Apparatus and method for active alignment of optical components
    2.
    发明申请
    Apparatus and method for active alignment of optical components 有权
    用于光学部件的主动对准的装置和方法

    公开(公告)号:US20040165837A1

    公开(公告)日:2004-08-26

    申请号:US10372362

    申请日:2003-02-24

    CPC classification number: G02B6/4225 G02B6/4227 G02B6/4237

    Abstract: The invention provides an apparatus and method for the active alignment and coupling of separate optical components consisting of a light-emitting component and a light-receiving component. It comprises first alignment means having a relatively lower optical resolving power stage that is adapted to perform coarse alignment of the light-emitting component to locate an approximate location of its point of highest intensity, and second alignment means having a relatively higher optical resolving power stage that is adapted to perform fine alignment of the light-emitting component to locate a more precise location of the said point of highest intensity. Accordingly, coarse alignment may be performed using a multi-mode fiber and fine alignment may be performed using a single-mode fiber that may further be coupled to the light-emitting component.

    Abstract translation: 本发明提供了一种用于主动对准和耦合由发光部件和光接收部件组成的分离的光学部件的装置和方法。 它包括具有相对较低的光学分辨功率级的第一对准装置,其适于执行发光部件的粗略对准以定位其最高强度点的近似位置,以及具有相对较高的光学分辨功率级的第二对准装置 其适于执行发光部件的精细对准以定位所述最高强度点的更精确的位置。 因此,可以使用多模光纤执行粗略对准,并且可以使用可以进一步耦合到发光部件的单模光纤进行精细对准。

    Ultrasonic cleaning module
    3.
    发明申请
    Ultrasonic cleaning module 有权
    超声波清洗模块

    公开(公告)号:US20030200987A1

    公开(公告)日:2003-10-30

    申请号:US10413602

    申请日:2003-04-14

    CPC classification number: H01L21/67092 B08B3/024 B08B2203/0288 H01L21/67051

    Abstract: The invention provides an ultrasonic cleaning module and a method for cleaning singulated electronic packages. The module comprises a cutting chuck having a surface with a plurality of cutting recesses defined in it for enabling a cutting device to separate individual electronic packages from a substrate having a plurality of electronic packages on the surface of the chuck. A pulsator nozzle is supported above the chuck and the separated electronic packages on the chuck such that the pulsator nozzle may emit fluid toward the packages. An ultrasonic generator is associated with the nozzle that is adapted to ultrasonically energize fluid that passes through the nozzle to enhance cleaning of the packages.

    Abstract translation: 本发明提供了一种超声波清洗模块和清洁单个电子封装的方法。 模块包括具有限定在其中的多个切割凹部的表面的切割卡盘,用于使得切割装置能够在卡盘的表面上具有多个电子封装的基板上分离各个电子封装。 波轮喷嘴支撑在卡盘上方和卡盘上分离的电子包装件上,使得波轮喷嘴可朝向包装发射流体。 超声波发生器与喷嘴相关联,该喷嘴适于对通过喷嘴的流体进行超声波激励以增强包装的清洁。

    Apparatus and method for off-loading electronic packages
    4.
    发明申请
    Apparatus and method for off-loading electronic packages 有权
    用于卸载电子封装的装置和方法

    公开(公告)号:US20030084642A1

    公开(公告)日:2003-05-08

    申请号:US10041426

    申请日:2001-11-07

    CPC classification number: H01L21/67271 H01L21/67796

    Abstract: The invention relates to an apparatus for off-loading items of varying size such as electronic packages into receptacles such as tubes, there being means automatically to adjust dimension parameters of the apparatus whereby to accommodate packages of different size and load same into a tube therefor. The apparatus also has means for stacking a plurality of tubes for loading a bottom one of the stack, ejecting that one when loaded, and providing a subsequent tube from the stack for loading.

    Abstract translation: 本发明涉及一种用于将各种尺寸的物品(例如电子包装物料)卸载到诸如管子之类的容器中的装置,存在自动调节装置的尺寸参数的装置,从而将不同尺寸的包装和相同的包装容纳在其中。 该装置还具有用于堆叠用于装载堆叠的底部的多个管的装置,当加载时弹出该管,并且从堆叠提供用于装载的随后的管。

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