Abstract:
A structure and method for forming isolation and a buried plate for a trench capacitor is disclosed. Embodiments of the structure comprise an epitaxial layer serving as the buried plate, and a bounded deep trench isolation area serving to isolate one or more deep trench structures. Embodiments of the method comprise angular implanting of the deep trench isolation area to form a P region at the base of the deep trench isolation area that serves as an anti-punch through implant.
Abstract:
A system in one embodiment includes a multiprocessor chip comprising a plurality of cores; a plurality of power circuits, each power circuit being coupled to one of the cores; and an electrically programmable fuse in each power circuit. Each electrically programmable fuse further comprises a first electrode coupled to the associated power circuit; a second electrode coupled to the associated power circuit; a first pad coupled to the first electrode; a second pad coupled to the second electrode; and an electrically conductive material extending between the first and second electrodes and forming part of the associated power circuit, the electrically conductive material being characterized as tending to electromigrate from one of the electrodes to the other electrode under an applied electrical current passing between the electrodes, wherein the electromigration increases an overall resistance of the power circuit.
Abstract:
A high pressure gas discharge lamp and the method of making same utilizing integrated circuit fabrication techniques. The lamp is manufactured from heat and pressure resistant planar substrates in which cavities are etched, by integrated circuit manufacturing techniques, so as to provide a cavity forming the gas discharge tube. Electrodes are deposited in the cavity. The cavity is filled with gas discharge materials such as mercury vapor, sodium vapor or metal halide. The substrates are bonded together and channels may be etched in the substrate so as to provide a means for connection to the electrodes. Electrodeless RF activated lamps may also be fabricated by this technique. Lamps fabricated from three or more planar substrates are disclosed.
Abstract:
A flat display device, preferably of the PALC type, in which the plasma channels are formed by etching in a substrate laterally-spaced channels and bonding a thin dielectric sheet over the etched substrate. Adjoining each of the channels are shallow ledges, also formed by etching, which serve as recessed areas to receive enlarged ends serving as contact pads for each of the electrodes. Holes are formed in the thin dielectric sheet and contact material deposited on the bonded thin dielectric sheet such that the deposited material makes electrical contact with the underlying electrode contact pads and seals off the holes, which allows a plasma-forming atmosphere to be provided in the channels. This arrangement results in a glass-to-glass interface between the substrate and the thin dielectric sheet, which allows anodic bonding to be employed to assemble the two elements and thus eliminates the frit glass sealing process required in other constructions.
Abstract:
A plasma-addressed electro-optic display device comprising a layer of electro-optic material, data electrodes coupled to the electro-optic layer and adapted to receive data voltages for activating portions of the electro-optic layer, and a plurality of plasma channels extending generally transverse to the data electrodes for selectively switching on said electro-optic portions. The plasma channels each comprise spaced elongated cathode and anode plasma electrodes and an ionizable gas filling. To improve performance and increase the effective aperture and provide a stable discharge, the channels are configured with a substantially flat bottom surface portion and curved side wall surface portions on which the electrodes are deposited such that the spacing between the electrodes is increased and the electrode surfaces form an angle of the order of 90.degree.. Additional features include provision of black masking to screen out incident light that may depolarize, and a novel method of forming the electrodes using a single mask.
Abstract:
A structure and method for forming isolation and a buried plate for a trench capacitor is disclosed. Embodiments of the structure comprise an epitaxial layer serving as the buried plate, and a bounded deep trench isolation area serving to isolate one or more deep trench structures. Embodiments of the method comprise angular implanting of the deep trench isolation area to form a P region at the base of the deep trench isolation area that serves as an anti-punch through implant.
Abstract:
A discharge lamp includes a first and a second substrate (12, 14), a cavity disposed in the first substrate (12) or in a portion of the first and a second substrate (12, 14), a first and a second aligned electrode (270, 272) disposed between the first and a second substrate (12, 14) having respective ends extending into the cavity, wherein the first and the second aligned electrode (270, 272) are "T-shaped" when viewed in cross-section. The T-shaped electrodes provide mechanical support that minimizes bending and distortion in the horizontal and vertical directions. The discharge lamp may include a charge of mercury or an inert gas, and may further include a phosphor layer (80).
Abstract:
A high pressure gas discharge lamp and the method of making same utilizing integrated circuit fabrication techniques. The lamp is manufactured from heat and pressure resistant planar substrates in which cavities are etched, by integrated circuit manufacturing techniques, so as to provide a cavity forming the gas discharge tube. Electrodes are deposited in the cavity. The cavity is filled with gas discharge materials such as mercury vapor, sodium vapor or metal halide. The substrates are bonded together and channels may be etched in the substrate so as to provide a means for connection to the electrodes. Electrodeless RF activated lamps may also be fabricated by this technique. Micro-lasers may also be fabricated by this technique as well.
Abstract:
A structure and method for forming isolation and a buried plate for a trench capacitor is disclosed. Embodiments of the structure comprise an epitaxial layer serving as the buried plate, and a bounded deep trench isolation area serving to isolate one or more deep trench structures. Embodiments of the method comprise angular implanting of the deep trench isolation area to form a P region at the base of the deep trench isolation area that serves as an anti-punch through implant.
Abstract:
An integrated circuit including a dynamic random access memory (DRAM) array is disclosed herein in which a DRAM cell includes a storage capacitor within a deep trench, a transistor having a channel extending along a sidewall of the deep trench and a gate conductor within the deep trench, and a wordline contacting the gate conductor from above, wherein the wordline has a centerline which is offset from the centerline of the gate conductor. The DRAM cell further includes active area extending from the transistor channel, and a bitline contact to the active area which is bordered by an insulating spacer of the sidewall of the wordline.