公开(公告)号：US20030209560A1

公开(公告)日：2003-11-13

申请号：US10144164

申请日：2002-05-10

Applicant: ASM Assembly Automation Ltd

Inventor： Hon Chiu Hui ,  Wing Fai Lam ,  Ka Yee Mak ,  Man Lai Manly Chau

IPC: G01F011/00

CPC classification number: H01L21/67253 ,  B05C11/1005 ,  H01L21/6715 ,  H01L24/83 ,  H01L2224/83 ,  H01L2924/12042 ,  H01L2924/00

Abstract: The invention provides an apparatus and method for dispensing material onto a substrate. The apparatus comprises a dispensing system having a dipenser and a control system adapted to adjust a quantity of material to be dispensed onto the substrate. It also includes an image capturing system adapted to acquire an image of the material that is dispensed onto the substrate, a measuring system to analyze the image and measure the quantity of material dispensed, and a compensation system adapted to provide a correction signal to the control system to vary the quantity of material dispensed.

Abstract translation: 本发明提供了一种用于将材料分配到基底上的装置和方法。 该装置包括具有二次分配器和控制系统的分配系统，该系统适于调整待分配到基底上的材料的量。 它还包括适于获取分配到基板上的材料的图像的图像捕获系统，用于分析图像并测量分配的材料量的测量系统，以及适于向控制器提供校正信号的补偿系统 系统改变分配的材料的数量。