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公开(公告)号：US09281260B2
公开(公告)日：2016-03-08
申请号：US13415556
申请日：2012-03-08
申请人： Martin Standing , Andrew Roberts
发明人： Martin Standing , Andrew Roberts
IPC分类号： H01L21/00 , H01L23/31 , H01L23/538 , H01L23/00 , H01L21/56
CPC分类号： H01L23/5389 , H01L21/568 , H01L21/76877 , H01L23/3135 , H01L23/3185 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/04105 , H01L2224/24227 , H01L2224/2518 , H01L2924/12042 , H01L2924/13055 , H01L2924/1306 , H01L2924/00
摘要： In one embodiment, a method of fabricating a semiconductor package includes forming a first plurality of die openings on a laminate substrate. The laminate substrate has a front side and an opposite back side. A plurality of first dies is placed within the first plurality of die openings. An integrated spacer is formed around each die of the plurality of first dies. The integrated spacer is disposed in gaps between the laminate substrate and an outer sidewall of each die of the plurality of first dies. The integrated spacer holds the die within the laminate substrate by partially extending over a portion of a top surface of each die of the plurality of first dies. Front side contacts are formed over the front side of the laminate substrate.
摘要翻译： 在一个实施例中，制造半导体封装的方法包括在层叠基板上形成第一多个裸片开口。 层叠基板具有前侧和相对的后侧。 多个第一模具被放置在第一多个模具开口内。 在多个第一管芯的每个管芯周围形成一个集成间隔件。 集成间隔件设置在层叠基板与多个第一管芯的每个管芯的外侧壁之间的间隙中。 集成间隔件通过部分延伸在多个第一管芯的每个管芯的顶表面的一部分上而将管芯保持在层压基板内。 前侧触点形成在层叠基板的前侧。
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公开(公告)号：US09207256B2
公开(公告)日：2015-12-08
申请号：US13372970
申请日：2012-02-14
申请人： Christoph Steiner
发明人： Christoph Steiner
CPC分类号： G01P21/00 , G01P15/123
摘要： Representative implementations of devices and techniques provide calibration for a sensor. The calibration includes adapting an output signal of the sensor based on acceleration components at the sensor and a rotational frequency of the sensor.
摘要翻译： 设备和技术的代表性实现为传感器提供校准。 校准包括根据传感器的加速度分量和传感器的转速来调整传感器的输出信号。
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公开(公告)号：US09197061B2
公开(公告)日：2015-11-24
申请号：US12975210
申请日：2010-12-21
申请人： Christian Russ , Wolfgang Soldner , Klaus von Arnim , David Alvarez , Krzysztof Domanski , Gernot Langguth
发明人： Christian Russ , Wolfgang Soldner , Klaus von Arnim , David Alvarez , Krzysztof Domanski , Gernot Langguth
CPC分类号： H02H9/046 , H01L27/0285
摘要： Techniques and architectures corresponding to electrostatic discharge clamping circuits with tracing circuitry are described.
摘要翻译： 描述对应于具有跟踪电路的静电放电钳位电路的技术和架构。
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4.发明授权Analog-to-digital converter and control circuit with a low quiescent current at low load 有权模数转换器和低负载时静态电流低的控制电路公开(公告)号：US09178522B2
公开(公告)日：2015-11-03
申请号：US14476638
申请日：2014-09-03
发明人： Emanuele Bodano , Peter Bogner , Joachim Pichler , Mark Schauer
摘要： A circuit contains a successive approximation register and an adjustable capacitor with a set input for adjusting a capacitance value of the adjustable capacitor. Moreover, it comprises a comparator having an input coupled to a terminal of the adjustable capacitor, and with an at least one output, wherein at least one of the outputs of the comparator is coupled to an input of the successive approximation register. The circuit also includes an analog input which is coupled to a terminal of the adjustable capacitor. The circuit may be set into a first operating state and a second operating state, wherein an output of the circuit is controlled in the first operating state by the successive approximation register and is not controlled in the second operating state by the successive approximation register, but by the comparator.
摘要翻译： 一个电路包含一个逐次逼近寄存器和一个带可调电容器的可调电容器，用于调节可调电容器的电容值。 而且，它包括比较器，其具有耦合到可调电容器的端子的输入端和至少一个输出端，其中比较器的输出中的至少一个耦合到逐次逼近寄存器的输入端。 电路还包括耦合到可调电容器的端子的模拟输入端。 电路可以被设置为第一操作状态和第二操作状态，其中电路的输出由逐次逼近寄存器控制在第一操作状态，并且在逐次逼近寄存器中不被控制在第二操作状态，但是 由比较方。
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公开(公告)号：US09148101B2
公开(公告)日：2015-09-29
申请号：US13752575
申请日：2013-01-29
发明人： Roberto Nonis , Nicola Da Dalt
CPC分类号： H03G1/0005 , H03K3/0315 , H03K3/354 , Y10T307/406
摘要： At least one implementation relates to a method that includes receiving a bias voltage provided by a low-dropout voltage regulator (LDO) error amplifier; supplying a feedback voltage to the LDO error amplifier; supplying a power signal to a load; and providing a control signal to enable or disable the load and enable or disable the LDO error amplifier.
摘要翻译： 至少一个实现涉及一种包括接收由低压差稳压器（LDO）误差放大器提供的偏置电压的方法; 向LDO误差放大器提供反馈电压; 向负载提供电力信号; 并提供控制信号以启用或禁用负载，并使能或禁用LDO误差放大器。
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公开(公告)号：US09136857B2
公开(公告)日：2015-09-15
申请号：US13539658
申请日：2012-07-02
申请人： Peter Bogner , Franz Kuttner
发明人： Peter Bogner , Franz Kuttner
CPC分类号： H03M1/1225 , H03M1/1205
摘要： Representative implementations of devices and techniques provide analog to digital conversion of multiple parallel analog inputs. An input interface is arranged to organize the parallel analog inputs and an analog-to-digital converter (ADC) is arranged to sequentially convert the multiple parallel analog inputs to digital results.
摘要翻译： 器件和技术的代表性实现提供了多个并行模拟输入的模数转换。 布置了输入接口来组织并行模拟输入，并且设置模数转换器（ADC）以将多个并行模拟输入顺序地转换成数字结果。
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7.发明授权公开(公告)号：US09075100B2
公开(公告)日：2015-07-07
申请号：US13906218
申请日：2013-05-30
发明人： Daniela Trombetti
CPC分类号： H04L25/08 , G01R31/317 , H04B3/46 , H04L12/40013 , H04L25/0274
摘要： An exemplary embodiment relates to a method for detecting a failure on a differential bus comprising the steps: detecting a first signal between the bus lines, detecting a second signal between the bus lines, and detecting the failure in case the first signal and the second signal do not show the same absolute value or in case the first signal and the second signal do not show nearly the same absolute value.
摘要翻译： 示例性实施例涉及一种用于检测差分总线上的故障的方法，包括以下步骤：检测总线之间的第一信号，检测总线之间的第二信号，以及在第一信号和第二信号 不显示相同的绝对值，或者在第一个信号和第二个信号不显示几乎相同的绝对值的情况下。
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8.发明授权公开(公告)号：US09012311B2
公开(公告)日：2015-04-21
申请号：US12170470
申请日：2008-07-10
IPC分类号： H01L21/425 , H01L29/167 , H01L21/22 , H01L21/265 , H01L29/06 , H01L29/08 , H01L29/36 , H01L29/66 , H01L29/739 , H01L29/78 , H01L29/861
CPC分类号： H01L29/0623 , H01L21/221 , H01L21/26506 , H01L29/0634 , H01L29/0834 , H01L29/1095 , H01L29/167 , H01L29/36 , H01L29/66348 , H01L29/7395 , H01L29/7397 , H01L29/7802 , H01L29/7811 , H01L29/861 , H01L29/8611
摘要： In a method for producing a semiconductor body, impurities which act as recombination centers in the semiconductor body and form a recombination zone are introduced into the semiconductor body during the process of producing the semiconductor body. In a semiconductor component, comprising a semiconductor body having a front surface and an opposite rear surface, and also a recombination zone formed by impurities between the front and rear surfaces, wherein the impurities act as recombination centers, the surface state density at the front and rear surfaces of the semiconductor body is just as high as the surface state density at a front and rear surface of an identical semiconductor body without a recombination zone.
摘要翻译： 在制造半导体体的方法中，在制造半导体体的过程中，在半导体本体中作为复合中心并形成复合区的杂质被引入半导体本体。 在半导体元件中，包括具有前表面和相对后表面的半导体本体，以及由前表面和后表面之间的杂质形成的复合区，其中杂质作为复合中心，前面的表面状态密度和 半导体本体的后表面与没有复合区的同一半导体主体的前表面和后表面的表面状态密度一样高。
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公开(公告)号：US09001952B2
公开(公告)日：2015-04-07
申请号：US13429815
申请日：2012-03-26
申请人： Anthony Sanders
发明人： Anthony Sanders
CPC分类号： G06F13/4278 , Y02D10/14 , Y02D10/151
摘要： Implementations related to systems, devices, and methods that make use of a master slave arrangement are described. In one implementation, a method of reducing overall power consumption in a master-slave system includes generating a clock signal in a master device having a first power consumption rate, transmitting the clock signal from the master device to a slave device having a second power consumption rate, the first power consumption rate is lower than the second power consumption rate, sampling data receive by the slave device, the data being provided by the master device, generating phase error information of the clock signal in the slave device, transmitting the phase error information from the slave device to the master device, and adjusting the clock signal in response to the phase error information.
摘要翻译： 描述与使用主从设备的系统，设备和方法相关的实现。 在一个实现中，降低主从系统中的总体功耗的方法包括：在具有第一功率消耗率的主设备中产生时钟信号，将时钟信号从主设备传送到具有第二功耗的从设备 速率，第一功耗率低于第二功率消耗率，由从设备接收的采样数据，数据由主设备提供，产生从设备中的时钟信号的相位误差信息，发送相位误差 从从设备到主设备的信息，以及响应于相位误差信息调整时钟信号。
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公开(公告)号：US08993394B2
公开(公告)日：2015-03-31
申请号：US13685684
申请日：2012-11-26
CPC分类号： B81C1/00246 , B81B2201/0271 , B81C2203/0742
摘要： Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a semiconductive layer disposed over a substrate. A trench is disposed in the semiconductive layer, the trench with a first sidewall and an opposite second sidewall. A first insulating material layer is disposed over an upper portion of the first sidewall, and a conductive material disposed within the trench. An air gap is disposed between the conductive material and the semiconductive layer.
摘要翻译： 公开了微机电系统（MEMS）装置及其制造方法。 在一个实施例中，MEMS器件包括设置在衬底上的半导体层。 沟槽设置在半导体层中，沟槽具有第一侧壁和相对的第二侧壁。 第一绝缘材料层设置在第一侧壁的上部之上，并且设置在沟槽内的导电材料。 在导电材料和半导体层之间设置气隙。
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