公开(公告)号：US20110014774A1

公开(公告)日：2011-01-20

申请号：US12760640

申请日：2010-04-15

申请人： HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES ,  MICHAEL KUHNLE

发明人： HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES ,  MICHAEL KUHNLE

IPC分类号： H01L21/50

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.

摘要翻译： 用于临时晶片键合的改进的装置包括临时键合器簇和解粘束簇。 临时粘合剂簇包括执行电子晶片接合工艺的临时粘合剂模块，包括粘合剂层粘合，粘合剂层与剥离层粘合的组合以及UV光可固化粘合剂层与激光吸收剥离层粘合的组合。 脱粘聚集体包括热敏剥离器，机械剥离器和辐射剥离器。

公开(公告)号：US20070296035A1

公开(公告)日：2007-12-27

申请号：US11766531

申请日：2007-06-21

申请人： GREGORY GEORGE ,  ETIENNE HANCOCK ,  ROBERT CAMPBELL

发明人： GREGORY GEORGE ,  ETIENNE HANCOCK ,  ROBERT CAMPBELL

IPC分类号： H01L27/12

CPC分类号： H01L21/67092 ,  H01L21/187

摘要： An apparatus for bonding semiconductor structures includes equipment for positioning a first surface of a first semiconductor structure directly opposite and in contact with a first surface of a second semiconductor structure and equipment for forming a bond interface area between the first surfaces of the first and second semiconductor structures by pressing the first and second semiconductor structures together with a force column configured to apply uniform pressure to the entire bond interface area between the first surfaces.

摘要翻译： 一种用于接合半导体结构的装置包括用于定位与第二半导体结构的第一表面直接相对并接触的第一半导体结构的第一表面的设备和用于在第一和第二半导体的第一表面之间形成接合界面区域的设备 通过将第一和第二半导体结构与被配置为对第一表面之间的整个结合界面区域施加均匀压力的力列一起按压第一和第二半导体结构的结构。

公开(公告)号：US20110010908A1

公开(公告)日：2011-01-20

申请号：US12760973

申请日：2010-04-15

申请人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES

发明人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES

IPC分类号： B23P19/00

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer.

摘要翻译： 用于通过粘合剂层临时粘合的晶片脱粘两个的脱粘器装置包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴 驱动控制。 顶部卡盘组件包括加热器和晶片保持器。 X轴驱动控制器将底部卡盘组件从装载区域水平驱动到顶部卡盘组件下方的过程区域，并从工艺区域向后加载到装载区域。 包括通过粘合剂层结合到器件晶片的载体晶片的晶片对被放置在位于底部卡盘组件处的负载区域处，使得器件晶片的未结合表面与底部组件接触并且由X 驱动到顶部卡盘组件下面的处理区域，并且载体晶片的未结合表面被放置成与顶部卡盘组件接触。 X轴驱动控制器启动X轴托架驱动器沿X轴的水平运动，同时通过加热器将热量施加到载体晶片上，同时通过晶片保持器将托架晶片保持在顶卡盘组件上，从而 使得器件晶片分离并从载体晶片滑离。

公开(公告)号：US20100266373A1

公开(公告)日：2010-10-21

申请号：US12761044

申请日：2010-04-15

申请人： GREGORY GEORGE ,  HALE JOHNSON ,  DENNIS PATRICIO

发明人： GREGORY GEORGE ,  HALE JOHNSON ,  DENNIS PATRICIO

IPC分类号： H01L21/68

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： A device for centering circular wafers includes a support chuck for supporting a circular wafer to be centered upon its top surface, left, right and middle centering linkage rods and a cam plate synchronizing the rectilinear motion of the left, right and middle centering linkage rods. The left centering linkage rod includes a first rotating arm at a first end and rectilinear motion of the left centering linkage rod translates into rotational motion of the first rotating arm. The right centering linkage rod comprises a second rotating arm at a first end, and rectilinear motion of the right centering linkage rod translates into rotational motion of the second rotating arm. The first and second rotating arms are rotatable around an axis perpendicular to the top surface of the support chuck and comprise a curved edge surface configured to roll against the curved edge of the circular wafer. The middle centering linkage rod includes a third alignment arm at a first end. The third alignment arm is placed in contact with the curved edge of the circular wafer and linear motion of the middle centering linkage rod in the Y-direction pushes the third alignment arm and the circular wafer toward or away from the center of the support chuck. The cam plate includes first and second linear cam profiles. The first cam profile provides rectilinear motion for the middle centering linkage rod and the second linear cam profile provides rectilinear motion for the left and right centering linkage rods.

摘要翻译： 用于定心圆形晶片的装置包括支撑卡盘，用于将圆形晶片支撑在其顶部中心定位的中心，左右中心对中连杆和中心对中连杆的直线运动同步的凸轮板。 左对中连杆包括在第一端处的第一旋转臂，并且左对中连杆的直线运动转换成第一旋转臂的旋转运动。 右对中连杆包括在第一端的第二旋转臂，右对中连杆的直线运动转换为第二旋转臂的旋转运动。 第一和第二旋转臂可绕垂直于支撑卡盘的顶表面的轴线旋转，并且包括弯曲的边缘表面，该弯曲边缘表面被配置成相对于圆形晶片的弯曲边缘滚动。 中间定心连杆在第一端包括第三对准臂。 第三对准臂被放置成与圆形晶片的弯曲边缘接触，并且Y中心定中心连杆的线性运动将第三对准臂和圆形晶片推向或远离支撑卡盘的中心。 凸轮板包括第一和第二直线凸轮轮廓。 第一凸轮轮廓为中间定心联动杆提供直线运动，第二直线凸轮轮廓为左右对中连杆提供直线运动。

公开(公告)号：US20090251699A1

公开(公告)日：2009-10-08

申请号：US12416779

申请日：2009-04-01

申请人： GREGORY GEORGE

发明人： GREGORY GEORGE

IPC分类号： G01B11/00

CPC分类号： H01L21/681 ,  H01L21/67092 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus for aligning semiconductor wafers includes equipment for positioning a first surface of a first semiconductor wafer directly opposite to a first surface of a second semiconductor wafer and equipment for aligning a first structure on the first semiconductor wafer with a second structure on the first surface of the second semiconductor wafer. The aligning equipment comprises at least one movable alignment device configured to be moved during alignment and to be inserted between the first surface of the first semiconductor wafer and the first surface of the second semiconductor wafer. The positioning equipment are vibrationally and mechanically isolated from the alignment device motion.

摘要翻译： 用于对准半导体晶片的装置包括用于定位与第二半导体晶片的第一表面直接相对的第一半导体晶片的第一表面的设备和用于将第一半导体晶片上的第一结构与第二半导体晶片的第一表面上的第一结构对准的设备 第二半导体晶片。 对准设备包括至少一个可移动对准装置，其构造成在对准期间移动并且被插入在第一半导体晶片的第一表面和第二半导体晶片的第一表面之间。 定位设备与对准装置的运动振动和机械隔离。

公开(公告)号：US20100122762A1

公开(公告)日：2010-05-20

申请号：US12618846

申请日：2009-11-16

申请人： GREGORY GEORGE

发明人： GREGORY GEORGE

IPC分类号： B32B37/14

CPC分类号： H01L21/67092 ,  H01L21/187 ,  Y10T29/49131

摘要： An improved wafer-to-wafer bonding method includes aligning an upper and a lower wafer and initiating a bond at a single point by applying pressure to a single point of the upper wafer via the flow of pressurized gas through a port terminating at the single point. The bond-front propagates radially across the aligned oppositely oriented wafer surfaces at a set radial velocity rate bringing the two wafer surfaces into full atomic contact by controlling the gas pressure and/or controlling the velocity of the motion of the lower wafer up toward the upper wafer.

摘要翻译： 改进的晶片到晶片接合方法包括：通过将加压气体流通过终止于单个点的端口向上部晶片的单个点施加压力，使上部和下部晶片对准并且在单个点处引发结合 。 键合前端以设定的径向速度径向跨越对准的相对定向的晶片表面传播，从而通过控制气体压力和/或控制下部晶片的运动速度向上移动，使两个晶片表面进入完全原子接触 晶圆。

公开(公告)号：US07612895B2

公开(公告)日：2009-11-03

申请号：US12118100

申请日：2008-05-09

申请人： Markus Gabriel ,  Matthew Stiles

发明人： Markus Gabriel ,  Matthew Stiles

IPC分类号： G01B11/14 ,  H01L21/66

CPC分类号： H01L22/14

摘要： An apparatus and a method for semiconductor wafer bonding provide in-situ and real time monitoring of semiconductor wafer bonding time. Deflection of the wafer edges during the last phase of the direct bonding process indicates the end of the bonding process. The apparatus utilizes a distance sensor to measure the deflection of the wafer edges and the bonding time is measured as the time between applying the force (bonding initiation) and completion of the bonding process. The bonding time is used as a real-time quality control parameter for the wafer bonding process.

摘要翻译： 半导体晶片接合的装置和方法提供半导体晶片接合时间的原位和实时监测。 在直接接合过程的最后阶段期间，晶片边缘的偏转指示结合过程的结束。 该装置利用距离传感器来测量晶片边缘的偏转，并且结合时间被测量为施加力（接合起始）和结合过程完成之间的时间。 接合时间用作晶片接合工艺的实时质量控制参数。

公开(公告)号：US20110198817A1

公开(公告)日：2011-08-18

申请号：US13022215

申请日：2011-02-07

申请人： DANIEL T. HURLEY ,  GREGORY GEORGE

发明人： DANIEL T. HURLEY ,  GREGORY GEORGE

IPC分类号： B23B31/30

CPC分类号： H01L21/67092 ,  B23B31/307 ,  B23Q3/088 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T279/11

摘要： An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.

摘要翻译： 用于承载和保持具有低于100微米厚度的半导体晶片的改进的晶片载体装置包括可移动的晶片卡盘，其具有封闭的真空容器和被配置为支撑晶片的顶表面。 顶表面具有从顶表面延伸到真空储存器的一个或多个通孔，并且晶片通过真空从穿过通孔的真空容器被保持在顶表面上。

公开(公告)号：US07975744B2

公开(公告)日：2011-07-12

申请号：US11334059

申请日：2006-01-18

申请人： Brad Johnson

发明人： Brad Johnson

IPC分类号： B32B37/00

CPC分类号： B32B37/10 ,  B32B37/26 ,  B32B2309/68 ,  B32B2457/14

摘要： A substrate bonding apparatus comprises a platen and a press. The press is movable relative to the platen for pressing at least one substrate stack between the press and platen. In one embodiment, a consumable compliant member is disposed between the press and the platen. In another embodiment, the apparatus further comprises a substrate carrier adapted for holding and carrying more than one substrate stack in and out of the apparatus. A method for bonding substrates is also described.

摘要翻译： 基板接合装置包括压板和压机。 压力机相对于压板可移动，用于在压力机和压板之间按压至少一个衬底叠层。 在一个实施例中，消耗品柔顺构件设置在压力机和压板之间。 在另一个实施例中，该装置还包括一个衬底载体，适用于将多于一个衬底叠层保持并承载在该装置内外。 还描述了接合基板的方法。

公开(公告)号：US20120037307A9

公开(公告)日：2012-02-16

申请号：US12975521

申请日：2010-12-22

申请人： JAMES HERMANOWSKI

发明人： JAMES HERMANOWSKI

IPC分类号： B32B38/10

CPC分类号： H01L21/67745 ,  H01L21/67132 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67748 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2924/30105 ,  Y10T156/1132 ,  Y10T156/15 ,  Y10T156/1944

摘要： An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.

摘要翻译： 用于剥离临时粘合晶片的改进的装置包括剥离器，清洁模块和胶带模块。 在脱粘器中使用真空吸盘来保持脱粘的薄化晶片，并且在清洁和安装到切割带上的后续处理步骤期间保持与变薄的脱粘晶片。 在一个实施例中，剥离的薄化晶片保留在真空卡盘上，并且随着真空卡盘移动到清洁模块中，然后移动到胶带模块。 在另一个实施例中，脱粘的薄化晶片保留在真空卡盘上，并且首先清洁模块在薄的晶片上移动以清洁晶片，然后胶带模块在薄的晶片上移动以将切割带安装到晶片上。