-
公开(公告)号:US20040123878A1
公开(公告)日:2004-07-01
申请号:US10698379
申请日:2003-11-03
Applicant: ASM Assembly Automation Ltd.
Inventor: Chi Wah Cheng , Yui Ko Wong , Tim Wai Mak
IPC: B08B003/00
CPC classification number: B08B3/12 , B08B3/123 , H01L21/481 , H01L21/67051
Abstract: The invention provides an apparatus and method for cleaning a plurality of electronic components. A tank is provided for containing a cleaning fluid and an ultrasonic resonator is mounted in communication with the cleaning fluid for charging ultrasonic energy thereto. A support platform positionable over a top surface of the cleaning fluid supports the electronic components such that the electronic components are in contact with said top surface of the cleaning fluid in use. Further, a cleaning fluid supply system is configured to generate a continuous flow of cleaning fluid into the tank for cleaning the electronic components in contact with said top surface of the cleaning fluid.
Abstract translation: 本发明提供一种用于清洁多个电子部件的装置和方法。 提供容器用于容纳清洁液体,并且超声波谐振器被安装成与用于向其提供超声波能量的清洁流体连通。 可在清洁流体的顶表面上定位的支撑平台支撑电子部件,使得电子部件在使用中与清洁流体的所述顶表面接触。 此外,清洁流体供应系统被配置为产生连续的清洁流体流入罐中,用于清洁与清洁流体的所述顶表面接触的电子部件。