公开(公告)号：US20040245893A1

公开(公告)日：2004-12-09

申请号：US10454418

申请日：2003-06-03

Applicant: ASM Assembly Automation Ltd.

Inventor： Hing Leung Marchy Li ,  Kin Yik Hung ,  Ming Wai Kelvin Ng

IPC: H02N002/00

CPC classification number: H01L24/85 ,  B06B3/00 ,  B23K20/106 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/78313 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3011 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: The invention provides an ultrasonic transducer assembly for a bonding apparatus, comprising a bonding tool mounted to an amplifying horn secured between first and second ultrasonic-generating means. A method of forming a transducer for a bonding apparatus is also provided, comprising the steps of providing an amplifying horn, securing first and second ultrasonic-generating means to the amplifying horn such that the amplifying horn is located between said first and second ultrasonic-generating means and mounting a bonding tool to the amplifying horn.

Abstract translation: 本发明提供了一种用于接合装置的超声换能器组件，包括安装到固定在第一和第二超声发生装置之间的放大喇叭的接合工具。 还提供了一种形成用于接合装置的换能器的方法，包括以下步骤：提供放大喇叭，将第一和第二超声发生装置固定到放大喇叭，使得放大喇叭位于所述第一和第二超声波产生 将接合工具装配并安装到放大喇叭。