Oxide semiconductor device including gate trench and isolation trench
    3.
    发明授权
    Oxide semiconductor device including gate trench and isolation trench 有权
    氧化物半导体器件包括栅极沟槽和隔离沟槽

    公开(公告)号:US08766255B2

    公开(公告)日:2014-07-01

    申请号:US13418558

    申请日:2012-03-13

    IPC分类号: H01L29/786

    摘要: A semiconductor device in which improvement of a property of holding stored data can be achieved. Further, power consumption of a semiconductor device is reduced. A transistor in which a wide-gap semiconductor material capable of sufficiently reducing the off-state current of a transistor (e.g., an oxide semiconductor material) in a channel formation region is used and which has a trench structure, i.e., a trench for a gate electrode and a trench for element isolation, is provided. The use of a semiconductor material capable of sufficiently reducing the off-state current of a transistor enables data to be held for a long time. Further, since the transistor has the trench for a gate electrode, the occurrence of a short-channel effect can be suppressed by appropriately setting the depth of the trench even when the distance between the source electrode and the drain electrode is decreased.

    摘要翻译: 一种其中可以实现保持存储数据的性质的改进的半导体器件。 此外,半导体器件的功耗降低。 使用能够充分降低沟道形成区域中的晶体管(例如,氧化物半导体材料)的截止电流的宽间隙半导体材料的晶体管,其具有沟槽结构,即,沟槽结构 栅电极和用于元件隔离的沟槽。 使用能够充分降低晶体管的截止电流的半导体材料能够长时间保持数据。 此外,由于晶体管具有用于栅极电极的沟槽,所以即使当源电极和漏电极之间的距离减小时,也可以通过适当地设置沟槽的深度来抑制短沟道效应的发生。

    Semiconductor device
    4.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US08581309B2

    公开(公告)日:2013-11-12

    申请号:US13277489

    申请日:2011-10-20

    IPC分类号: H01L27/092

    摘要: An object is to realize high performance and low power consumption in a semiconductor device having an SOI structure. In addition, another object is to provide a semiconductor device having a high performance semiconductor element which is more highly integrated. A semiconductor device is such that a plurality of n-channel field-effect transistors and p-channel field-effect transistors are stacked with an interlayer insulating layer interposed therebetween over a substrate having an insulating surface. By controlling a distortion caused to a semiconductor layer due to an insulating film having a stress, a plane orientation of the semiconductor layer, and a crystal axis in a channel length direction, difference in mobility between the n-channel field-effect transistor and the p-channel field-effect transistor can be reduced, whereby current driving capabilities and response speeds of the n-channel field-effect transistor and the p-channel field-effect can be comparable.

    摘要翻译: 目的是在具有SOI结构的半导体器件中实现高性能和低功耗。 此外,另一个目的是提供一种具有更高集成度的高性能半导体元件的半导体器件。 半导体器件使得多个n沟道场效应晶体管和p沟道场效应晶体管层叠在其间具有绝缘表面的衬底之间的层间绝缘层。 通过控制由于具有应力的绝缘膜,半导体层的平面取向和沟道长度方向的晶轴引起的半导体层的失真,n沟道场效应晶体管和 可以减小p沟道场效应晶体管,由此n沟道场效应晶体管的电流驱动能力和响应速度与p沟道场效应相当。

    Semiconductor device and method for manufacturing the same

    公开(公告)号:US08470688B2

    公开(公告)日:2013-06-25

    申请号:US13251641

    申请日:2011-10-03

    申请人: Atsuo Isobe

    发明人: Atsuo Isobe

    IPC分类号: H01L27/12 H01L21/30

    摘要: A semiconductor device and a method for manufacturing a semiconductor device are provided. A semiconductor device comprises a first single-crystal semiconductor layer including a first channel formation region and a first impurity region over a substrate having an insulating surface, a first gate insulating layer over the first single-crystal semiconductor layer, a gate electrode over the first gate insulating layer, a first interlayer insulating layer over the first gate insulating layer, a second gate insulating layer over the gate electrode and the first interlayer insulating layer, and a second single-crystal semiconductor layer including a second channel formation region and a second impurity region over the second gate insulating layer. The first channel formation region, the gate electrode, and the second channel formation region are overlapped with each other.

    Method for manufacturing semiconductor device including a photoelectric conversion element
    7.
    发明授权
    Method for manufacturing semiconductor device including a photoelectric conversion element 有权
    包括光电转换元件的半导体器件的制造方法

    公开(公告)号:US08426231B2

    公开(公告)日:2013-04-23

    申请号:US12857820

    申请日:2010-08-17

    IPC分类号: H01L31/18

    摘要: An object of an embodiment of the disclosed invention is to provide a semiconductor device including a photoelectric conversion element with excellent characteristics. An object of an embodiment of the disclosed invention is to provide a semiconductor device including a photoelectric conversion device with excellent characteristic through a simple process. A semiconductor device is provided, which includes a light-transmitting substrate; an insulating layer over the light-transmitting substrate; and a photoelectric conversion element over the insulating layer. The photoelectric conversion element includes a single crystal semiconductor layer including a semiconductor region having an effect of photoelectric conversion, a semiconductor region having a first conductivity type, and a semiconductor region having a second conductivity type; a first electrode electrically connected to the semiconductor region having the first conductivity type; and a second electrode electrically connected to the semiconductor region having the second conductivity type.

    摘要翻译: 所公开的发明的一个实施例的目的是提供一种包括具有优异特性的光电转换元件的半导体器件。 所公开的发明的一个实施例的目的是提供一种包括通过简单工艺具有优异特性的光电转换装置的半导体器件。 提供了一种半导体器件,其包括透光衬底; 透光基板上的绝缘层; 和绝缘层上的光电转换元件。 光电转换元件包括具有具有光电转换效果的半导体区域,具有第一导电类型的半导体区域和具有第二导电类型的半导体区域的单晶半导体层; 电连接到具有第一导电类型的半导体区域的第一电极; 以及电连接到具有第二导电类型的半导体区域的第二电极。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    8.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 有权
    制造半导体器件和半导体器件的方法

    公开(公告)号:US20130075733A1

    公开(公告)日:2013-03-28

    申请号:US13609931

    申请日:2012-09-11

    摘要: A minute transistor and the method of manufacturing the minute transistor. A source electrode layer and a drain electrode layer are each formed in a corresponding opening formed in an insulating layer covering a semiconductor layer. The opening of the source electrode layer and the opening of the drain electrode layer are formed separately in two distinct steps. The source electrode layer and the drain electrode layer are formed by depositing a conductive layer over the insulating layer and in the openings, and subsequently removing the part located over the insulating layer by polishing. This manufacturing method allows for the source electrode later and the drain electrode layer to be formed close to each other and close to a channel forming region of the semiconductor layer. Such a structure leads to a transistor having high electrical characteristics and a high manufacturing yield even in the case of a minute structure.

    摘要翻译: 一分钟晶体管和微晶体管的制造方法。 源极电极层和漏极电极层各自形成在形成在覆盖半导体层的绝缘层中的对应的开口中。 源电极层的开口和漏电极层的开口分开形成两个不同的步骤。 源极电极层和漏电极层通过在绝缘层上和开口中沉积导电层而形成,然后通过抛光去除绝缘层上方的部分。 该制造方法允许稍后的源极电极和漏极电极层彼此靠近并且靠近半导体层的沟道形成区域。 这种结构导致即使在微小结构的情况下也具有高电特性和高制造成品率的晶体管。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
    9.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20120267624A1

    公开(公告)日:2012-10-25

    申请号:US13446028

    申请日:2012-04-13

    IPC分类号: H01L29/24 H01L21/34

    摘要: An insulating layer is provided with a projecting structural body, and a channel formation region of an oxide semiconductor layer is provided in contact with the projecting structural body, whereby the channel formation region is extended in a three dimensional direction (a direction perpendicular to a substrate). Thus, it is possible to miniaturize a transistor and to extend an effective channel length of the transistor. Further, an upper end corner portion of the projecting structural body, where a top surface and a side surface of the projecting structural body intersect with each other, is curved, and the oxide semiconductor layer is formed to include a crystal having a c-axis perpendicular to the curved surface.

    摘要翻译: 绝缘层设置有突出的结构体,并且设置与突出结构体接触的氧化物半导体层的沟道形成区域,由此沟道形成区域沿三维方向(垂直于衬底的方向)延伸 )。 因此,可以使晶体管小型化并且延长晶体管的有效沟道长度。 此外,突出结构体的顶表面和侧表面彼此相交的突出结构体的上端角部弯曲,并且氧化物半导体层形成为包括具有c轴的晶体 垂直于曲面。

    SEMICONDUCTOR DEVICE
    10.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20120235150A1

    公开(公告)日:2012-09-20

    申请号:US13418558

    申请日:2012-03-13

    摘要: A semiconductor device in which improvement of a property of holding stored data can be achieved. Further, power consumption of a semiconductor device is reduced. A transistor in which a wide-gap semiconductor material capable of sufficiently reducing the off-state current of a transistor (e.g., an oxide semiconductor material) in a channel formation region is used and which has a trench structure, i.e., a trench for a gate electrode and a trench for element isolation, is provided. The use of a semiconductor material capable of sufficiently reducing the off-state current of a transistor enables data to be held for a long time. Further, since the transistor has the trench for a gate electrode, the occurrence of a short-channel effect can be suppressed by appropriately setting the depth of the trench even when the distance between the source electrode and the drain electrode is decreased.

    摘要翻译: 一种其中可以实现保持存储数据的性质的改进的半导体器件。 此外,半导体器件的功耗降低。 使用能够充分降低沟道形成区域中的晶体管(例如,氧化物半导体材料)的截止电流的宽间隙半导体材料的晶体管,其具有沟槽结构,即,沟槽结构 栅电极和用于元件隔离的沟槽。 使用能够充分降低晶体管的截止电流的半导体材料能够长时间保持数据。 此外,由于晶体管具有用于栅极电极的沟槽,所以即使当源电极和漏电极之间的距离减小时,也可以通过适当地设置沟槽的深度来抑制短沟道效应的发生。