发明授权
US07745930B2 Semiconductor device packages with substrates for redistributing semiconductor device electrodes
有权
具有用于重新分配半导体器件电极的衬底的半导体器件封装
- 专利标题： Semiconductor device packages with substrates for redistributing semiconductor device electrodes
- 专利标题（中）： 具有用于重新分配半导体器件电极的衬底的半导体器件封装
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申请号： US11409679申请日： 2006-04-24
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公开(公告)号： US07745930B2公开(公告)日： 2010-06-29
- 发明人: Norman Glyn Connah , Mark Pavier , Phillip Adamson , Hazel D Schofield
- 申请人： Norman Glyn Connah , Mark Pavier , Phillip Adamson , Hazel D Schofield
- 申请人地址： US CA El Segundo
- 专利权人： International Rectifier Corporation
- 当前专利权人： International Rectifier Corporation
- 当前专利权人地址： US CA El Segundo
- 代理机构： Farjami & Farjami LLP
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A semiconductor device package includes a substrate with one or more pads and at least one semiconductor device that has one or more of its electrodes electrically connected to the substrate pads. The package also includes one or more terminals in electrical connection with the substrate pads and that provide for external connection to the device.
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