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    Substrate alignment method and apparatus
    1.
    发明申请
    Substrate alignment method and apparatus 失效
    基板对准方法及装置

    公开(公告)号：US20040245319A1

    公开(公告)日：2004-12-09

    申请号：US10454258

    申请日：2003-06-03

    Applicant: ASM Assembly Automation Ltd.

    Inventor： Chi Wah Cheng ,  Ping Chun Benson Chong ,  Chin Pang Anson Chan

    IPC: B23K031/12

    CPC classification number: B23K3/0607 ,  B23K2101/42

    Abstract: The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obtain positional information of the substrate. Furthermore, a carrier is provided to which the vision system is mountable, such that operation of the vision system is decoupled from movement of the ball pick head. Drivers responsive to said positional information viewed by the vision system are operative to align at least the substrate and the ball pick head for depositing solder balls onto the substrate.

    Abstract translation: 本发明提供了一种用于对准衬底的方法和装置。 该装置包括用于在球拾取过程中拾取多个焊球并将其沉积到基板上的球形拾取头，以及适于观察和获得基板的位置信息的视觉系统。 此外，提供了可安装视觉系统的载体，使得视觉系统的操作与球拍头的移动脱离。 响应于由视觉系统观看的所述位置信息的驱动器可操作以至少对准基底和球形拾取头，以将焊球沉积到基底上。

    Dispensation of controlled quantities of material onto a substrate
    3.
    发明申请
    Dispensation of controlled quantities of material onto a substrate 有权
    将受控量的材料分配到基材上

    公开(公告)号：US20030209560A1

    公开(公告)日：2003-11-13

    申请号：US10144164

    申请日：2002-05-10

    Applicant: ASM Assembly Automation Ltd

    Inventor： Hon Chiu Hui ,  Wing Fai Lam ,  Ka Yee Mak ,  Man Lai Manly Chau

    IPC: G01F011/00

    CPC classification number: H01L21/67253 ,  B05C11/1005 ,  H01L21/6715 ,  H01L24/83 ,  H01L2224/83 ,  H01L2924/12042 ,  H01L2924/00

    Abstract: The invention provides an apparatus and method for dispensing material onto a substrate. The apparatus comprises a dispensing system having a dipenser and a control system adapted to adjust a quantity of material to be dispensed onto the substrate. It also includes an image capturing system adapted to acquire an image of the material that is dispensed onto the substrate, a measuring system to analyze the image and measure the quantity of material dispensed, and a compensation system adapted to provide a correction signal to the control system to vary the quantity of material dispensed.

    Abstract translation: 本发明提供了一种用于将材料分配到基底上的装置和方法。 该装置包括具有二次分配器和控制系统的分配系统，该系统适于调整待分配到基底上的材料的量。 它还包括适于获取分配到基板上的材料的图像的图像捕获系统，用于分析图像并测量分配的材料量的测量系统，以及适于向控制器提供校正信号的补偿系统 系统改变分配的材料的数量。

    Test handler temperature monitoring system
    5.
    发明申请
    Test handler temperature monitoring system 有权
    测试处理器温度监控系统

    公开(公告)号：US20040184508A1

    公开(公告)日：2004-09-23

    申请号：US10395401

    申请日：2003-03-21

    Applicant: ASM Assembly Automation Ltd.

    Inventor： Ching Man Stanley Tsui ,  Sai Kit Wong ,  Shing Kai Yip

    IPC: G01J005/00 ,  G01K007/00

    CPC classification number: G01R31/2874 ,  G01J5/00 ,  G01J5/0096 ,  G01J5/12 ,  G01R1/0458 ,  G01R31/2867 ,  G01R31/3025

    Abstract: The invention provides a temperature monitoring system for a semiconductor test handler. A preparation stage brings a test device to a predetermined temperature for testing at a test platform at said predetermined temperature. At least one radiation sensor, such as a thermopile device, is employed in the test handler for detecting a surface temperature of the test device by measuring radiation emitted from the test device.

    Abstract translation: 本发明提供了一种用于半导体测试处理器的温度监测系统。 准备阶段使测试装置达到预定温度，以在测试台在所述预定温度下进行测试。 在测试处理器中采用至少一个辐射传感器，例如热电堆设备，用于通过测量从测试设备发出的辐射来检测测试设备的表面温度。

    Apparatus and method for calibration of a dispensing system
    6.
    发明申请
    Apparatus and method for calibration of a dispensing system 有权
    用于校准分配系统的装置和方法

    公开(公告)号：US20040175832A1

    公开(公告)日：2004-09-09

    申请号：US10379832

    申请日：2003-03-03

    Applicant: ASM Assembly Automation Ltd

    Inventor： Hon Chiu Hui ,  Wing Fai Lam ,  Lim Pun Kong ,  Ka Yee Mak ,  Ka Yin Lee

    IPC: B01L003/00

    CPC classification number: H01L21/67253 ,  B01L3/0241 ,  G01F11/006 ,  G01F25/0084 ,  G01N35/1016 ,  H01L21/67126 ,  Y10T436/10 ,  Y10T436/2575

    Abstract: The invention provides an apparatus and method for calibrating a dispensing system. A dispenser dispenses a controlled quantity of material into a container for receiving material. A system, preferably a vision system comprising an image capturing device and an imaging system, is adapted to capture an image of a physical dimension of a quantity of dispensed material in a given time. The physical dimension may be a width of a top surface area, a height or a cross-sectional area of the dispensed material. A calibrating system is adapted to calculate a volume of the quantity of material based upon said physical dimension.

    Abstract translation: 本发明提供了一种用于校准分配系统的装置和方法。 分配器将可控量的材料分配到用于接收材料的容器中。 优选地，包括图像捕获装置和成像系统的视觉系统的系统适于在给定时间内捕获一批分配材料的物理尺寸的图像。 物理尺寸可以是分配材料的顶表面积，高度或横截面面积的宽度。 校准系统适于基于所述物理尺寸计算材料量的体积。

    Apparatus and method for cleaning electronic packages
    7.
    发明申请
    Apparatus and method for cleaning electronic packages 有权
    电子包装清洗装置及方法

    公开(公告)号：US20040123878A1

    公开(公告)日：2004-07-01

    申请号：US10698379

    申请日：2003-11-03

    Applicant: ASM Assembly Automation Ltd.

    Inventor： Chi Wah Cheng ,  Yui Ko Wong ,  Tim Wai Mak

    IPC: B08B003/00

    CPC classification number: B08B3/12 ,  B08B3/123 ,  H01L21/481 ,  H01L21/67051

    Abstract: The invention provides an apparatus and method for cleaning a plurality of electronic components. A tank is provided for containing a cleaning fluid and an ultrasonic resonator is mounted in communication with the cleaning fluid for charging ultrasonic energy thereto. A support platform positionable over a top surface of the cleaning fluid supports the electronic components such that the electronic components are in contact with said top surface of the cleaning fluid in use. Further, a cleaning fluid supply system is configured to generate a continuous flow of cleaning fluid into the tank for cleaning the electronic components in contact with said top surface of the cleaning fluid.

    Abstract translation: 本发明提供一种用于清洁多个电子部件的装置和方法。 提供容器用于容纳清洁液体，并且超声波谐振器被安装成与用于向其提供超声波能量的清洁流体连通。 可在清洁流体的顶表面上定位的支撑平台支撑电子部件，使得电子部件在使用中与清洁流体的所述顶表面接触。 此外，清洁流体供应系统被配置为产生连续的清洁流体流入罐中，用于清洁与清洁流体的所述顶表面接触的电子部件。

    Apparatus and method for active alignment of optical components
    10.
    发明申请
    Apparatus and method for active alignment of optical components 有权
    用于光学部件的主动对准的装置和方法

    公开(公告)号：US20040165837A1

    公开(公告)日：2004-08-26

    申请号：US10372362

    申请日：2003-02-24

    Applicant: ASM Assembly Automation Ltd

    Inventor： Yiu Ming Cheung ,  Chou Kee Peter Liu ,  Ching Hong Yiu

    IPC: G02B006/00

    CPC classification number: G02B6/4225 ,  G02B6/4227 ,  G02B6/4237

    Abstract: The invention provides an apparatus and method for the active alignment and coupling of separate optical components consisting of a light-emitting component and a light-receiving component. It comprises first alignment means having a relatively lower optical resolving power stage that is adapted to perform coarse alignment of the light-emitting component to locate an approximate location of its point of highest intensity, and second alignment means having a relatively higher optical resolving power stage that is adapted to perform fine alignment of the light-emitting component to locate a more precise location of the said point of highest intensity. Accordingly, coarse alignment may be performed using a multi-mode fiber and fine alignment may be performed using a single-mode fiber that may further be coupled to the light-emitting component.

    Abstract translation: 本发明提供了一种用于主动对准和耦合由发光部件和光接收部件组成的分离的光学部件的装置和方法。 它包括具有相对较低的光学分辨功率级的第一对准装置，其适于执行发光部件的粗略对准以定位其最高强度点的近似位置，以及具有相对较高的光学分辨功率级的第二对准装置 其适于执行发光部件的精细对准以定位所述最高强度点的更精确的位置。 因此，可以使用多模光纤执行粗略对准，并且可以使用可以进一步耦合到发光部件的单模光纤进行精细对准。

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