公开(公告)号：US20110198817A1

公开(公告)日：2011-08-18

申请号：US13022215

申请日：2011-02-07

申请人： DANIEL T. HURLEY ,  GREGORY GEORGE

发明人： DANIEL T. HURLEY ,  GREGORY GEORGE

IPC分类号： B23B31/30

CPC分类号： H01L21/67092 ,  B23B31/307 ,  B23Q3/088 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T279/11

摘要： An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.

摘要翻译： 用于承载和保持具有低于100微米厚度的半导体晶片的改进的晶片载体装置包括可移动的晶片卡盘，其具有封闭的真空容器和被配置为支撑晶片的顶表面。 顶表面具有从顶表面延伸到真空储存器的一个或多个通孔，并且晶片通过真空从穿过通孔的真空容器被保持在顶表面上。