摘要:
An image forming method includes a first step of irradiating a beam onto an object, and using an intensity corresponding to an image area onto which the beam was irradiated as an intensity of a pixel at the center of the image area, and scanning a beam throughout the inspection area of the object to obtain an image within the inspection area as a collection of pixels arranged at intervals smaller than a beam diameter; and a second step of assigning a pixel to be processed and neighboring pixels with coefficients in accordance with a beam intensity distribution, multiplying the intensity of each pixel by each assigned coefficient, determining a new intensity of the pixel to be processed in accordance with the sum of respective products, and repeating the new intensity determining process for all pixels necessary to be processed. In the second step, the value of the coefficients for those pixels except on the scanning direction may be reduced. Further, a third step may be provided for linearly-transforming the intensities so as to make the intensities of respective pixels to be distributed within a predetermined range.
摘要:
Before detecting the surface state of specific patterns a sample by means of an electron beam tester system, patterns formed in a specified surface area of the sample, are detected by deflecting an electron beam by a deflection coil. Data representing current supplied to the deflection coil, data representing the position of the sample during the pattern-detecting operation, and image signals representing the patterns found in the specified surface area, are stored in a memory. While the specific patterns of a sample are being detected, the electron beam is used to perform a second pattern-detecting operation. Data representing current supplied to the deflection coil during the second pattern-detecting operation, such data representing the position of the sample, and image signals provided by the second pattern-detecting operation representing the patterns formed in the specified surface area, afe compared with those data items already stored in the memory. From the difference between the compared two sets of data items, any drift in the electron beam is calculated. In accordance with the drift thus calculated, the deflection coil is energized to deflec the electron beam such that the beam is applied onto the desired portion of the sample.
摘要:
In an operation of a pattern dimension measuring system comprising a stage, an electron gun part, electron lens systems for scanning electron beam on a sample and having a MOL mechanism thereto, a secondary electron detector for detecting secondary electrons and so forth emitted from the sample, and a host computer having a pattern dimension measuring part, the stage is moved at a constant velocity, the coordinates of the stage is measured by a laser interferometer in real time, the variation in working distance of the electron beam is measured in real time by the optical lever system from a focal length measuring part to be fed back to a stage control part and an objective lens. When a pattern serving as an object to be measured reaches a region capable of scanning, the electron beam is scanned in the best focus while moving the scanning start position of the electron beam in synchronism with the constant velocity movement of the stage, so that the SEM image thereof is acquired.
摘要:
To prevent electric charge up from being accumulated on the plane scanned by an electron beam and further to improve the S/N ratio, an electron beam irradiating apparatus comprising: position information signal outputting section for outputting position information signals, in sequence to designate positions at which an electron beam is irradiated on a plane scanned by the electron beam, so as to designate the irradiation positions at random; and irradiation controller for controlling the electron beam to irradiate the electron beam at the irradiation positions in response to the outputted position information signals. Further, to integrate an photoelectric signal over a sufficient time interval within the period of the pixel clock signal, the electric signal detecting circuit comprises a plurality of sample hold circuits and a selecting circuit for selecting and activating the sample hold circuits in sequence.
摘要:
An automatic focusing method for scanning electron microscopy. A scanning electron microscope is set in a low magnification mode to detect a taper portion of an object to be observed. The beam scanning whose direction is perpendicular to the taper portion is effected whenever objective lens control condition is changed at a first pitch, and the secondary electron signals obtained under these conditions are converted into video signals. The video signals are differential smoothed to calculate a sum of video signal absolute values. On the basis of the sum of the absolute values, an optimum objective lens control condition in the low magnification mode can be obtained. Sequentially, the microscope is set to a high magnification mode, and the objective lens control condition is further changed at a second pitch within a predetermined range with the optimum control condition in the low magnification mode as the center of the range. The beam scanning whose direction is perpendicular to the taper portion is effected. In the same way as in the low magnification mode, the secondary electrons signal obtained under these conditions are converted into video signals to obtain the optimum objective lens control condition in the high magnification mode. The optimum control condition obtained in the high magnification mode is determined as the control condition to determine the focal distance of the objective lens.
摘要:
A method for measuring a size of fine pattern wherein sizes of a plurality of fine patterns are measured using a scanning electron microscope is disclosed. The measuring method comprises the following procedures of obtaining a secondary electron image while scanning an electron beam on a fine pattern, determining whether or not the secondary electron image thus obtained meets a shape judgment criterion which has been set in advance, and, when the criterion is met as a result of determination processing, measuring a size of the fine pattern but, when the criterion is not met as a result of determination processing, moving to a next measurement area without measuring a size of the fine pattern.
摘要:
Analog image data a SEM are converted into digital data, and are processed by a spatial filtering processing, histogram processing, threshold value setting, three-valued image data processing, noise reduction and the like. Area of a pattern in the three-valued image data is calculated by a labelling and calculation processing, and a pattern is sequentially detected by comparing the area of the pattern with a reference area value. The comparison and detection of the same or similar patterns repeated in the SEM image are performed by using the area of the pattern, and are not performed by a shape of the pattern, thereby resulting a precise detection at high speed by using a microprocessor. Since it is possible to perform a pattern recognition from the area value even though the pattern does not have a characteristic, it is possible to precisely detect and recognize a pattern image in high speed.
摘要:
The fluorescent X-ray generated by elements when an X-ray is total reflected from a substrate surface is detected by a fluorescent X-ray detecting circuit; the fluorescent X-ray peak generated by the substrate element and the fluorescent X-ray peaks generated by contaminative elements are separated by a peak separating circuit; an integral intensity I.sub.0 of the fluorescent X-ray peak generated by the substrate element and integral intensities I of the fluorescent X-ray peaks generated by the contaminative elements are calculated by an integral intensity calculating circuit, respectively; and contaminative element concentrations N=N.sub.0 .multidot.(.eta..sub.0 / I.sub.0).multidot.(I / .eta.) (where N.sub.0 denotes the surface concentration of the substrate; .eta..sub.0 denotes the fluorescent yield of the substrate; and .eta. denotes the fluorescent yield of the contaminative elements) are calculated by a contaminative element concentration calculating circuit on the basis of the calculated integral intensities I.sub.0 and I. The contaminative elements can be analyzed non-destructively without use of any analytical curves, so that it is possible to save much labor required to prepare the analytical curves.
摘要:
In the method and apparatus for analyzing contaminative element concentrations, a fluorescent X-ray generated by elements when an X-ray is total reflected from the surface of a substrate is detected by a fluorescent X-ray detector; a peak of the fluorescent X-ray generated by a substrate element and peaks of the fluorescent X-ray generated by other contaminative elements are separated from the detected fluorescent X-ray waveform by a peak separating circuit; and the concentrations of the detected contaminative elements are calculated on the basis of the separated peaks by a calculating circuit. In the peak detection, in particular, the peaks of the contaminative elements to be analyzed are detected from the waveform. When other peaks are present within a predetermed number of channels (energy eV) before and after each detected peak, the channel numbers and the signal intensities between the respective peaks are extracted. Further, the a true peak is determined after obtaining the evaluation values of the respective peaks, so that it is possible to separate peaks from the fluorescent X-ray waveform accurately, even if each peak is split in the observed waveform.
摘要:
Element identification and concentration calculation can be conducted with precision by correcting waveform distortion caused by the energy resolution of a detection system. A smoothing process is effected on a measured waveform of fluorescent X-rays obtained from an object to be measured. A device function of the detection system is obtained for each analytic element, based on the energy resolution of the detection system for a fluorescent X-ray energy value of each analytic element. A deconvolution process is effected on the measured waveform thus smoothed, by using the device functions of the detection system. Analytic elements are identified and concentrations of the analytic elements are obtained from the waveform data after the deconvolution process. The measured waveform is compensated for absorption in a beryllium window prior to smoothing.