公开(公告)号：US07834409B2

公开(公告)日：2010-11-16

申请号：US11883671

申请日：2006-01-25

申请人： Frank Reichenbach ,  Franz Laermer ,  Silvia Kronmueller ,  Christoph Schelling ,  Tino Fuchs ,  Christina Leinenbach

发明人： Frank Reichenbach ,  Franz Laermer ,  Silvia Kronmueller ,  Christoph Schelling ,  Tino Fuchs ,  Christina Leinenbach

IPC分类号： H01L29/82 ,  H01L21/00

CPC分类号： G01L9/0073 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00182 ,  G01L9/0042 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

摘要： A micromechanical component having a conductive substrate, an elastically deflectable diaphragm including at least one conductive layer, which is provided over a front side of the substrate, the conductive layer being electrically insulated from the substrate, a hollow space, which is provided between the substrate and the diaphragm and is filled with a medium, and a plurality of perforation openings, which run under the diaphragm through the substrate, the perforation openings providing access to the hollow space from a back surface of the substrate, so that a volume of the medium located in the hollow space may change when the diaphragm is deflected. Also described is a corresponding manufacturing method.

摘要翻译： 一种具有导电基底的微机械元件，包括至少一个导电层的弹性可偏转隔膜，该导电层设置在基板的前侧，导电层与基板电绝缘，中空空间设置在基板 和隔膜，并且填充有介质，以及多个穿孔，其在隔膜下方穿过基底，穿孔开口提供从基底的背面进入中空空间，使得一定体积的介质 当隔膜偏转时，位于中空空间中的位置可能会改变。 还描述了相应的制造方法。

公开(公告)号：US07273764B2

公开(公告)日：2007-09-25

申请号：US11028370

申请日：2005-01-03

申请人： Frank Reichenbach ,  Stefan Pinter ,  Frank Henning ,  Hans Artmann ,  Helmut Baumann ,  Franz Laemer ,  Michael Offenberg ,  Georg Bischopink

发明人： Frank Reichenbach ,  Stefan Pinter ,  Frank Henning ,  Hans Artmann ,  Helmut Baumann ,  Franz Laemer ,  Michael Offenberg ,  Georg Bischopink

IPC分类号： H01L21/00

CPC分类号： B81C1/00293 ,  B81B2201/0228 ,  B81B2207/095 ,  B81C2201/0115 ,  B81C2203/0136 ,  B81C2203/0145

摘要： The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor. It is provided that in the sensor of the invention, the covering (13) comprises a first layer (32) (deposition layer) that is permeable to an etching medium and the reaction products, and a hermetically sealing second layer (34) (sealing layer) located above it, and that in the method of the invention, at least the sensor chamber (28) present in the foundation wafer (11) after the establishment of the structure (26) is filled with an oxide (30), in particular CVD oxide or porous oxide; the sensor chamber (28) is covered by a first layer (32) (deposition layer), in particular of polysilicon, that is transparent to an etching medium and the reaction products or is retroactively made transparent; the oxide (30) in the sensor chamber (28) is removed through the deposition layer (32) with the etching medium; and next, a second layer (34) (sealing layer), in particular of metal or an insulator, is applied to the deposition layer (32) and hermetically seals off the sensor chamber (28).

摘要翻译： 本发明涉及具有至少一个硅基微机械结构的传感器，其与基础晶片的传感器室结合，并且在传感器室的区域中具有覆盖基础晶片的至少一个覆盖物，以及至少一个 传感器的制造方法 设置在本发明的传感器中，覆盖物（13）包括可蚀刻介质和反应产物的第一层（沉积层）和密封的第二层（34）（密封 层），并且在本发明的方法中，在建立结构（26）之后，至少存在于基础晶片（11）中的传感器室（28）填充有氧化物（30），其中 特定的CVD氧化物或多孔氧化物; 传感器室（28）由对蚀刻介质和反应产物透明的或者具有回溯性的透明的第一层（32）（沉积层）（特别是多晶硅）覆盖; 传感器室（28）中的氧化物（30）通过蚀刻介质通过沉积层（32）去除; 接下来，将特别是金属或绝缘体的第二层（34）（密封层）施加到沉积层（32）并气密地密封传感器室（28）。

公开(公告)号：US08329555B2

公开(公告)日：2012-12-11

申请号：US12734994

申请日：2008-10-20

申请人： Frank Reichenbach ,  Franz Laermer ,  Silvia Kronmueller ,  Andreas Scheurle

发明人： Frank Reichenbach ,  Franz Laermer ,  Silvia Kronmueller ,  Andreas Scheurle

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  H01L21/76879 ,  H01L21/76898 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13025 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.

摘要翻译： 一种用于制造具有至少一个盖的传感器的封盖晶片的方法包括：产生通过晶片延伸的接触通孔，并且在其后随后通过导电材料填充接触通孔。

公开(公告)号：US20110012248A1

公开(公告)日：2011-01-20

申请号：US12734994

申请日：2008-10-20

申请人： Frank Reichenbach ,  Franz Laermer ,  Silvia Kronmueller ,  Andreas Scheurle

发明人： Frank Reichenbach ,  Franz Laermer ,  Silvia Kronmueller ,  Andreas Scheurle

IPC分类号： H01L23/15 ,  H01L21/60 ,  H01R9/00 ,  B05D5/12 ,  C25D5/02

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  H01L21/76879 ,  H01L21/76898 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13025 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.

摘要翻译： 一种用于制造具有至少一个盖的传感器的封盖晶片的方法包括：产生通过晶片延伸的接触通孔，并且在其后随后通过导电材料填充接触通孔。

公开(公告)号：US07495328B2

公开(公告)日：2009-02-24

申请号：US11493702

申请日：2006-07-24

申请人： Frank Reichenbach ,  Freider Haag ,  Arnd Kaelberer

发明人： Frank Reichenbach ,  Freider Haag ,  Arnd Kaelberer

IPC分类号： H01L23/22 ,  H01L23/24

CPC分类号： B81C1/00333 ,  H01L21/565 ,  H01L23/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/00

摘要： A micromechanical component has a structure such that a material flow is guided from at least one preferred direction for the purpose of uniformly enveloping the micromechanical component.

摘要翻译： 微机械部件具有使得材料流从至少一个优选方向引导以便均匀地包封微机械部件的结构。

公开(公告)号：US20080061237A1

公开(公告)日：2008-03-13

申请号：US11631249

申请日：2005-05-11

申请人： Jochen Franz ,  Frank Reichenbach ,  Dieter Maurer ,  Holger Hoefer ,  Mark-Alexander Schweiker

发明人： Jochen Franz ,  Frank Reichenbach ,  Dieter Maurer ,  Holger Hoefer ,  Mark-Alexander Schweiker

IPC分类号： G01J5/02

CPC分类号： G01J5/0014 ,  G01J5/02 ,  G01J5/0225 ,  G01J5/024 ,  G01J5/045 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0803 ,  G01J5/0831 ,  G01J5/0875 ,  G01J5/12 ,  G01N21/3504 ,  G01N2021/3137 ,  G01N2021/317

摘要： An infrared sensor having at least one measuring structure, which has, for example, a sensor chip having a measuring structure and a cap chip which is attached to the sensor chip and, together with the sensor chip, defines a sensor space; a screen having an internal screen area and an external screen area surrounding the internal screen area being formed on the top side of the cap chip; the internal screen area which is transparent to the infrared radiation to be detected being formed above the measuring structure, and the external screen area being at least partly non-transparent for the incident infrared radiation. The external screen area may be designed in particular as a reflective coating of metal or a dielectric layer, as reflective structuring formed by trenches having oblique surfaces, or as absorbing structuring.

摘要翻译： 具有至少一个测量结构的红外传感器，其具有例如具有测量结构的传感器芯片和附接到传感器芯片的帽芯片，并且与传感器芯片一起限定传感器空间; 具有内部屏幕区域的屏幕和围绕内部屏幕区域的外部屏幕区域形成在盖芯片的顶侧上; 在测量结构上方形成对要检测的红外线辐射透明的内部屏幕区域，并且外部屏幕区域对于入射的红外辐射至少部分不透明。 外部屏幕区域可以特别设计为金属或电介质层的反射涂层，作为由具有倾斜表面的沟槽形成的反射结构，或者作为吸收结构。

公开(公告)号：US20080053254A1

公开(公告)日：2008-03-06

申请号：US10563993

申请日：2005-01-14

申请人： Frank Reichenbach ,  Holger Hoefer

发明人： Frank Reichenbach ,  Holger Hoefer

IPC分类号： G01D21/00 ,  G01N7/00 ,  G01P15/00 ,  H01S4/00

CPC分类号： G01N21/3504 ,  G01J1/0204 ,  G01J1/04 ,  G01J5/12 ,  G01N2021/3177 ,  G01P1/023 ,  G01P15/18 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention relates to a microstructured sensor, having at least one measurement chip in which there is formed a first measurement area having a first measurement structure and a second measurement area having a second measurement structure, the measurement areas being offset to one another in a lateral direction, one cap chip that is fastened in vacuum-tight fashion to the measurement chip in a connecting area, one intermediate space, formed between the measurement chip and the cap chip, that is sealed outwardly by the connecting area and in which the measurement areas are situated, and at least one contact area, formed on the measurement chip, and left exposed by the cap chip, for the contacting of the measurement chip. The sensor can be in particular a gas sensor for measuring a gas concentration, or an acceleration sensor.

摘要翻译： 本发明涉及一种微结构传感器，其具有至少一个测量芯片，其中形成具有第一测量结构的第一测量区域和具有第二测量结构的第二测量区域，测量区域在侧向相互偏移 方向，一个在与测量芯片和盖芯片之间形成的连接区域中的测量芯片以真空密封方式固定的一个盖芯片，其由连接区域向外密封，并且测量区域 并且至少一个接触区域形成在测量芯片上，并且被盖芯片暴露以使测量芯片接触。 传感器可以特别地用于测量气体浓度的气体传感器或加速度传感器。

公开(公告)号：US06955975B2

公开(公告)日：2005-10-18

申请号：US10433525

申请日：2002-09-05

申请人： Frank Reichenbach ,  Frank Fischer ,  Ralf Hausner ,  Frieder Haag ,  Eckhard Graf ,  Markus Lutz

发明人： Frank Reichenbach ,  Frank Fischer ,  Ralf Hausner ,  Frieder Haag ,  Eckhard Graf ,  Markus Lutz

IPC分类号： B29C65/16 ,  B29C65/60 ,  B81C1/00 ,  H01L21/20 ,  H01L21/58 ,  H01L21/60 ,  H01L21/762 ,  H01L21/30 ,  H01L21/46

CPC分类号： B29C65/1635 ,  B29C65/1612 ,  B29C65/1683 ,  B29C65/608 ,  B29C66/1122 ,  B29C66/12421 ,  B29C66/472 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/712 ,  B29C66/7392 ,  B29K2083/00 ,  B29L2031/756 ,  B81C1/00269 ,  B81C1/00357 ,  B81C2201/019 ,  B81C2203/019 ,  H01L21/2007 ,  H01L21/76251 ,  H01L24/83 ,  H01L2224/80224 ,  H01L2224/80365 ,  H01L2224/80379 ,  H01L2224/804 ,  H01L2224/80488 ,  H01L2224/83224 ,  H01L2224/834 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83466 ,  H01L2224/83471 ,  H01L2224/83487 ,  H01L2224/8349 ,  H01L2224/83801 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for joining a silicon plate to a second plate, a laser beam being directed through the silicon plate at the second plate. In the process, the wavelength of the laser beam is selected in such a way that only a negligibly small amount of energy is absorbed in the silicon plate. A strongly absorbent material is hotmelted by the laser beam's energy and then produces a bond between the silicon plate and the second plate.

摘要翻译： 一种用于将硅板接合到第二板的方法，激光束被引导通过硅板在第二板。 在该过程中，激光束的波长以这样一种方式选择，即在硅板中仅吸收可忽略的少量能量。 强吸收性材料被激光束的能量热熔化，然后在硅板和第二板之间产生粘结。

公开(公告)号：US08698255B2

公开(公告)日：2014-04-15

申请号：US13262905

申请日：2010-04-06

申请人： Frank Reichenbach ,  Arnim Hoechst ,  Thomas Buck

发明人： Frank Reichenbach ,  Arnim Hoechst ,  Thomas Buck

IPC分类号： H01L29/84

CPC分类号： B81B3/0008 ,  B81B2201/0257 ,  H04R19/005 ,  H04R19/016

摘要： A simple and cost-effective form of implementing a semiconductor component having a micromechanical microphone structure, including an acoustically active diaphragm as a deflectable electrode of a microphone capacitor, a stationary, acoustically permeable counterelement as a counter electrode of the microphone capacitor, and means for applying a charging voltage between the deflectable electrode and the counter electrode of the microphone capacitor. In order to not impair the functionality of this semiconductor component, even during overload situations in which contact occurs between the diaphragm and the counter electrode, the deflectable electrode and the counter electrode of the microphone capacitor are counter-doped, at least in places, so that they form a diode in the event of contact. In addition, the polarity of the charging voltage between the deflectable electrode and the counter electrode is such that the diode is switched in the blocking direction.

摘要翻译： 实现具有微机械麦克风结构的半导体部件的简单和成本有效的形式，包括作为麦克风电容器的可偏转电极的声学活动光圈，作为麦克风电容器的对电极的静止的，声学可渗透的反射器，以及用于 在麦克风电容器的可偏转电极和对电极之间施加充电电压。 为了不损害该半导体元件的功能，即使在隔膜和对电极之间发生接触的过载情况下，麦克风电容器的可偏转电极和对电极至少在某些地方相互掺杂 它们在接触的情况下形成二极管。 此外，可偏转电极和对电极之间的充电电压的极性使得二极管在阻挡方向上被切换。

公开(公告)号：US20130182558A1

公开(公告)日：2013-07-18

申请号：US13786580

申请日：2013-03-06

申请人： Pal Orten ,  Frank Reichenbach

发明人： Pal Orten ,  Frank Reichenbach

IPC分类号： H04W84/18

CPC分类号： H04W84/18 ,  H04W84/20

摘要： A method for maintaining network lifetime of a wireless network in wireless communication system, the network including a plurality of device nodes. Selected ones of the wireless nodes have assigned roles in the wireless network. To improve and maintain network lifetime the method includes determining a below threshold operating condition of a first sensor node assigned to a first role and re-assigning the first role to another second node in said network. In other aspects of the invention a method, system and a computer program for carrying out the method are described.

摘要翻译： 一种用于在无线通信系统中维持无线网络的网络寿命的方法，所述网络包括多个设备节点。 所选择的无线节点已经在无线网络中分配了角色。 为了改善和维持网络寿命，该方法包括确定分配给第一角色的第一传感器节点的低于阈值操作条件并将第一角色重新分配给所述网络中的另一第二节点。 在本发明的其他方面，描述了用于执行该方法的方法，系统和计算机程序。