Method of manufacturing closed cavity LED
    2.
    发明授权
    Method of manufacturing closed cavity LED 失效
    封闭式LED的制造方法

    公开(公告)号:US5358880A

    公开(公告)日:1994-10-25

    申请号:US44787

    申请日:1993-04-12

    CPC classification number: H01L33/42 H01L33/0066 H01L33/405 Y10S438/977

    Abstract: A method of manufacturing a closed cavity LED including forming, on a substrate, a short cavity LED with electrically conductive layers on opposite ends. Depositing a transparent conductive layer of material over one electrically conductive layer and affixing glass or a diamond film over the transparent conductive layer to define and protect a light output area. Removing the substrate and covering the top and sides of the cavity with dielectric material and contact metal. The metal being in contact with the transparent conductive layer and the other electrical contact layer. Thus, a reflector covers the cavity in all directions except the light output area to increase external efficiency.

    Abstract translation: 一种制造封闭腔LED的方法,包括在衬底上形成在相对端上具有导电层的短腔LED。 在一个导电层上沉积材料的透明导电层,并将玻璃或金刚石膜固定在透明导电层上,以限定和保护光输出区域。 用介质材料和接触金属去除基板并覆盖空腔的顶部和侧面。 金属与透明导电层和另一个电接触层接触。 因此,除了光输出区域之外,反射器在所有方向上覆盖空腔以增加外部效率。

    Method of forming a light emitting diode
    3.
    发明授权
    Method of forming a light emitting diode 失效
    形成发光二极管的方法

    公开(公告)号:US5270245A

    公开(公告)日:1993-12-14

    申请号:US982525

    申请日:1992-11-27

    Abstract: A method of forming a III-V semiconductor device (10, 20) utilizes a III-V semiconductor substrate (11) having a plurality of III-V semiconductor layers (12, 14, 15, 16, 17). A pattern layer ( 19, 24) is formed on the plurality of layers (12, 14, 15, 16, 17). The plurality of III-V semiconductor layers (12, 14, 15, 16, 17) is etched with an isotropic etch that does not etch the pattern layer (19, 24). The isotropic etch undercuts the pattern layer (19, 24) and exposes an area for forming ohmic contacts on the plurality of III-V semiconductor layers. The pattern layer (19, 24) is used as a mask while depositing ohmic contact material (22, 23, 28) onto the area for forming ohmic contacts.

    Abstract translation: 形成III-V半导体器件(10,20)的方法利用具有多个III-V半导体层(12,14,15,16,17)的III-V半导体衬底(11)。 在多个层(12,14,15,16,17)上形成图形层(19,24)。 通过不蚀刻图案层(19,24)的各向同性蚀刻蚀刻多个III-V半导体层(12,14,15,16,17)。 各向同性蚀刻使图案层(19,24)下切,并在多个III-V半导体层上露出用于形成欧姆接触的区域。 将图形层(19,24)用作掩模,同时将欧姆接触材料(22,23,28)沉积在用于形成欧姆接触的区域上。

    Monolithic optoelectronic integrated circuit
    4.
    发明授权
    Monolithic optoelectronic integrated circuit 失效
    单片光电集成电路

    公开(公告)号:US5237633A

    公开(公告)日:1993-08-17

    申请号:US791708

    申请日:1991-11-14

    CPC classification number: H05B33/0818 H05B33/0803

    Abstract: A monolithic optoelectronic integrated circuit having an optical emission portion (18) and a drive portion (11, or 22 and 21). The drive portion is capable of accepting TTL and standard CMOS logic voltage levels. In a first embodiment, the monolithic optoelectronic integrated circuit (10) has a light emitting diode (18) driven by a dual gate FET (11). In a second embodiment, the monolithic optoelectronic integrated circuit (20) has a light emitting diode (18) driven by two FETs (22 and 21). In each embodiment (10 or 20), a gate (13 or 23) of the respective drive circuit accepts the TTL or standard CMOS logic voltage. Further, in each embodiment current limiting is accomplished by coupling a gate with the source of the FET (11 or 22). Thus, the output of the light emitting diode (18, 18) is controlled by an input signal to the drive circuit.

    Abstract translation: 具有光发射部分(18)和驱动部分(11或22和21)的单片光电集成电路。 驱动部分能够接受TTL和标准CMOS逻辑电压电平。 在第一实施例中,单片光电集成电路(10)具有由双栅极FET(11)驱动的发光二极管(18)。 在第二实施例中,单片光电集成电路(20)具有由两个FET(22和21)驱动的发光二极管(18)。 在每个实施例(10或20)中,相应驱动电路的栅极(13或23)接受TTL或标准CMOS逻辑电压。 此外,在每个实施例中,通过将栅极与FET(11或22)的源耦合来实现电流限制。 因此,发光二极管(18,18)的输出由驱动电路的输入信号控制。

    Method of forming a light emitting diode
    5.
    发明授权
    Method of forming a light emitting diode 失效
    形成发光二极管的方法

    公开(公告)号:US5256580A

    公开(公告)日:1993-10-26

    申请号:US864101

    申请日:1992-04-06

    Abstract: An optical semiconductor device is formed by using one controlled etch to form a "T" shaped contact structure on the device (20). The etch rate is controlled by judicious selection of materials to provide a cladding layer (17) that has a predetermined etch rate in hydrofluoric acid, a support layer (10) and a contact layer (18) that are not affected by hydrofluoric acid, a lift-off layer (19) that is dissolved by hydrofluoric acid, and a barrier layer (21). Dissolving of the lift-off layer (19) facilitates removing the barrier layer (21).

    Abstract translation: 通过使用一个受控蚀刻在器件(20)上形成“T”形接触结构来形成光学半导体器件。 通过明智选择材料来控制蚀刻速率,以提供在氢氟酸中具有预定蚀刻速率的包覆层(17),不受氢氟酸影响的支撑层(10)和接触层(18), 由氢氟酸溶解的剥离层(19)和阻挡层(21)。 剥离层(19)的溶解有利于去除阻挡层(21)。

    VCSEL having polarization control and method of making same
    7.
    发明授权
    VCSEL having polarization control and method of making same 失效
    具有偏振控制的VCSEL及其制造方法

    公开(公告)号:US5995531A

    公开(公告)日:1999-11-30

    申请号:US963624

    申请日:1997-11-04

    Abstract: A vertical cavity surface emitting laser with polarization control includes a first stack of distributed Bragg reflectors positioned on a substrate with an active region including a first cladding region and a second cladding region positioned on opposite sides of an active area overlying the first stack of distributed Bragg reflectors A second stack of distributed Bragg reflectors is positioned on the active region. The second stack has an ion implantation region formed to control and define a lasing threshold of the laser. The second stack further is formed into a ridge with the ridge being etched into the ion implantation region to form an elongated shape so as to polarize light emitted by the second stack of distributed Bragg reflectors

    Abstract translation: 具有偏振控制的垂直腔表面发射激光器包括位于衬底上的分布式布拉格反射器的第一叠层,其具有有源区域,该有源区域包括第一覆层区域和位于覆盖分布布拉格的第一堆叠层的有源区域相对侧上的第二覆盖区域 反射器第二层分布式布拉格反射器位于有源区上。 第二堆叠具有形成为控制和限定激光器的激光阈值的离子注入区域。 第二堆叠进一步形成为脊,其中脊被蚀刻到离子注入区域中以形成细长形状,以便使由分布布拉格反射器的第二堆叠发射的光偏振

    Semiconductor laser package including a lead frame and plastic resin
housing
    8.
    发明授权
    Semiconductor laser package including a lead frame and plastic resin housing 失效
    半导体激光器封装包括引线框架和塑料树脂外壳

    公开(公告)号:US5939773A

    公开(公告)日:1999-08-17

    申请号:US692355

    申请日:1996-08-05

    Abstract: A semiconductor laser package including a laser chip mounted to a leadframe, and a plastic resin housing for encapsulating the laser chip. The laser chip composed of a vertical cavity surface emitting laser and a photodetector. The vertical cavity surface emitting laser generating an emission along a path. The leadframe being positioned a fixed distance from an emission window formed in the plastic resin housing. The laser chip mounted in precise z-axis alignment from the emission window utilizing the leadframe as a dimensional reference point, with the bump height compensating for variations in laser chip dimension. An optical element is optionally positioned in the path to reflect a portion of the emission.

    Abstract translation: 一种半导体激光器封装,包括安装在引线框架上的激光芯片和用于封装激光芯片的塑料树脂外壳。 激光芯片由垂直腔表面发射激光器和光电检测器组成。 垂直腔表面发射激光器沿着路径产生发射。 引线框架与形成在塑料树脂壳体中的发射窗口定位一定距离。 激光芯片以发射窗口的精确z轴对准,利用引线框架作为尺寸参考点,凸起高度补偿了激光芯片尺寸的变化。 光学元件可选地位于路径中以反映发射的一部分。

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