公开(公告)号：US20190219449A1

公开(公告)日：2019-07-18

申请号：US16365026

申请日：2019-03-26

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Koichi KUSUKAME ,  Nawatt SILAWAN ,  Aki YONEDA

IPC分类号： G01J5/20 ,  G01J5/08 ,  G01J5/04 ,  G01J5/02

CPC分类号： G01J5/20 ,  G01J5/0205 ,  G01J5/04 ,  G01J5/045 ,  G01J5/047 ,  G01J5/048 ,  G01J5/0806 ,  G01J5/089 ,  G01J2005/202

摘要： An infrared detecting device includes: an infrared sensor that has one or more infrared detection elements arranged in one or more columns; and an IC chip that performs signal processing on a signal output from the infrared sensor. The infrared sensor and the IC chip are generally juxtaposed in a direction along a scan rotation axis of the infrared sensor.

公开(公告)号：US20180226530A1

公开(公告)日：2018-08-09

申请号：US15939636

申请日：2018-03-29

申请人： Heptagon Micro Optics Pte. Ltd.

发明人： Hartmut Rudmann ,  Markus Rossi

IPC分类号： H01L31/16 ,  H01L31/167 ,  G01J1/02 ,  G01J1/04 ,  G01J1/06 ,  H01L31/0232 ,  H01L27/146 ,  H01L25/16 ,  G02B13/00 ,  G02B3/00 ,  G01J5/20 ,  G01J5/08 ,  G01J5/04 ,  G01J5/02 ,  G01J5/00 ,  G01J1/42 ,  B29D11/00

CPC分类号： H01L31/16 ,  B29D11/00298 ,  B29D11/00307 ,  G01J1/0209 ,  G01J1/0233 ,  G01J1/0271 ,  G01J1/0411 ,  G01J1/06 ,  G01J1/42 ,  G01J5/00 ,  G01J5/022 ,  G01J5/0235 ,  G01J5/024 ,  G01J5/0265 ,  G01J5/045 ,  G01J5/0806 ,  G01J5/20 ,  G01J2001/061 ,  G02B3/0031 ,  G02B3/0056 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14687 ,  H01L31/02325 ,  H01L31/167 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

摘要： Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

公开(公告)号：US09989409B2

公开(公告)日：2018-06-05

申请号：US14964927

申请日：2015-12-10

申请人： MELEXIS TECHNOLOGIES NV

发明人： Appolonius Jacobus Van Der Wiel

IPC分类号： G01J1/42 ,  G01J1/16 ,  G01J5/02 ,  G01J5/04 ,  G01J5/06 ,  G01J5/12 ,  G01J5/14 ,  G01J5/20

CPC分类号： G01J1/4228 ,  G01J1/1626 ,  G01J5/0225 ,  G01J5/024 ,  G01J5/0285 ,  G01J5/045 ,  G01J5/06 ,  G01J5/061 ,  G01J5/12 ,  G01J5/14 ,  G01J5/20 ,  G01J2005/0048 ,  G01J2005/063 ,  G01J2005/065 ,  G01J2005/066 ,  G01J2005/068

摘要： A semiconductor device for measuring IR radiation is disclosed. It comprises a substrate and a cap enclosing a cavity, a sensor pixel in the cavity, comprising a first absorber for receiving said IR radiation, a first heater, first temperature measurement means for measuring a first temperature; a reference pixel in the same cavity, comprising a second absorber shielded from said IR radiation, a second heater, and second temperature measurement means for measuring a second temperature; a control circuit for applying a first/second power to the first/second heater such that the first temperature equals the second temperature; and an output circuit for generating an output signal indicative of the IR radiation based on a difference between the first and second power.

公开(公告)号：US09929196B2

公开(公告)日：2018-03-27

申请号：US15400278

申请日：2017-01-06

申请人： Ulis ,  Commissariat A L'Energie Atomique Et Aux Energies Alternatives

发明人： Michel Vilain ,  Jérôme Favier ,  Jean-Jacques Yon ,  Laurent Frey

IPC分类号： G01J5/20 ,  G01J5/02 ,  H01L27/146 ,  G01J5/04

CPC分类号： H01L27/14618 ,  G01J5/024 ,  G01J5/045 ,  G01J5/20 ,  G01J2005/204 ,  H01L27/1462 ,  H01L27/14629 ,  H01L27/14649 ,  H01L27/14685 ,  H01L27/14687

摘要： A method of manufacturing a detector capable of detecting a wavelength range [λ8; λ14] centered on a wavelength λ10, including: forming said device on a substrate by depositing a sacrificial layer totally embedding said device; forming, on the sacrificial layer, a cap including first, second, and third optical structures transparent in said range [Δ8; λ14], the second and third optical structures having equivalent refraction indexes at wavelength λ10 respectively greater than or equal to 3.4 and smaller than or equal to 2.3; forming a vent of access to the sacrificial layer through a portion of the cap, and then applying, through the vent, an etching to totally remove the sacrificial layer.

公开(公告)号：US09857229B1

公开(公告)日：2018-01-02

申请号：US15188116

申请日：2016-06-21

申请人： MP High Tech Solutions Pty Ltd

发明人： Marek Steffanson

IPC分类号： H01L21/00 ,  G01J5/10 ,  B81C1/00

CPC分类号： G01J5/10 ,  B81C1/00142 ,  B81C1/0019 ,  B81C2201/0132 ,  G01J5/045 ,  G01J5/0806 ,  G01J5/40

摘要： A method of fabricating electromagnetic radiation detection devices including: forming a first mask on a substrate; forming a structural layer on the substrate using the first mask; forming a metallic layer overlying the structural layer; removing the first mask; forming a second mask on the substrate, the second mask comprising mask openings; selectively patterning the metallic layer using the mask openings; and removing the second mask.

公开(公告)号：US09851258B2

公开(公告)日：2017-12-26

申请号：US14671007

申请日：2015-03-27

申请人： Maxim Integrated Products, Inc.

发明人： Cheng-Wei Pei ,  Craig A. Easson ,  Arvin Emadi ,  Nicole D. Kerness ,  Stanley Barnett

IPC分类号： G01J5/00 ,  G01J5/12 ,  G01J5/04 ,  G01J5/06

CPC分类号： G01J5/12 ,  G01J5/045 ,  G01J5/06 ,  G01J2005/068

摘要： A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

公开(公告)号：US09748214B2

公开(公告)日：2017-08-29

申请号：US14887294

申请日：2015-10-19

申请人： Joseph Donald LaVeigne

发明人： Joseph Donald LaVeigne

IPC分类号： H01L25/16 ,  G01J1/44 ,  H01L27/146 ,  H01L31/18 ,  H01L33/00 ,  H01L33/62 ,  G01J5/02 ,  G01J5/20 ,  G01J5/04 ,  G01J5/10

CPC分类号： H01L25/167 ,  G01J1/44 ,  G01J5/02 ,  G01J5/024 ,  G01J5/045 ,  G01J5/20 ,  G01J2005/106 ,  G01J2005/202 ,  H01L27/14649 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  Y10T29/49002 ,  Y10T29/49117 ,  H01L2924/00

摘要： A first substrate having an array of emitters or detectors may be joined by bump bonding with a second substrate having read-in (RIIC) or read-out (ROIC) circuitry. After the two substrates are joined, the resulting assembly may be singulated to form sub-arrays such as tiles sub-arrays having pixel elements which may be arranged on a routing layer or carrier to form a larger array. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like.

公开(公告)号：US20170110641A1

公开(公告)日：2017-04-20

申请号：US15394464

申请日：2016-12-29

申请人： XINTEC INC.

发明人： Chien-Hung LIU

IPC分类号： H01L35/08 ,  H01L27/146 ,  H01L35/34 ,  H01L21/78 ,  H01L35/10

CPC分类号： H01L35/08 ,  G01J5/024 ,  G01J5/045 ,  G01J5/20 ,  H01L21/78 ,  H01L23/053 ,  H01L23/3178 ,  H01L23/3185 ,  H01L23/498 ,  H01L24/33 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/1876 ,  H01L35/02 ,  H01L35/10 ,  H01L35/34 ,  H01L2224/11

摘要： A semiconductor package includes a substrate, at lest one support, a cover, and a plate. The substrate has at least one light sensor or thermal sensor, a first surface, and a second surface opposite to the first surface. The light sensor or the thermal sensor is disposed on the first surface. The second surface has an opening to expose the light sensor (or the thermal sensor). The support is disposed on the first surface. The cover is disposed on the support, such that the cover is above the light sensor (or the thermal sensor) to form a first space between the cover and the light sensor (or the thermal sensor). The plate is placed on the second surface to cover the opening, such that a second space is formed between the plate and the light sensor (or the thermal sensor).

公开(公告)号：US09612159B2

公开(公告)日：2017-04-04

申请号：US14840320

申请日：2015-08-31

申请人： Mitsubishi Electric Corporation

发明人： Takaki Sugino

IPC分类号： G01J5/02 ,  G01J5/08 ,  G01J5/10 ,  G01J5/20 ,  G01J5/04 ,  G01J5/06 ,  G01J5/34

CPC分类号： G01J5/0853 ,  G01J5/045 ,  G01J5/06 ,  G01J5/0818 ,  G01J5/0831 ,  G01J5/0875 ,  G01J5/10 ,  G01J5/20 ,  G01J2005/345

摘要： An infrared sensor includes: a package; an infrared detecting element formed on the package, the infrared detecting element including a thermal detector and an absorber formed on the thermal detector which is configured to absorb infrared light rays of a specific wavelength that are detected by conversion of the infrared light rays into heat; and a cap formed on the package to cover the infrared detecting element, the cap including: a body having front and rear surfaces, through which the infrared light rays transmit; and a shielding film, with a window formed therein, provided on at least one of the front and rear surfaces of the body, the infrared light rays being reflected by the shielding film other than a portion of the shielding film having the window, and every one of the infrared light rays passing through the window of the cap impinging on the absorber.

公开(公告)号：US20160245702A1

公开(公告)日：2016-08-25

申请号：US15048058

申请日：2016-02-19

申请人： Commissariat A L'Energie Atomique et aux Energies Alternatives

发明人： Geoffroy DUMONT ,  Laurent CARLE ,  Pierre IMPERINETTI ,  Stephane POCAS ,  Jean-Jacques YON

IPC分类号： G01J5/04 ,  G01J5/20 ,  G01J5/34

CPC分类号： G01J5/045 ,  G01J5/0225 ,  G01J5/10 ,  G01J5/20 ,  G01J5/34 ,  G01J2005/0077

摘要： A device for detecting electromagnetic radiation, including a substrate; at least one thermal detector, placed on the substrate, including an absorbing membrane suspended above the substrate; and an encapsulating structure encapsulating the thermal detector, including an encapsulating layer extending around and above the thermal detector so as to define with the substrate a cavity in which the thermal detector is located; wherein the encapsulating layer includes at least one through-orifice that is what is referred to as an exhaust vent, each exhaust vent being placed so that at least one thermal detector has a single exhaust vent located facing the corresponding absorbing membrane, preferably plumb with the centre of said absorbing membrane.

摘要翻译： 一种用于检测电磁辐射的装置，包括一基板; 至少一个热检测器，放置在基底上，包括悬浮在基底上方的吸收膜; 以及封装所述热检测器的封装结构，包括在所述热检测器周围和上方延伸的封装层，以便在所述基板上限定所述热检测器所在的腔; 其特征在于，所述封装层包括至少一个称为排气口的通孔，每个排气口被放置成使得至少一个热检测器具有面向相应的吸收膜的单个排气口，优选地， 所述吸收膜的中心。