公开(公告)号：US20040184508A1

公开(公告)日：2004-09-23

申请号：US10395401

申请日：2003-03-21

Applicant: ASM Assembly Automation Ltd.

Inventor： Ching Man Stanley Tsui ,  Sai Kit Wong ,  Shing Kai Yip

IPC: G01J005/00 ,  G01K007/00

CPC classification number: G01R31/2874 ,  G01J5/00 ,  G01J5/0096 ,  G01J5/12 ,  G01R1/0458 ,  G01R31/2867 ,  G01R31/3025

Abstract: The invention provides a temperature monitoring system for a semiconductor test handler. A preparation stage brings a test device to a predetermined temperature for testing at a test platform at said predetermined temperature. At least one radiation sensor, such as a thermopile device, is employed in the test handler for detecting a surface temperature of the test device by measuring radiation emitted from the test device.

Abstract translation: 本发明提供了一种用于半导体测试处理器的温度监测系统。 准备阶段使测试装置达到预定温度，以在测试台在所述预定温度下进行测试。 在测试处理器中采用至少一个辐射传感器，例如热电堆设备，用于通过测量从测试设备发出的辐射来检测测试设备的表面温度。