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公开(公告)号：US11005448B2
公开(公告)日：2021-05-11
申请号：US16392847
申请日：2019-04-24
发明人： Xiaochuan Wang
摘要： A film bulk acoustic wave resonator includes a first substrate; a first insulating material layer, formed on the first substrate; a first cavity, formed in the first insulating material layer with an opening facing away from the first substrate; and an acoustic-wave resonant plate, including a first electrode, a piezoelectric oscillation plate, and a second electrode stacked on the first insulating material layer. The piezoelectric oscillation plate is disposed between the first electrode and the first electrode. The first electrode includes a first electrode cavity above the first cavity. The second electrode includes a second cavity above the first cavity. At least a portion of a boundary of the piezoelectric oscillation plate is formed by a boundary of the first electrode cavity and a boundary of the second electrode cavity. The boundary of the piezoelectric oscillation plate has an irregular polygonal shape without having two parallel edges.
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公开(公告)号：US09933356B2
公开(公告)日：2018-04-03
申请号：US14722582
申请日：2015-05-27
发明人： Jianhong Mao , Fengqin Han , Shan Huang
IPC分类号： G01N21/17 , G01N33/487 , G01D5/34 , G01N21/59 , G01N21/03
CPC分类号： G01N21/17 , G01D5/34 , G01N21/03 , G01N21/59 , G01N33/487 , G01N2021/0346
摘要： An apparatus for detecting macromolecules in a biological fluid is discloses which includes a first substrate and a second substrate. The first substrate includes a plurality of sampling apertures, at least some of which have different diameters. The sampling apertures are configured to screen and isolate the macromolecules in the biological fluid. The second substrate is stacked with the first substrate and includes a plurality of detectors vertically corresponding in position to the sampling apertures. Each of the detectors is configured to detect whether one of the macromolecules is present in a corresponding one of the sampling apertures and produce a detection output signal. A method for detecting macromolecules in a biological fluid is also disclosed. The apparatus has high integration and simple manufacturability, while the method is easy to use.
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公开(公告)号：US10468325B2
公开(公告)日：2019-11-05
申请号：US15949295
申请日：2018-04-10
发明人： Xiaochuan Wang
IPC分类号： H01L23/367 , H01L27/12 , H01L21/48 , H01L21/84 , H01L23/66 , H01L23/373
摘要： A radio frequency integrated circuit (RFIC) device and methods for fabricating same are disclosed. The RFIC device includes: a first semiconductor layer having a first surface, a second surface parallel to the first surface and a thickness of smaller than 3 μm; a first dielectric layer on the first surface of the first semiconductor layer; a semiconductor component within the first semiconductor layer and the first dielectric layer; a second dielectric layer on the second surface of the first semiconductor layer, the second dielectric layer having a thickness of smaller than 1 μm; and a sheet-like heat sink formed on a surface of the first dielectric layer opposite to the first semiconductor layer for dissipating heat from the semiconductor component. Efficient dissipation of heat from an RF transistor to a certain extent can be achieved by the RFIC device.
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公开(公告)号：US09772489B2
公开(公告)日：2017-09-26
申请号：US14215076
申请日：2014-03-17
发明人： Jianhong Mao , Deming Tang
CPC分类号： G02B26/0841 , B81B2201/047 , B81C1/00246 , H01L33/10
摘要： A display device having a MEMS transmissive light valve and a method for forming the same are provided. The method includes: providing a multilayer semiconductor substrate comprising a bottom semiconductor layer, a middle buried layer and a top semiconductor layer; forming a light guide opening in the top semiconductor layer; forming at least one MOS device in a remaining part of the top semiconductor layer; forming an interconnection layer and an interlayer dielectric layer on the at least one MOS; forming a MEMS transmissive light valve, which is electrically connected to the interconnection layer, on the light guide opening, where the MEMS transmissive light valve is surrounded by the interlayer dielectric layer; forming a transparent backplane on a top surface of the interlayer dielectric layer; and removing the bottom semiconductor layer.
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公开(公告)号：US10018725B2
公开(公告)日：2018-07-10
申请号：US15070408
申请日：2016-03-15
发明人： Ruilong Liu
CPC分类号： G01S17/89 , G01S7/4812 , G01S7/4815 , G01S7/499 , G01S17/325 , G01S17/58
摘要： A LIDAR imaging system (90) includes: an illumination source block (100) having at least one illumination source (110) for emitting at least one polarized illumination beam (20) of first polarization with wavelengths in a first wave length range (21); an optical engine core (200) having a first polarized beam splitter panel (210); a quarter wave retarder panel (230) configured between the external image object (900) and the optical engine core (200); and a first imaging block (300) having a plurality of first illumination detectors (310). The imaging system is more compact and ensures optical alignment between the radiation sources and the detectors. Moreover, the polarized illumination beams and the retarded reflection beams do not interfere with each other though transiting along the same axis, thus improving the imaging quality of the imaging system.
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6.发明授权公开(公告)号：US09570429B2
公开(公告)日：2017-02-14
申请号：US14694868
申请日：2015-04-23
发明人： Jianhong Mao , Fengqin Han , Zhiwei Wang , Wenfen Chang
CPC分类号： H01L25/50 , H01L21/561 , H01L21/565 , H01L21/568 , H01L22/14 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L2224/0392 , H01L2224/0401 , H01L2224/0557 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/16147 , H01L2224/2919 , H01L2224/32145 , H01L2224/73204 , H01L2224/81002 , H01L2224/811 , H01L2224/83121 , H01L2224/83855 , H01L2224/83862 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/92 , H01L2224/92143 , H01L2224/94 , H01L2224/96 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/00012 , H01L2924/01015 , H01L2924/01005 , H01L2224/81 , H01L2224/83 , H01L2224/03 , H01L21/56 , H01L21/78 , H01L21/304
摘要： The present invention provides a method of fabricating a 3D stacked IC SiP which includes: providing a first semiconductor wafer having a plurality of first dies formed thereon, each having a first wire bond pad and a first dielectric layer, at least a portion of the first wire bond pad is not covered by the first dielectric layer and constitutes an exposed area of the first die; providing a plurality of second dies, each having a second wire bond pad and a second dielectric layer, at least a portion of the second wire bond pad is not covered by the second dielectric layer and constitutes an exposed area of the second die different in size from that of the first die; aligning the second dies with the first dies and bonding the second dielectric layer to the first dielectric layer; plating the first semiconductor wafer bonded with the second dies.
摘要翻译： 本发明提供了一种制造3D堆叠IC SiP的方法，其包括：提供第一半导体晶片，其具有形成在其上的多个第一裸片，每个具有第一引线键合焊盘和第一介电层，第一半导体晶片的至少一部分 引线接合焊盘不被第一介电层覆盖并构成第一裸片的暴露区域; 提供多个第二管芯，每个第二管芯具有第二引线接合焊盘和第二介电层，第二引线接合焊盘的至少一部分不被第二介电层覆盖，并且构成尺寸不同的第二裸片的暴露区域 从第一个死亡的; 将所述第二管芯与所述第一管芯对准并且将所述第二介电层接合到所述第一介电层; 电镀与第二模具结合的第一半导体晶片。
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公开(公告)号：US10153315B2
公开(公告)日：2018-12-11
申请号：US15136223
申请日：2016-04-22
发明人： Jianhong Mao , Cheng Xu
IPC分类号： H01L27/146
摘要： A photosensitive imaging apparatus and a method of forming such an apparatus are disclosed. The apparatus includes: a first semiconductor substrate, including a photosensitive semiconductor layer including an array of photodetectors; and a second semiconductor substrate, stacked with the first semiconductor substrate and including a pixel-circuitry semiconductor layer including an array of in-pixel amplifier circuitries. Each in-pixel amplifier circuitry includes at least one first pixel MOS transistor. Each first pixel MOS transistor has an active region disposed between the gate layer thereof and the first semiconductor substrate. The photosensitive imaging apparatus allows an effective reduction in noises produced during light reception of the in-pixel amplifier circuitries and an increased light utilization of the photodetectors. In addition, by separating the pixel-circuitry semiconductor layer from the photosensitive semiconductor layer, the apparatus achieves better process compatibility and is conducive to separate design and process optimization of the in-pixel amplifier circuitries and the photodetectors.
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8.发明授权公开(公告)号：US09491340B2
公开(公告)日：2016-11-08
申请号：US14086493
申请日：2013-11-21
发明人： Jianhong Mao , Fengqin Han , Deming Tang , Lei Zhang
CPC分类号： H04N5/2254 , B81B7/02 , G02B5/005 , G03B9/02 , H04N5/2253 , H04N5/2353
摘要： A micro-electro-mechanical system based device for adjusting aperture and a manufacturing method thereof are disclosed. The system includes: an opaque deformable aperture ring, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable aperture ring and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable aperture ring, and their external edges are connected with the fixed parts. The conductive structs are connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable aperture ring to be stretched and rotate, so that area of an inner bore of the deformable aperture ring is changed.
摘要翻译： 公开了一种用于调节孔径的基于微机电系统的装置及其制造方法。 该系统包括：不透明的可变形孔环，多组导电可变形横梁和导电结构; 和一个或多个固定部件。 在每组中，每个导电可变形横梁对应于导电结构。 导电可变形横梁和导电结构体布置在可变形孔环周围并彼此间隔开。 导电可变形横梁悬挂在空气中，它们的内边缘与可变形孔环的外边缘连接，其外边缘与固定部分连接。 导电结构与固定部分连接并保持静止。 导电可变形横梁与导电结构之间的静电力使得可变形的孔环被拉伸和旋转，使得可变形孔环的内孔的面积改变。
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