Methods of operating an electromagnet of an ion source
    3.
    发明授权
    Methods of operating an electromagnet of an ion source 有权
    操作离子源电磁铁的方法

    公开(公告)号:US08158016B2

    公开(公告)日:2012-04-17

    申请号:US12037598

    申请日:2008-02-26

    IPC分类号: G01L21/30 B44C1/22

    摘要: Methods of operating an electromagnet of an ion source for generating an ion beam with a controllable ion current density distribution. The methods may include generating plasma in a discharge space of the ion source, generating and shaping a magnetic field in the discharge space by applying a current to an electromagnet that is effective to define a plasma density distribution, extracting an ion beam from the plasma, measuring a distribution profile for the ion beam density, and comparing the actual distribution profile with a desired distribution profile for the ion beam density. Based upon the comparison, the current applied to the electromagnet may be adjusted either manually or automatically to modify the magnetic field in the discharge space and, thereby, alter the plasma density distribution.

    摘要翻译: 操作离子源的电磁体的方法,用于产生具有可控离子电流密度分布的离子束。 所述方法可以包括在离子源的放电空间中产生等离子体,通过向有效限定等离子体密度分布的电磁体施加电流来产生和放电放电空间中的磁场,从等离子体提取离子束, 测量离子束密度的分布曲线,并将实际分布分布与用于离子束密度的期望分布分布进行比较。 基于比较,可以手动或自动地调节施加到电磁体的电流,以改变放电空间中的磁场,从而改变等离子体密度分布。

    Film deposition assisted by angular selective etch on a surface
    4.
    发明授权
    Film deposition assisted by angular selective etch on a surface 有权
    通过在表面上的角度选择性蚀刻辅助薄膜沉积

    公开(公告)号:US09347127B2

    公开(公告)日:2016-05-24

    申请号:US13550270

    申请日:2012-07-16

    摘要: An ion etch assisted deposition apparatus deposits a thin film upon a substrate having a three dimensional feature, using an ion etching source and deposition source arranged at similar angles relative to the substrate and at an angle α relative to each other. The angle α is selected to be substantially equal the supplement of the angle α′ formed between the three dimensional feature on the substrate and the substrate surface. In this configuration the relative flux of energetic etch ions and deposition atoms is adjusted to prevent the growth of poor quality deposited material.

    摘要翻译: 离子蚀刻辅助沉积设备使用离子蚀刻源和沉积源以相对于衬底相似的角度相对于彼此成角度α将薄膜沉积在具有三维特征的衬底上。 角度α选择为基本上等于在基板上的三维特征与基板表面之间形成的角度α'的补充。 在该配置中,调节能量蚀刻离子和沉积原子的相对通量以防止劣质沉积材料的生长。

    Film Deposition Assisted by Angular Selective Etch on a Surface
    7.
    发明申请
    Film Deposition Assisted by Angular Selective Etch on a Surface 有权
    由表面选择性蚀刻辅助的膜沉积

    公开(公告)号:US20140014497A1

    公开(公告)日:2014-01-16

    申请号:US13550270

    申请日:2012-07-16

    IPC分类号: C23C14/34 C23C14/35

    摘要: An ion etch assisted deposition apparatus deposits a thin film upon a substrate having a three dimensional feature, using an ion etching source and deposition source arranged at similar angles relative to the substrate and at an angle α relative to each other. The angle α is selected to be substantially equal the supplement of the angle α′ formed between the three dimensional feature on the substrate and the substrate surface. In this configuration the relative flux of energetic etch ions and deposition atoms is adjusted to prevent the growth of poor quality deposited material.

    摘要翻译: 离子蚀刻辅助沉积设备使用离子蚀刻源和沉积源以相对于衬底相似的角度相对于彼此以一定角度α将薄膜沉积在具有三维特征的衬底上。 角度α选择为基本上等于在基底上的三维特征与基底表面之间形成的角度α'的补充。 在该配置中,调节能量蚀刻离子和沉积原子的相对通量以防止劣质沉积材料的生长。

    ION SOURCES AND METHODS FOR GENERATING AN ION BEAM WITH CONTROLLABLE ION CURRENT DENSITY DISTRIBUTION
    8.
    发明申请
    ION SOURCES AND METHODS FOR GENERATING AN ION BEAM WITH CONTROLLABLE ION CURRENT DENSITY DISTRIBUTION 有权
    用于产生具有可控离子电流密度分布的离子束的离子源和方法

    公开(公告)号:US20120211166A1

    公开(公告)日:2012-08-23

    申请号:US13448282

    申请日:2012-04-16

    IPC分类号: B05C9/00 H01J27/16

    摘要: Ion sources and methods for generating an ion bean with a controllable ion current density distribution. The ion source includes a discharge chamber having an optical grid position proximate at a first end and a re-entrant vessel positioned proximate a second end that opposes the first end. A plasma shaper extends from the re-entrant vessel and into the plasma discharge chamber. A position of the plasma shaper is adjustable relative to the grid-based ion optic such that the plasma shaper may operably change a plasma density distribution within the discharge chamber.

    摘要翻译: 用于产生具有可控离子电流密度分布的离子束的离子源和方法。 离子源包括具有靠近第一端的光栅位置的放电室和靠近与第一端相对的第二端的重入容器。 等离子体成形器从入口容器延伸到等离子体放电室中。 等离子体成形器的位置相对于基于栅格的离子光学器件是可调节的,使得等离子体成形器可以可操作地改变放电室内的等离子体密度分布。

    Method for repetitive ion beam processing with a carbon containing ion beam
    10.
    发明授权
    Method for repetitive ion beam processing with a carbon containing ion beam 有权
    用含碳离子束重复离子束加工的方法

    公开(公告)号:US06464891B1

    公开(公告)日:2002-10-15

    申请号:US09270998

    申请日:1999-03-17

    IPC分类号: B44C122

    摘要: A method is provided for a repetitive deposition and etch of a substrate using a carbon containing ion beam in a gridded ion source. The method includes the actual ion beam processing step combined with the thermal and chemical conditioning of the ion source and a special cleaning step(s). The special cleaning step(s) effect robust removal of the precipitates accumulated in the operating source due to the decomposition of carbon containing gases such as hydrocarbons and halocarbons Precipitate removal is achieved by employing ions and radicals formed in an inert gas plasma or a mixture of inert gas and oxygen to reactively etch or bombard the precipitates.

    摘要翻译: 提供了一种用于在网格离子源中使用含碳离子束重复沉积和蚀刻基底的方法。 该方法包括与离子源的热和化学调节结合的实际离子束处理步骤和特殊的清洁步骤。 由于碳氢化合物和卤代烃等含碳气体的分解,特殊的清洗步骤可以有效地除去积聚在操作源中的沉淀物。通过使用在惰性气体等离子体中形成的离子和自由基 惰性气体和氧气以反应性蚀刻或轰击沉淀物。