致动器和传感器可操作地相关联的控制单元，以便在抛光操作期间监测压力。 控制单元可操作以响应于所监视的压力来控制致动器的操作，以便当压力在预定时间段内偏离预定范围时将压力保持在目标水平并停止抛光操作。