公开(公告)号：US07122887B2

公开(公告)日：2006-10-17

申请号：US10634447

申请日：2003-08-05

申请人： Martin Standing ,  Hazel D Schofield

发明人： Martin Standing ,  Hazel D Schofield

IPC分类号： H01L23/48

CPC分类号： H01L23/492 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/544 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/1147 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/73153 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/3025 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom.

公开(公告)号：US07821133B2

公开(公告)日：2010-10-26

申请号：US11586902

申请日：2006-10-26

申请人： Hazel D. Schofield ,  Slawomir Skocki ,  Philip Adamson

发明人： Hazel D. Schofield ,  Slawomir Skocki ,  Philip Adamson

IPC分类号： H01L21/461 ,  H01L29/12

CPC分类号： H01L24/81 ,  H01L24/13 ,  H01L24/14 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/14051 ,  H01L2224/81194 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/013

摘要： A flip chip Schottky die is provided, which includes three contact bumps extending from a top surface of the die for electrically connecting with a board, a first and second bump being cathode contacts, and a third bump being an anode contact and having a larger surface than each of the first and second bumps for a 0.5 ampere device. Each bump is substantially rectangular at its base, but may have a curved or arched top surface on a square die. Also, provided is a contact bump useful in a flip chip device, such as a MOSFET or diode for a current of 1.0 amperes that includes a solder body of PbSn or a solder body free of lead comprising SnAgCu. Such a contact bump is substantially rectangular, and a height of approximately 120 μm.

摘要翻译： 提供了一种倒装芯片肖特基晶片，其包括从芯片的顶表面延伸的三个接触凸块，用于与板电连接，第一和第二凸块为阴极触点，第三凸块为阳极触点，并具有较大的表面 比0.5安培装置的第一和第二凸起的每一个。 每个凸块在其基部处基本上是矩形的，但是在正方形模具上可以具有弯曲或拱形的顶表面。 此外，提供了一种用于倒装芯片器件的触点凸块，例如用于1.0安培的电流的MOSFET或二极管，其包括PbSn的焊料体或不含SnAgCu的焊料的焊料体。 这种接触凸块基本上是矩形的，高度约为120μm。

公开(公告)号：US07745930B2

公开(公告)日：2010-06-29

申请号：US11409679

申请日：2006-04-24

申请人： Norman Glyn Connah ,  Mark Pavier ,  Phillip Adamson ,  Hazel D Schofield

发明人： Norman Glyn Connah ,  Mark Pavier ,  Phillip Adamson ,  Hazel D Schofield

IPC分类号： H01L23/34

CPC分类号： H01L23/49527 ,  H01L23/15 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/4951 ,  H01L23/49531 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48644 ,  H01L2224/48744 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73255 ,  H01L2224/85207 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/30107 ,  H03K17/567 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device package includes a substrate with one or more pads and at least one semiconductor device that has one or more of its electrodes electrically connected to the substrate pads. The package also includes one or more terminals in electrical connection with the substrate pads and that provide for external connection to the device.

摘要翻译： 半导体器件封装包括具有一个或多个焊盘的衬底和至少一个半导体器件，其具有电连接到衬底焊盘的一个或多个电极。 封装还包括与衬底焊盘电连接的一个或多个端子，并且提供与设备的外部连接。