Multi-die semiconductor package structure and method for manufacturing the same
    3.
    发明授权
    Multi-die semiconductor package structure and method for manufacturing the same 有权
    多芯片半导体封装结构及其制造方法

    公开(公告)号:US07875505B2

    公开(公告)日:2011-01-25

    申请号:US11942174

    申请日:2007-11-19

    Inventor: Tsing-Chow Wang

    Abstract: The present invention provides a multi-die semiconductor package structure and a manufacturing method thereof, which includes providing at least two dies and a lead frame including a die pad and a lead wire located at the periphery of the die pad, the die pad has a via hole at the edge thereof, binding a base opposite side of a first die to the die pad; electrically connecting the first die to the lead wire through the via hole; binding a base side of a second die to the die pad, the first and second dies are disposed on the opposite sides of the die pad respectively; electrically connecting the second die to the lead wire; stacking other dies above the first or second die and electrically connecting them to the lead wire; and encapsulating said at least two dies and the lead frame to form a package.

    Abstract translation: 本发明提供一种多芯片半导体封装结构及其制造方法,其包括提供至少两个管芯和引线框架,所述引线框架包括位于所述管芯焊盘周边的管芯焊盘和引线,所述管芯焊盘具有 在其边缘处的通孔,将第一管芯的基部相对侧结合到管芯焊盘; 通过通孔将第一管芯与引线电连接; 将第二管芯的基极侧结合到管芯焊盘,第一和第二管芯分别设置在管芯焊盘的相对侧上; 将所述第二管芯电连接到所述引线; 在第一或第二模具上方堆叠其他模具并将它们电连接到引线; 并且封装所述至少两个管芯和所述引线框架以形成封装。

    Distance measuring apparatus and distance measuring method
    5.
    发明授权
    Distance measuring apparatus and distance measuring method 有权
    距离测量仪和距离测量方法

    公开(公告)号:US07864105B2

    公开(公告)日:2011-01-04

    申请号:US12754999

    申请日:2010-04-06

    Inventor: Koichi Matsumoto

    CPC classification number: G01S13/325 G01S7/35 G01S13/36

    Abstract: Distance measuring apparatus has a rough distance measuring circuit (18) using a time delay circuit and a precise distance measuring circuit (31) for measuring the orientation of the vector of a carrier wave to determine the distance, the sum of which is the final output. The rough distance measuring apparatus (18) has a long measurement span but low precision. The precise distance measuring apparatus (31) has a short measurement span but high precision. The combination provides distance measuring apparatus having a long measurement span and high resolution and capable of implementing precise measurement.

    Abstract translation: 距离测量装置具有使用时间延迟电路的粗略距离测量电路(18)和用于测量载波矢量取向的精确距离测量电路(31),以确定距离,其总和是最终输出 。 粗距离测量装置(18)的测量范围长,精度低。 精确的距离测量装置(31)具有短的测量范围,但是精度高。 该组合提供了具有长的测量范围和高分辨率并且能够实现精确测量的测距装置。

    Bicuspid vascular valve and methods for making and implanting same
    6.
    发明授权
    Bicuspid vascular valve and methods for making and implanting same 有权
    二尖瓣血管瓣及其制造和植入方法

    公开(公告)号:US07862610B2

    公开(公告)日:2011-01-04

    申请号:US11939452

    申请日:2007-11-13

    CPC classification number: A61F2/2412 A61F2/2415 A61F2/2418 A61F2/2475

    Abstract: A vascular valve constructed from a biocompatible material that is designed to be surgically implanted in a patient's blood vessel, such as the right ventricular outflow tract. At the first end of the valve there is an orifice defined by at least two opposing free edges, and which can occupy either a first, closed position or a second, open position. At the second end of the valve there are at least two flexible members attachable to an anterior and a posterior wall of a patient's blood vessel. A length of the orifice between said at least two opposing free edges when the orifice is generally closed is equal to about 1.5 to 2 times the diameter of a patient's blood vessel. Optionally, the two flexible members to a stent or tubular graft. The valved stent or tubular graft can be inserted into a patient's blood vessel or heart.

    Abstract translation: 由生物相容性材料制成的血管瓣膜,其被设计成手术植入病人的血管,例如右心室流出道。 在阀的第一端处具有由至少两个相对的自由边缘限定的孔,并且其可以占据第一闭合位置或第二打开位置。 在阀的第二端处具有至少两个可附接到患者血管的前壁和后壁的柔性构件。 当孔口通常关闭时,所述至少两个相对的自由边缘之间的孔的长度等于患者血管直径的约1.5至2倍。 任选地,两个柔性构件到支架或管状移植物。 瓣膜支架或管状移植物可以插入患者的血管或心脏。

    Baffle device, hot air blower for solder treatment, and nozzle for same
    7.
    发明授权
    Baffle device, hot air blower for solder treatment, and nozzle for same 有权
    挡板装置,用于焊接处理的热风机,以及用于其的喷嘴

    公开(公告)号:US07860378B2

    公开(公告)日:2010-12-28

    申请号:US11814166

    申请日:2005-01-18

    Abstract: In a baffle device 20 fixedly provided in an air passage of a mechanism for blowing out hot air to a solder treatment portion, vanes inclined with a predetermined inclination angle with respect to an air flow are provided substantially radially with a predetermined interval. Also, in a nozzle to be attached to the hot air blower for solder treatment, the baffle device 20 is fixedly provided in an in-nozzle air passage. Moreover, in the hot air blower for solder treatment which blows out hot air to the solder treatment portion, the baffle device 20 is fixedly provided in an in-blower air passage.

    Abstract translation: 在固定设置在用于将热空气吹出到焊接处理部分的机构的空气通道中的挡板装置20中,以预定间隔大致径向地设置相对于空气流以预定倾斜角度倾斜的叶片。 此外,在要连接到用于焊接处理的热风鼓风机的喷嘴中,挡板装置20固定地设置在喷嘴内空气通道中。 此外,在将热空气吹向焊料处理部的焊接处理用热风鼓风机中,挡板装置20固定地设置在鼓风机空气通路内。

    Method for aligning a stent with a stent support
    10.
    发明授权
    Method for aligning a stent with a stent support 有权
    将支架对准支架支架的方法

    公开(公告)号:US07853340B2

    公开(公告)日:2010-12-14

    申请号:US12558059

    申请日:2009-09-11

    Abstract: A method for aligning a stent with a stent support includes the steps of (1) placing a stent support and a stent mounted on the stent support in a vertically position with the stent support's first support element at a lower position and the stent support's second support element at an upper position; (2) obtaining a digital image of the stent support and stent; (3) analyzing the digital image of the stent support and stent to compute the vertical position of the stent's upper end; (4) computing a desired position of the second support element based on the position of the stent's upper end; and (5) using a positioning device to move the second support element to the desired position. The movement of the second support element causes the conical sections of the first and second support elements to engage the respective ends of the stent to center the stent around a core element of the stent support and to secure the stent in a longitudinal direction of the stent support.

    Abstract translation: 用于使支架与支架支架对准的方法包括以下步骤:(1)将支架支架和安装在支架支架上的支架放置在支架支架的第一支撑元件处于较低位置的垂直位置,支架支架的第二支撑件 元素在上位; (2)获得支架支架和支架的数字图像; (3)分析支架支架和支架的数字图像,计算支架上端的垂直位置; (4)基于支架的上端的位置计算第二支撑元件的期望位置; 和(5)使用定位装置将第二支撑元件移动到所需位置。 第二支撑元件的运动导致第一和第二支撑元件的锥形部分接合支架的相应端部,以使支架围绕支架支架的芯元件居中,并将支架固定在支架的纵向方向上 支持。

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