公开(公告)号：US20040245319A1

公开(公告)日：2004-12-09

申请号：US10454258

申请日：2003-06-03

Applicant: ASM Assembly Automation Ltd.

Inventor： Chi Wah Cheng ,  Ping Chun Benson Chong ,  Chin Pang Anson Chan

IPC: B23K031/12

CPC classification number: B23K3/0607 ,  B23K2101/42

Abstract: The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obtain positional information of the substrate. Furthermore, a carrier is provided to which the vision system is mountable, such that operation of the vision system is decoupled from movement of the ball pick head. Drivers responsive to said positional information viewed by the vision system are operative to align at least the substrate and the ball pick head for depositing solder balls onto the substrate.

Abstract translation: 本发明提供了一种用于对准衬底的方法和装置。 该装置包括用于在球拾取过程中拾取多个焊球并将其沉积到基板上的球形拾取头，以及适于观察和获得基板的位置信息的视觉系统。 此外，提供了可安装视觉系统的载体，使得视觉系统的操作与球拍头的移动脱离。 响应于由视觉系统观看的所述位置信息的驱动器可操作以至少对准基底和球形拾取头，以将焊球沉积到基底上。